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    • 6. 发明授权
    • Method of retaining a substrate during a substrate transferring process
    • 在衬底转移过程中保持衬底的方法
    • US07374393B2
    • 2008-05-20
    • US11398218
    • 2006-04-05
    • Mike RiceJeffrey HudgensCharles CarlsonWilliam Tyler WeaverRobert LowranceEric EnglhardtDean C. HruzekMario David SilvettiMichael KucharKirk Van KatwykVan HoskinsVinay Shah
    • Mike RiceJeffrey HudgensCharles CarlsonWilliam Tyler WeaverRobert LowranceEric EnglhardtDean C. HruzekMario David SilvettiMichael KucharKirk Van KatwykVan HoskinsVinay Shah
    • B65G61/00
    • H01L21/67178H01L21/67173H01L21/67276H01L21/67742H01L21/67745H01L21/67748H01L21/68707
    • A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.
    • 一种使用多室处理系统或集群工具处理衬底的方法和设备,其具有增加的系统吞吐量,增加的系统可靠性,改进的器件产量性能,更可重复的晶片处理历史(或晶片历史)以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人,以在保留在处理机架中的各种处理室之间传送衬底,使得可以在衬底上执行期望的处理顺序。 在一个方面,并行处理配置包括两个或更多个机器人组件,其适于在垂直和水平方向上移动,以访问保持在通常相邻定位的处理机架中的各种处理室。 通常,这里描述的各种实施例是有利的,因为每行或一组衬底处理室由两个或更多个机器人来维护,以允许增加的生产量和增加的系统可靠性。 此外,本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒,以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室,处理机架和处理机器人的数量。