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    • 2. 发明授权
    • Solvent systems for polymeric dielectric materials
    • 高分子电介质材料溶剂体系
    • US06413202B1
    • 2002-07-02
    • US09340976
    • 1999-06-28
    • Oana M. LeonteTadashi NakanoKelly M. BeresKreisler Lau
    • Oana M. LeonteTadashi NakanoKelly M. BeresKreisler Lau
    • C08G7902
    • H01L21/02118C08J3/095H01L21/02126H01L21/02216H01L21/02222H01L21/02282H01L21/312Y10T428/31504
    • Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    • 已经发现芳族脂族醚溶剂如苯甲醚,甲基苯甲醚和苯乙醚可用于配制聚合物电介质材料的涂料溶液和作为涂布过程中的清洁溶剂。 在衬底上形成电介质膜的方法包括将介电材料的涂布溶液在配方溶剂中沉积到衬底的表面上,并将芳族脂族醚溶剂沉积在衬底表面的边缘部分上。 该方法用于形成包括亚芳基醚介电聚合物,氢化硅氧烷树脂,有机氢硅氧烷树脂,旋涂玻璃材料,固化以形成纳米多孔介电二氧化硅材料的部分水解和部分缩合的烷氧基硅烷组合物的介电材料的膜,以及聚( perhydrido)硅氮烷。