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1. 发明授权

US09842812B2 Self-destructing chip 有权
公开(公告)号：US09842812B2
公开(公告)日：2017-12-12
申请号：US14660726
申请日：2015-03-17
申请人： Honeywell International Inc. , Cornell University
发明人： Steven Tin , Jeffrey James Kriz , Steven J. Eickhoff , Jeff A. Ridley , Amit Lal , Christopher Ober , Serhan Ardanuc , Ved Gund , Alex Ruyack , Katherine Camera
IPC分类号： H01L23/00 , H01M8/2475 , B29C35/02 , B81B7/00 , B81C1/00 , C23C16/26 , C23C16/44 , H01L21/02 , H01L21/268 , H01L21/306 , H01L21/311 , H01L21/768 , H01L25/16 , H01L23/58 , B29L31/34
CPC分类号： H01L23/564 , B29C35/02 , B29L2031/34 , B81B7/0077 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00333 , B81C2201/013 , C23C16/26 , C23C16/44 , H01L21/02118 , H01L21/268 , H01L21/30604 , H01L21/31133 , H01L21/76837 , H01L21/76877 , H01L21/76898 , H01L23/57 , H01L23/573 , H01L23/576 , H01L23/58 , H01L25/16 , H01L2223/6677 , H01L2924/0002 , H01L2924/14 , H01M8/2475 , H01L2924/00
摘要： Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.

2. 发明申请

US20170025365A1 SELF-DESTRUCTING CHIP 有权
标题翻译：自毁芯片
公开(公告)号：US20170025365A1
公开(公告)日：2017-01-26
申请号：US14660726
申请日：2015-03-17
申请人： Honeywell International Inc. , Cornell University
发明人： Steven Tin , Jeffrey James Kriz , Steven J. Eickhoff , Jeff A. Ridley , Amit Lal , Christopher Ober , Serhan Ardanuc , Ved Gund , Alex Ruyack , Katherine Camera
IPC分类号： H01L23/00 , C23C16/26 , C23C16/44 , H01L25/16 , B81C1/00 , H01L21/306 , H01L21/268 , H01L21/02 , H01L21/311 , H01L21/768 , B29C35/02 , B81B7/00
CPC分类号： H01L23/564 , B29C35/02 , B29L2031/34 , B81B7/0077 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00333 , B81C2201/013 , C23C16/26 , C23C16/44 , H01L21/02118 , H01L21/268 , H01L21/30604 , H01L21/31133 , H01L21/76837 , H01L21/76877 , H01L21/76898 , H01L23/57 , H01L23/573 , H01L23/576 , H01L23/58 , H01L25/16 , H01L2223/6677 , H01L2924/0002 , H01L2924/14 , H01M8/2475 , H01L2924/00
摘要： Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.
摘要翻译：本文的实施例提供了包括至少第一模具和第二模具的自毁芯片。第一模具包括电子电路，第二模具由在第一温度下分解的一种或多种聚合物组成。第二模具限定多个室，其中室的第一子集含有以放热方式与氧反应的材料。腔室的第二子集含有蚀刻剂以蚀刻第一管芯的材料。响应于触发事件，电子电路被配置为将室的第一子集中的材料暴露于氧气，以便将第二管芯加热至少第一温度，并且被配置为将蚀刻剂从第二子集这些腔室蚀刻第一个模具。

3. 发明申请

US20180135770A1 APPARATUS AND METHODS FOR THERMALLY ACTIVATED MICRO-VALVE 审中-公开
公开(公告)号：US20180135770A1
公开(公告)日：2018-05-17
申请号：US15349376
申请日：2016-11-11
申请人： Honeywell International Inc.
发明人： Steven Tin , Jeff A. Ridley , Jong Park
IPC分类号： F16K31/00 , F16K99/00 , B23P15/00
CPC分类号： B23P15/001 , B01L3/502738 , B01L2200/12 , B01L2300/1827 , B01L2400/0677 , F16K99/003 , F16K99/0044 , F16K2099/0084
摘要： In one embodiment, an apparatus is provided. The apparatus comprises a bilayer; and wherein the bilayer is configured to cover at least one opening in at least one chamber and irreparably opens upon reaching a threshold temperature.

4. 发明授权

US09417261B2 Atomic referenced optical accelerometer 有权
标题翻译：原子参考光学加速度计
公开(公告)号：US09417261B2
公开(公告)日：2016-08-16
申请号：US14162697
申请日：2014-01-23
申请人： Honeywell International Inc.
发明人： Kenneth Salit , Mary Salit , Robert Compton , Jeff A. Ridley , Karl Nelson
IPC分类号： G01P15/093 , B81B7/02 , G01P15/12 , G01P1/00 , G01P15/13
CPC分类号： G01P15/093 , B81B7/02 , G01P1/006 , G01P15/08 , G01P15/12 , G01P15/131
摘要： In some examples, a micro-electro-mechanical system (MEMS) optical accelerometer includes a housing comprising an internal chamber that includes a Fabry-Perot cavity and a proof mass affixed to the housing via one or more elastic elements, a light source configured to emit radiation, a first detector configured to receive radiation transmitted through the Fabry-Perot cavity and configured to generate one or more signals that indicate a position of the proof mass. The MEMS optical accelerometer further comprises an atomic wavelength reference and a second detector configured to detect radiation transmitted through the atomic wavelength reference and configured to generate one or more signals that indicate a wavelength of the radiation emitted by the light source, and a servomechanism electrically coupled to the second photo detector and the light source, configured to adjust the light source to maintain the radiation emitted by the light source at approximately a selected wavelength.
摘要翻译：在一些示例中，微电子机械系统（MEMS）光学加速度计包括壳体，该壳体包括内部腔室，该内部腔室包括法布里 - 珀罗空腔和经由一个或多个弹性元件固定到壳体的校验物质，发射辐射，第一检测器被配置为接收透射通过法布里 - 珀罗腔的辐射并被配置为产生指示证明质量位置的一个或多个信号。 MEMS光学加速度计还包括原子波长参考和第二检测器，其被配置为检测透射原子波长参考的辐射并被配置为产生指示由光源发射的辐射的波长的一个或多个信号，以及电耦合的伺服机构所述第二光检测器和所述光源被配置为调节所述光源以将由所述光源发射的辐射保持在大致选定的波长。

5. 发明授权

US09164491B2 Vapor cell atomic clock physics package 有权
标题翻译：蒸汽电池原子钟物理包
公开(公告)号：US09164491B2
公开(公告)日：2015-10-20
申请号：US14083067
申请日：2013-11-18
申请人： Honeywell International Inc.
发明人： Jeff A. Ridley , Robert Compton , Mary K. Salit , Jeffrey James Kriz
IPC分类号： G04F5/14
CPC分类号： G04F5/14 , G04F5/145 , Y10T29/49117
摘要： In an example, a chip-scale atomic clock physics package is provided. The physics package includes a body defining a cavity having a base surface and one or more side walls. The cavity includes a first step surface and a second step surface defined in the one or more side walls. A first scaffold mounted to the base surface in the cavity. One or more spacers defining an aperture therethrough are mounted to the second step surface in the cavity. A second scaffold is mounted to a first surface of the one or more spacers spans across the aperture of the one or more spacers. A third scaffold is mounted to a second surface of the one or more spacers in the cavity and spans across the aperture of the one or more spacers. Other components of the physics package are mounted to the first, second, and third scaffold.
摘要翻译：在一个示例中，提供了芯片级原子钟物理包。物理包装件包括限定具有基面和一个或多个侧壁的空腔的主体。空腔包括限定在一个或多个侧壁中的第一台阶表面和第二台阶表面。安装在空腔中的基面的第一脚手架。限定穿过其中的孔的一个或多个间隔件安装到空腔中的第二台阶表面。第二个支架安装在穿过一个或多个间隔物的孔的一个或多个间隔物的第一表面上。第三支架安装到空腔中的一个或多个隔离物的第二表面，跨越一个或多个隔离物的孔。物理包装的其他部件安装在第一，第二和第三支架上。

6. 发明申请

US20140014826A1 FOLDED OPTICS FOR BATCH FABRICATED ATOMIC SENSOR 有权
标题翻译：用于批量制造原子传感器的折叠光学
公开(公告)号：US20140014826A1
公开(公告)日：2014-01-16
申请号：US13663057
申请日：2012-10-29
申请人： HONEYWELL INTERNATIONAL INC.
发明人： Robert Compton , Robert D. Horning , Jeff A. Ridley
IPC分类号： G01N21/84 , B23P11/00
CPC分类号： G21K1/006 , G01C19/58 , G01P15/08 , G04F5/14 , Y10T29/49826
摘要： System and methods for a vacuum cell apparatus for an atomic sensor are provided. In at least one embodiment, the apparatus comprises a cell wall encircling an enclosed volume, the cell wall having a first open end and a second open end opposite from the first open end and a first panel over the first open end of the cell wall and having a first surface, the first surface facing the enclosed volume and having a first set of diffractive optics therein. Further, the apparatus comprises a second panel over the second open end of the cell wall and having a second surface, the second surface facing the enclosed volume and having a second set of diffractive optics therein; wherein the first set of diffractive optics and the second of diffractive optics are configured to reflect at least one optical beam within the enclosed volume along a predetermined optical path.
摘要翻译：提供了一种用于原子传感器的真空电池装置的系统和方法。在至少一个实施例中，该装置包括围绕封闭容积的细胞壁，细胞壁具有第一开放端和与第一开放端相对的第二开口端和在细胞壁的第一开口端上的第一面板，具有第一表面，所述第一表面面向所述封闭容积并且在其中具有第一组衍射光学元件。此外，该装置包括在细胞壁的第二开口端上的第二面板，并具有第二表面，第二表面面向封闭容积并且在其中具有第二组衍射光学元件; 其中所述第一组衍射光学器件和所述第二衍射光学器件被配置为沿着预定光学路径反射所述封闭容积内的至少一个光束。

7. 发明申请

US20130052405A1 FABRICATION TECHNIQUES TO ENHANCE PRESSURE UNIFORMITY IN ANODICALLY BONDED VAPOR CELLS 有权
标题翻译：制造技术提高阳极粘结蒸汽电池的压力均匀性
公开(公告)号：US20130052405A1
公开(公告)日：2013-02-28
申请号：US13662850
申请日：2012-10-29
申请人： Honeywell International Inc.
发明人： Daniel W. Youngner , Jeff A. Ridley , Son T. Lu
IPC分类号： B32B3/12 , B23K11/00
CPC分类号： G04F5/14 , Y10T428/24149
摘要： A method of fabricating one or more vapor cells comprises forming one or more vapor cell dies in a first wafer having a first diameter, and anodically bonding a second wafer to a first side of the first wafer over the vapor cell dies, the second wafer having a second diameter. A third wafer is positioned over the vapor cell dies on a second side of the first wafer opposite from the second wafer, with the third wafer having a third diameter. A sacrificial wafer is placed over the third wafer, with the sacrificial wafer having a diameter that is larger than the first, second and third diameters. A metallized bond plate is located over the sacrificial wafer. The third wafer is anodically bonded to the second side of the first wafer when a voltage is applied to the metallized bond plate while the sacrificial wafer is in place.
摘要翻译：一种制造一个或多个蒸汽池的方法包括在具有第一直径的第一晶片中形成一个或多个蒸汽池模具，并且将第二晶片阳极结合到第一晶片的第一侧上，在第二晶圆上方，第二直径。第三晶片位于第一晶片与第二晶片相对的第二侧上的蒸汽单元上，第三晶片具有第三直径。牺牲晶片放置在第三晶片上，牺牲晶片的直径大于第一，第二和第三直径。金属化接合板位于牺牲晶片上方。当牺牲晶片就位时，将第三晶片阳极接合到第一晶片的第二侧，当电压施加到金属化接合板时。

8. 发明申请

US20170092598A1 SELF-DESTRUCTING ELECTRONIC DEVICE 有权
公开(公告)号：US20170092598A1
公开(公告)日：2017-03-30
申请号：US14869367
申请日：2015-09-29
申请人： Honeywell International Inc.
发明人： Jeff A. Ridley , Steven Tin , Jeffrey James Kriz
IPC分类号： H01L23/00
CPC分类号： H01L23/573
摘要： A self destructing device includes: at least one active electronic region and at least one thermal destruction trigger; at least one chamber enclosed by the semiconducting material, wherein the at least one chamber contains an etchant material, wherein in response to activation of the at least one thermal destruction trigger, the self-destructing device is configured to: generate heat to cause decomposition of at least a first portion of the etchant material; decompose at least a first portion of the etchant material; etch at least a second portion of the second oxide layer provided between the semiconducting material and the at least one chamber at a first temperature; expose the etchant material to the semiconducting material to cause an exothermic reaction generating more heat; enable spread of the exothermic reaction to etch at least a third portion of the first oxide layer and to etch the top layer.

9. 发明申请

US20160306119A1 OPTICAL BENCH 有权
标题翻译：光学底板
公开(公告)号：US20160306119A1
公开(公告)日：2016-10-20
申请号：US14686501
申请日：2015-04-14
申请人： Honeywell International Inc.
发明人： Thomas Ohnstein , Daniel Youngner , Mary Salit , Jeff A. Ridley
IPC分类号： G02B6/36 , G02B6/32
CPC分类号： G02B6/3652 , G02B6/32 , G02B6/3616 , G02B6/3636 , G02B6/3664 , G02B6/3692
摘要： Methods, apparatuses, and systems for design, fabrication, and use of an optical bench, as well as alignment and attachment of optical fibers are described herein. One apparatus includes an apparatus body, a first channel within the apparatus body for positioning of a first optical fiber directed along a first axis and a second channel within the apparatus body for positioning of a second optical fiber directed along a second axis, wherein the first axis is orthogonal to the second axis. The apparatus also includes a third optical fiber directed along the second axis and an optical element positioned along the first channel and second channel to focus a first light beam from the first optical fiber along the first axis and focus a second light beam from the second optical fiber along the second axis.
摘要翻译：本文描述了用于设计，制造和使用光学平台的方法，装置和系统，以及光纤的对准和附接。一种装置包括装置主体，装置本体内的用于定位沿着第一轴线定向的第一光纤的第一通道和装置主体内的第二通道，用于定位沿着第二轴线定向的第二光纤，其中第一轴与第二轴正交。该装置还包括沿着第二轴线定向的第三光纤和沿着第一通道和第二通道定位的光学元件，以沿着第一轴线聚焦来自第一光纤的第一光束并且聚焦来自第二光学器件的第二光束纤维沿第二轴。

10. 发明申请

US20140062608A1 VAPOR CELL ATOMIC CLOCK PHYSICS PACKAGE 有权
标题翻译：蒸汽细胞原子钟物理包装
公开(公告)号：US20140062608A1
公开(公告)日：2014-03-06
申请号：US14083067
申请日：2013-11-18
申请人： Honeywell International Inc.
发明人： Jeff A. Ridley , Robert Compton , Mary K. Salit , Jeffrey James Kriz
IPC分类号： G04F5/14
CPC分类号： G04F5/14 , G04F5/145 , Y10T29/49117
摘要： In an example, a chip-scale atomic clock physics package is provided. The physics package includes a body defining a cavity having a base surface and one or more side walls. The cavity includes a first step surface and a second step surface defined in the one or more side walls. A first scaffold mounted to the base surface in the cavity. One or more spacers defining an aperture therethrough are mounted to the second step surface in the cavity. A second scaffold is mounted to a first surface of the one or more spacers spans across the aperture of the one or more spacers. A third scaffold is mounted to a second surface of the one or more spacers in the cavity and spans across the aperture of the one or more spacers. Other components of the physics package are mounted to the first, second, and third scaffold.
摘要翻译：在一个示例中，提供了芯片级原子钟物理包。物理包装件包括限定具有基面和一个或多个侧壁的空腔的主体。空腔包括限定在一个或多个侧壁中的第一台阶表面和第二台阶表面。安装在空腔中的基面的第一脚手架。限定穿过其中的孔的一个或多个间隔件安装到空腔中的第二台阶表面。第二个支架安装在穿过一个或多个间隔物的孔的一个或多个间隔物的第一表面上。第三支架安装到空腔中的一个或多个隔离物的第二表面，跨越一个或多个隔离物的孔。物理包装的其他部件安装在第一，第二和第三支架上。

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