会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Semiconductor device having a high aspect cylindrical capacitor and method for fabricating the same
    • 具有高方位圆柱形电容器的半导体器件及其制造方法
    • US07985645B2
    • 2011-07-26
    • US12649610
    • 2009-12-30
    • Cheol Hwan ParkHo Jin ChoDong Kyun Lee
    • Cheol Hwan ParkHo Jin ChoDong Kyun Lee
    • H01L21/8242
    • H01L28/91H01L27/10817H01L27/10852H01L27/10894
    • A semiconductor device having a high aspect cylindrical capacitor and a method for fabricating the same is presented. The high aspect cylindrical type capacitor is a stable structure which is not prone to causing bunker defects and losses in a guard ring. The semiconductor device includes the cylindrical type capacitor structure, a storage node oxide, a guard ring hole, a conductive layer, and a capping oxide. The cylindrical type capacitor structure in a cell region includes a cylindrical type lower electrode, a dielectric and an upper electrode. The storage node oxide is in a peripheral region over the semiconductor substrate. The conductive layer coating the guard ring hole. The guard ring hole at a boundary of the peripheral region that adjoins the cell region over the semiconductor substrate. The capping oxide partially fills in a part of the conductive layer. The gapfill film filling in the rest of the conductive layer.
    • 提出了具有高方位圆柱形电容器的半导体器件及其制造方法。 高档圆柱型电容器是一种稳定的结构,不容易造成保护环中的掩体缺陷和损失。 半导体器件包括圆柱形电容器结构,存储节点氧化物,保护环孔,导电层和封盖氧化物。 单元区域中的圆柱型电容器结构包括圆筒形下电极,电介质和上电极。 存储节点氧化物位于半导体衬底上的周边区域中。 导电层涂覆保护环孔。 在与半导体基板上的单元区域相邻的周边区域的边界处的保护环孔。 覆盖氧化物部分地填充导电层的一部分。 间隙填充膜填充在导电层的其余部分。
    • 3. 发明授权
    • Semiconductor device having a high aspect cylindrical capacitor and method for fabricating the same
    • 具有高方位圆柱形电容器的半导体器件及其制造方法
    • US08148764B2
    • 2012-04-03
    • US13185873
    • 2011-07-19
    • Cheol Hwan ParkHo Jin ChoDong Kyun Lee
    • Cheol Hwan ParkHo Jin ChoDong Kyun Lee
    • H01L27/108H01L29/76H01L29/94H01L31/119
    • H01L28/91H01L27/10817H01L27/10852H01L27/10894
    • A semiconductor device having a high aspect cylindrical capacitor and a method for fabricating the same is presented. The high aspect cylindrical type capacitor is a stable structure which is not prone to causing bunker defects and losses in a guard ring. The semiconductor device includes the cylindrical type capacitor structure, a storage node oxide, a guard ring hole, a conducive layer, and a capping oxide. The cylindrical type capacitor structure in a cell region includes a cylindrical type lower electrode, a dielectric and an upper electrode. The storage node oxide is in a peripheral region over the semiconductor substrate. The conductive layer coating the guard ring hole. The guard ring hole at a boundary of the peripheral region that adjoins the cell region over the semiconductor substrate. The capping oxide partially fills in a part of the conductive layer. The gapfill film filling in the rest of the conductive layer.
    • 提出了具有高方位圆柱形电容器的半导体器件及其制造方法。 高档圆柱型电容器是一种稳定的结构,不容易造成保护环中的掩体缺陷和损失。 半导体器件包括圆柱形电容器结构,存储节点氧化物,保护环孔,导电层和封盖氧化物。 单元区域中的圆柱型电容器结构包括圆筒形下电极,电介质和上电极。 存储节点氧化物位于半导体衬底上的周边区域中。 导电层涂覆保护环孔。 在与半导体基板上的单元区域相邻的周边区域的边界处的保护环孔。 覆盖氧化物部分地填充导电层的一部分。 间隙填充膜填充在导电层的其余部分。
    • 4. 发明授权
    • Capacitor having tapered cylindrical storage node and method for manufacturing the same
    • 具有锥形圆柱形存储节点的电容器及其制造方法
    • US07723183B2
    • 2010-05-25
    • US12499248
    • 2009-07-08
    • Ho Jin ChoCheol Hwan ParkJae Soo KimDong Kyun Lee
    • Ho Jin ChoCheol Hwan ParkJae Soo KimDong Kyun Lee
    • H01L21/02
    • H01L28/65H01L27/10852H01L28/91
    • A capacitor is made by forming a buffer oxide layer, an etching stop layer, and a mold insulation layer over a semiconductor substrate having a storage node contact plug. The mold insulation layer and the etching stop layer are etched to form a hole in an upper portion of the storage node contact plug. A tapering layer is deposited over the mold insulation layer including the hole. The tapering layer and the buffer oxide layer are etched back so that the tapering layer is remained only at the upper end portion of the etched hole. A metal storage node layer formed on the etched hole over the remaining tapering layer. The mold insulation layer and the remaining tapering layer are removed to form a cylindrical storage node having a tapered upper end. A dielectric layer and a plate node are formed over the storage node.
    • 通过在具有存储节点接触插塞的半导体衬底上形成缓冲氧化物层,蚀刻停止层和模具绝缘层来制造电容器。 蚀刻模具绝缘层和蚀刻停止层,以在存储节点接触插塞的上部形成孔。 在包括孔的模具绝缘层上沉积渐缩层。 锥形层和缓冲氧化物层被回蚀刻,使得锥形层仅保留在蚀刻孔的上端部。 在剩余的锥形层上形成在蚀刻孔上的金属储存节点层。 去除模具绝缘层和剩余的锥形层以形成具有锥形上端的圆柱形存储节点。 在存储节点上形成介电层和板状节点。
    • 6. 发明授权
    • Capacitor having tapered cylindrical storage node and method for manufacturing the same
    • 具有锥形圆柱形存储节点的电容器及其制造方法
    • US07576383B2
    • 2009-08-18
    • US11779093
    • 2007-07-17
    • Ho Jin ChoCheol Hwan ParkJae Soo KimDong Kyun Lee
    • Ho Jin ChoCheol Hwan ParkJae Soo KimDong Kyun Lee
    • H01L27/108
    • H01L28/65H01L27/10852H01L28/91
    • A capacitor is made by forming a buffer oxide layer, an etching stop layer, and a mold insulation layer over a semiconductor substrate having a storage node contact plug. The mold insulation layer and the etching stop layer are etched to form a hole in an upper portion of the storage node contact plug. A tapering layer is deposited over the mold insulation layer including the hole. The tapering layer and the buffer oxide layer are etched back so that the tapering layer is remained only at the upper end portion of the etched hole. A metal storage node layer formed on the etched hole over the remaining tapering layer. The mold insulation layer and the remaining tapering layer are removed to form a cylindrical storage node having a tapered upper end. A dielectric layer and a plate node are formed over the storage node.
    • 通过在具有存储节点接触插塞的半导体衬底上形成缓冲氧化物层,蚀刻停止层和模具绝缘层来制造电容器。 蚀刻模具绝缘层和蚀刻停止层,以在存储节点接触插塞的上部形成孔。 在包括孔的模具绝缘层上沉积渐缩层。 锥形层和缓冲氧化物层被回蚀刻,使得锥形层仅保留在蚀刻孔的上端部。 在剩余的锥形层上形成在蚀刻孔上的金属储存节点层。 去除模具绝缘层和剩余的锥形层以形成具有锥形上端的圆柱形存储节点。 在存储节点上形成介电层和板状节点。
    • 9. 发明授权
    • Method for forming isolation layer of semiconductor device
    • 形成半导体器件隔离层的方法
    • US06955974B2
    • 2005-10-18
    • US10877714
    • 2004-06-25
    • Tae Hyeok LeeCheol Hwan ParkDong Su ParkHo Jin ChoEun A Lee
    • Tae Hyeok LeeCheol Hwan ParkDong Su ParkHo Jin ChoEun A Lee
    • H01L21/76H01L21/762H01L21/8242
    • H01L21/76224H01L27/10894
    • A method for forming an isolation layer of a semiconductor device, which comprises the steps of: a) sequentially forming a pad oxide layer and a pad nitride layer on a silicon substrate; b) etching the pad nitride layer, the pad oxide layer, and the silicon substrate, thereby forming a trench; c) thermal-oxidizing the resultant substrate to form a sidewall oxide layer on a surface of the trench; d) nitrifying the sidewall oxide layer through the use of NH3 annealing; e) depositing a liner aluminum nitride layer on an entire surface of the silicon substrate inclusive of the nitrated sidewall oxide layer; f) depositing a buried oxide layer on the liner aluminum nitride layer to fill the trench; g) performing a chemical mechanical polishing process with respect to the buried oxide layer; and h) eliminating the pad nitride layer.
    • 一种用于形成半导体器件的隔离层的方法,包括以下步骤:a)在硅衬底上依次形成焊盘氧化物层和衬垫氮化物层; b)蚀刻衬垫氮化物层,衬垫氧化物层和硅衬底,从而形成沟槽; c)热氧化所得衬底以在沟槽的表面上形成侧壁氧化物层; d)通过使用NH 3退火对侧壁氧化物层进行硝化; e)在包括所述硝化侧壁氧化物层的所述硅衬底的整个表面上沉积衬里氮化铝层; f)在衬里氮化铝层上沉积掩埋氧化物层以填充沟槽; g)对所述掩埋氧化物层进行化学机械抛光工艺; 以及h)消除所述衬垫氮化物层。