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1. 发明授权

US5830297A Method and apparatus for application of adhesive 失效
标题翻译：用于粘合剂的方法和设备
公开(公告)号：US5830297A
公开(公告)日：1998-11-03
申请号：US685604
申请日：1996-07-24
申请人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
发明人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
IPC分类号： B05C5/02 , H05K3/00 , H05K3/30 , H05K13/04 , B32B31/00
CPC分类号： H05K13/0469 , B05C5/0208 , H05K3/0097 , H05K3/305 , Y10T156/1798
摘要： An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each table, and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.
摘要翻译：一种用于通过施加喷嘴将粘合剂施加到施加物体上的粘合剂的施加方法。每个应用对象通过每个桌子的移动而定位在与输送方向相交的方向上，并且对应于桌子的各个应用头单独地沿传送方向移动和定位，并且将粘合剂同时施加到应用的必要位置使得电子电路板的生产效率在各个方面得到增强，而不增加设备的尺寸。

2. 发明授权

US5938871A Method and apparatus for application of adhesive 失效
标题翻译：用于粘合剂的方法和设备
公开(公告)号：US5938871A
公开(公告)日：1999-08-17
申请号：US113197
申请日：1998-07-10
申请人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
发明人： Hitoshi Nakahira , Hiroyuki Miyake , Osamu Ikeda , Takashi Sasaki , Yuzuru Inaba , Toshiyuki Kinou
IPC分类号： B05C5/02 , H05K3/00 , H05K3/30 , H05K13/04 , B32B31/00 , B05B7/06 , B05D3/14
CPC分类号： H05K13/0469 , B05C5/0208 , H05K3/0097 , H05K3/305 , Y10T156/1798
摘要： An application method of adhesive for applying an adhesive by an application nozzle on an application object. Each application object is positioned in a direction intersecting the conveying direction by the move of each tables and the individual application heads corresponding to the tables are individually moved and positioned in the conveying direction, and the adhesive is applied simultaneously to necessary positions of the application objects by the application heads, so that the production efficiency of electronic circuit boards is enhanced in various aspects without increasing the size of the apparatus.
摘要翻译：一种用于通过施加喷嘴将粘合剂施加到施加物体上的粘合剂的施加方法。每个应用对象通过每个桌子的移动而定位在与输送方向相交的方向上，并且对应于桌子的各个应用头单独地沿传送方向移动和定位，并且粘合剂被同时施加到应用对象的必要位置通过应用头，使得电子电路板的生产效率在各个方面得到增强，而不增加设备的尺寸。

3. 发明授权

US06562406B1 Apparatus and method for applying viscous fluid 失效
标题翻译：用于施加粘性流体的装置和方法
公开(公告)号：US06562406B1
公开(公告)日：2003-05-13
申请号：US09647237
申请日：2000-09-28
申请人： Naoichi Chikahisa , Hiroyuki Miyake , Takashi Sasaki , Akira Iizuka , Eiichiro Terayama , Yuzuru Inaba
发明人： Naoichi Chikahisa , Hiroyuki Miyake , Takashi Sasaki , Akira Iizuka , Eiichiro Terayama , Yuzuru Inaba
IPC分类号： B05D500
CPC分类号： B05C11/1034 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
摘要： The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed. The rotation of the screw portion is controlled in accordance with a viscosity of the adhesive, thus achieving the application in a required application diameter through a simple operation.
摘要翻译：本发明的目的是提供一种用于施加粘性流体的装置和方法，由此通过简单的操作实现恒定的施加直径，而在施加的构件的表面可以较少损坏的情况下，没有Tact损失。具有插入其中的螺纹部分（2122）的粘合剂施加构件（2111）通过旋转装置（230）旋转，从而防止粘合剂施加构件的喷嘴止动件（2114）与表面上的布线图案干涉的电路板。此外，当粘合剂施加构件旋转时，螺杆部分也同步旋转，从而防止粘合剂由于粘合剂施加构件的旋转而从喷嘴排出。因此施加直径可以均匀。螺杆部分的旋转根据粘合剂的粘度进行控制，从而通过简单的操作实现所需应用直径的应用。

4. 发明授权

US5882451A Method and apparatus for applying an electronic component adhesive 失效
标题翻译：用于涂覆电子部件粘合剂的方法和装置
公开(公告)号：US5882451A
公开(公告)日：1999-03-16
申请号：US824679
申请日：1997-03-26
申请人： Takashi Sasaki , Naoithi Thikahisa , Hiroyuki Miyake , Akira Iizuka , Eiichiro Terayama , Yuzuru Inaba
发明人： Takashi Sasaki , Naoithi Thikahisa , Hiroyuki Miyake , Akira Iizuka , Eiichiro Terayama , Yuzuru Inaba
IPC分类号： B05D1/26 , B05C5/00 , H01L21/00 , H05K1/02 , H05K3/30 , H05K3/34 , B05C11/00
CPC分类号： H01L21/67253 , H01L21/6715 , H05K3/305 , H05K1/0269 , H05K2203/0126 , H05K2203/163 , H05K3/3484 , Y02P70/613 , Y10T156/1798
摘要： A method and apparatus for applying an electronic component adhesive with a minimum length of time for setting a proper application condition. Variation of application shapes of each type of the adhesive is monitored under various different application conditions and its resultant data is saved. When a desired application shape is inputted, the application nozzles are automatically controlled to apply desired doses of the adhesive under an optimum application condition which is defined by retrieving the data previously stored. Also, various different application shapes for bonding respective electronic components may be determined and saved in advance, so that a proper application condition can be automatically determined by retrieving the data on the application shapes when a desired electronic component is selected.
摘要翻译：一种用于施加电子部件粘合剂的方法和装置，其具有用于设定适当施加条件的最小时间长度。在各种不同的应用条件下监测每种类型的粘合剂的应用形状的变化，并且保存其结果数据。当输入所需的应用形状时，应用喷嘴被自动控制，以在通过检索先前存储的数据定义的最佳应用条件下施加所需剂量的粘合剂。此外，可以预先确定并保存用于粘合各个电子部件的各种不同的应用形状，使得当选择所需的电子部件时，通过检索应用形状的数据，可以自动确定适当的应用条件。

5. 发明申请

US20090277348A1 SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD 有权
标题翻译：屏幕打印设备和画面打印方法
公开(公告)号：US20090277348A1
公开(公告)日：2009-11-12
申请号：US12090657
申请日：2006-11-10
申请人： Seikou Abe , Kunihiko Tokita , Seiichi Miyahara , Yuzuru Inaba
发明人： Seikou Abe , Kunihiko Tokita , Seiichi Miyahara , Yuzuru Inaba
IPC分类号： B41F15/08
CPC分类号： H05K3/1216 , B41F15/22 , B41P2215/114 , H05K2203/0165
摘要： Movable claws 13 are formed in dampers 10 holding a substrate 3 so that the movable claws can be selectively moved to a position where they have projected above the substrate 3, and to a position where they have retreated from above the substrate 3. Thereby, the safety of operation is ensured by causing the movable claws 13 to retreat during maintenance. Moreover, printing with high precision can be performed in a state where the surface of the substrate 3 and the rear face of the mask 2 are brought into surface contact with each other without any clearance by causing the movable claws 13 to retreat.
摘要翻译：可移动爪13形成在保持基板3的阻尼器10中，使得可动爪可以选择性地移动到它们已经突出到基板3上方的位置，并且到达它们已经从基板3的上方退回的位置。因此，通过使可动爪13在维护期间退回来确保操作的安全性。此外，可以通过使可动爪13退回，在基板3的表面和面罩2的表面彼此表面接触而没有任何间隙的状态下，可以进行高精度的打印。

6. 发明申请

US20100258591A1 PASTE APPLICATION DEVICE 有权
标题翻译： PASTE应用设备
公开(公告)号：US20100258591A1
公开(公告)日：2010-10-14
申请号：US12746595
申请日：2008-11-17
申请人： Yuzuru Inaba , Osamu Okuda
发明人： Yuzuru Inaba , Osamu Okuda
IPC分类号： G01F11/00
CPC分类号： H01L21/6715 , H01L21/67144 , Y10T156/1798
摘要： There is provided a paste application device which can solve problems of an increased exclusively occupied space attributed to an arrangement of a syringe and of deterioration of a tube.In a paste application unit 15 (a paste application device) for applying a paste 7 stored in a syringe 16 to an application target material, a configuration is adopted in which a pump mechanism 18 for sending the paste 7 under pressure is formed by causing a discharge thread portion 32b provided at a lower portion of a rotary member 32 to rotate about an axis AX within a discharge space 31b provided in a casing portion 31, in which a discharge port 17a, which communicates with the discharge space 31b, is provided at an end portion of the casing portion 31, and in which the syringe 16 is disposed coaxially with the rotary member 32 for detachable connection thereto. By adopting this configuration, the problems can be solved of the increased exclusively occupied space that would occur when the syringe 16 is disposed in parallel to the pump mechanism 18 and of deterioration of the tube.
摘要翻译：提供了一种可以解决归因于注射器的布置和管劣化引起的专门占用空间增加的问题的糊剂施加装置。在将用于将存储在注射器16中的糊剂7施加到施加对象材料的糊剂施加单元15（糊剂施加装置）中，采用其中用于在压力下发送膏体7的泵机构18通过使设置在旋转构件32的下部的排出螺纹部32b围绕设置在与放电空间31b连通的排出口17a的壳体部31内的放电空间31b内的轴线AX旋转，壳体部分31的端部，并且其中注射器16与旋转部件32同轴设置，用于可拆卸地连接到其上。通过采用这种构造，可以解决当注射器16平行于泵机构18设置并且管的劣化时将发生的增加的专门占用空间的问题。

7. 发明授权

US06761769B2 Apparatus for applying viscous material 失效
标题翻译：用于施加粘性材料的装置
公开(公告)号：US06761769B2
公开(公告)日：2004-07-13
申请号：US10075620
申请日：2002-02-15
申请人： Yuzuru Inaba , Eiichiro Terayama , Naoichi Chikahisa , Shunji Hashimoto
发明人： Yuzuru Inaba , Eiichiro Terayama , Naoichi Chikahisa , Shunji Hashimoto
IPC分类号： B05C1100
CPC分类号： B05C5/001 , B05C11/10 , B05C11/1034
摘要： An applicator has a rubber heater (51) attached to the outer peripheral surface of the application member (4) in the vicinity of a nozzle (3). Thereby, the temperature in the vicinity of the nozzle (3) is controlled by a control unit by detecting the temperature using a thermal resistor (52). A change in the viscosity of the viscous material (2) is prevented by keeping the temperature substantially constant, so that the volume of the viscous material from the nozzle (3) is stabilized.
摘要翻译：喷涂器具有在喷嘴（3）附近附着在施加部件（4）的外周面上的橡胶加热器（51）。由此，通过使用热电阻（52）检测温度，由控制单元控制喷嘴（3）附近的温度。通过保持温度基本上恒定来防止粘性物质（2）的粘度变化，使来自喷嘴（3）的粘性物质的体积稳定。

8. 发明授权

US06412166B1 Mounting apparatus for electronic component 有权
标题翻译：电子元件安装装置
公开(公告)号：US06412166B1
公开(公告)日：2002-07-02
申请号：US09576713
申请日：2000-05-23
申请人： Yuzuru Inaba , Kiyoshi Imai , Hideaki Watanabe , Hiromi Kinoshita
发明人： Yuzuru Inaba , Kiyoshi Imai , Hideaki Watanabe , Hiromi Kinoshita
IPC分类号： B23P1900
CPC分类号： H05K13/0417 , Y10T29/4914 , Y10T29/515 , Y10T29/53013 , Y10T29/53065 , Y10T29/53178 , Y10T29/53183
摘要： An apparatus is provided with a component feeding member for feeding electronic components having lead wires in a tape-bonded state, an insertion head for separating the electronic components fed from the feeding member from the tapes and inserting to holes of a board, and a fixing head facing the insertion head via the board for cutting and folding the lead wires of the inserted electronic component in the board thereby fixing the electronic component to the board. AC servo motors operating independently of each other are individually set in the insertion head and the fixing head, which are controlled by a device so as to be synchronous with each other.
摘要翻译：一种装置设置有用于馈送具有带状接合状态的引线的电子部件的部件供给部件，用于将从进给部件供给的电子部件与带子分离并插入到板的孔的插入头，以及固定头部通过板面对插入头，用于将插入的电子部件的引线切割和折叠在板中，从而将电子部件固定到板上。彼此独立地操作的交流伺服电动机分别设置在插入头和固定头中，其由装置控制以彼此同步。

9. 发明授权

US08333010B2 Electronic component mounting apparatus 有权
标题翻译：电子元件安装装置
公开(公告)号：US08333010B2
公开(公告)日：2012-12-18
申请号：US12936752
申请日：2009-03-30
申请人： Yuzuru Inaba , Osamu Okuda , Yuji Tanaka , Tetsutaro Hachimura
发明人： Yuzuru Inaba , Osamu Okuda , Yuji Tanaka , Tetsutaro Hachimura
IPC分类号： B23P19/00
CPC分类号： H05K13/0465 , Y10T29/49828 , Y10T29/5137 , Y10T29/5313 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： In an electronic component mounting apparatus that is used in an electronic component mounting line for producing a mounted substrate by mounting electronic components on a substrate and that subjects the substrate to predetermined operation, a working unit attachment section 30 is provided within a range of movement of a working head, such as a loading head and a paste coating head, wherein a nozzle stocker 9 and a paste trial coating unit 10 can be removably attached as a working unit for performing specific additional operation appropriate for working function of the working head. The nozzle stoker 9 and the paste trial coating unit 10 are attached to the working unit attachment section 30 according to the type of working head.
摘要翻译：在将电子部件安装在基板上并使基板进行规定的动作的电子部件安装线中使用的电子部件安装装置中，将工作部件安装部30设置在诸如装载头和糊涂头的工作头，其中喷嘴贮存器9和糊涂试验单元10可移除地附接作为工作单元，用于执行适合于工作头的作业功能的特定附加操作。根据工作头的种类，将喷嘴加热器9和糊料试
涂单元10安装在作业单元安装部30上。

10. 发明申请

US20110098840A1 PARTS MOUNTING RELATED WORK DEVICE 有权
标题翻译：部件安装相关工作装置
公开(公告)号：US20110098840A1
公开(公告)日：2011-04-28
申请号：US13000755
申请日：2009-05-28
申请人： Yuzuru Inaba , Osamu Okuda
发明人： Yuzuru Inaba , Osamu Okuda
IPC分类号： G06F19/00
CPC分类号： H05K13/0452 , G05B2219/45029 , H05K13/0404 , H05K13/0408 , H05K13/046
摘要： A problem that the present invention is to solve is to provide a parts mounting related work device which can prevent the occurrence of an unexpected operation failure and an erroneous stopping of the whole system which are attributed to an error in combination of working head and working equipment.A storage part (24c) stores combinations of types of working heads (H) and types of working equipment (E) which correspond to contents of work that is performed on a board (PB), and a determination part (24d) determines whether or not the combination of the type of the working head (H) which is currently detected by a head type detector and the type of the working equipment which is currently detected by an equipment type detector coincides with any of combinations stored in the storage part (24c). An action restriction part (24e) restricts a moving action of a moving stage (11) by an action control part (24a) in case the determination part (24d) determines that the combination of the type of the working head (H) which is currently attached to the moving stage (11) and the type of the working equipment which is currently mounted in a base platform (3) coincides with non of the combinations stored in the storage part (24c).
摘要翻译：本发明要解决的问题是提供一种能够防止由于工作头和作业设备的组合引起的误差而引起的意外的操作故障和整个系统的错误停止的零件安装相关的工作装置。存储部（24c）存储与在板（PB）上进行的作业的内容对应的工作头（H）和工作装置（E）的种类的组合，判定部（24d）不是由头型检测器当前检测到的工作头（H）的类型与当前由设备型检测器检测到的工作设备的类型的组合与存储在存储部分（24c）中的任何组合）。动作限制部分（24e）在确定部分（24d）确定工作头（H）的类型的组合（H）是否合并的情况下，通过动作控制部分（24a）限制移动台（11）的移动动作当前安装在基台（3）上的工作设备的类型与存储在存储部分（24c）中的组合的非组合一致。

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