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1. 发明授权

US5567515A Surface protective films 失效
标题翻译：表面保护膜
公开(公告)号：US5567515A
公开(公告)日：1996-10-22
申请号：US365540
申请日：1994-12-28
申请人： Hitoshi Koga , Masao Kameyama , Kazuo Iwata , Masahiro Gonda
发明人： Hitoshi Koga , Masao Kameyama , Kazuo Iwata , Masahiro Gonda
IPC分类号： C09J7/02 , B32B7/12 , B32B27/08
CPC分类号： C09J7/021 , C09J2203/306 , Y10T428/2848 , Y10T428/2852 , Y10T428/2883 , Y10T428/31913
摘要： The underside of a base layer consisting of one or more sub-layers is overlaid with an adhesive layer that is chiefly composed of an .alpha.-olefin copolymer that is based on at least two .alpha.-olefins selected from among .alpha.-olefins having 2-12 carbon atoms and which has a crystallinity of up to 10%, and said adhesive layer will develop an initial tack of at least 20 g/25 mm when attached to the surface of a stainless steel plate at 23.degree. C. The thus produced surface protective film, when attached to various kinds of adherends, will not experience separation of the adhesive layer from the base layer while developing strong initial tack, will experience only small changes in adhesive strength (peel strength) with the lapse of time after attachment to the adherends, is sufficiently low in blocking force to provide ease in film handling during the rewinding operation and it yet can be manufactured at low cost.
摘要翻译：由一个或多个亚层组成的基层的下侧覆盖有主要由α-烯烃共聚物组成的粘合剂层，所述α-烯烃共聚物基于选自具有2-12个碳原子的α-烯烃中的至少两种α-烯烃碳原子，其结晶度高达10％，并且当粘附在23℃的不锈钢板的表面上时，所述粘合剂层将产生至少20g / 25mm的初始粘性。由此产生的表面保护胶片当附着于各种被粘物时，不会发生粘合剂层与基底层的分离，同时显现出强烈的初始粘着力，在附着到被粘附体之后随着时间的推移经历粘合强度（剥离强度）的微小变化，阻塞力足够低，以便在重绕操作期间容易地进行膜处理，并且可以以低成本制造。

2. 发明授权

US4849293A Amorphous polyester compositions and uses thereof 失效
标题翻译：无定形聚酯组合物及其用途
公开(公告)号：US4849293A
公开(公告)日：1989-07-18
申请号：US103350
申请日：1987-10-01
申请人： Hitoshi Koga , Kazuo Iwata , Masushi Mishimoto , Nikio Hashimoto
发明人： Hitoshi Koga , Kazuo Iwata , Masushi Mishimoto , Nikio Hashimoto
IPC分类号： C08L51/06 , C08L67/02
CPC分类号： C08L51/06 , C08L67/02 , Y10T428/31663 , Y10T428/31681
摘要： An amorphous polyester composition according to the present invention comprises (A) a low crystalline polyolefin modified with unsaturated carboxylic acids, (B) an amorphous polyester, (C) a silane coupling agent and (D) an optional inorganic filler, wherein (A) forms a matrix phase and (B) forms a domain phase. This amorphous polyester composition has excellent adhesion properties to different materials such as metal and has excellent damping performance, and therefore a damping material having excellent initial adhesion properties and water-resistant adhesion properties and excellent damping performance, particularly at high temperatures can be obtained from such an amorphous polyester composition.
摘要翻译：根据本发明的无定形聚酯组合物包含（A）用不饱和羧酸改性的低结晶聚烯烃，（B）无定形聚酯，（C）硅烷偶联剂和（D）任选的无机填料，其中（A）形成基质相，（B）形成畴相。该无定形聚酯组合物对金属等不同材料的粘合性优异，阻尼性优异，因此具有优异的初期粘合性，耐水粘合性，阻尼性优异的阻尼材料，特别是在高温下，可以得到无定形聚酯组合物。

3. 发明授权

US07358158B2 Wafer machining adhesive tape, and its manufacturing method and using method 有权
标题翻译：晶圆加工胶带及其制造方法和使用方法
公开(公告)号：US07358158B2
公开(公告)日：2008-04-15
申请号：US11003373
申请日：2004-12-06
申请人： Shin Aihara , Hitoshi Koga
发明人： Shin Aihara , Hitoshi Koga
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J7/381 , C09J7/385 , C09J2203/326 , C09J2423/00 , C09J2423/006 , C09J2453/00 , H01L21/78 , H01L2221/68327 , Y10T428/28
摘要： An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G′ of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan δ as represented by the ratio of a loss modulus G″ to the storage modulus G′ is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.
摘要翻译：具有在基材层的一面上形成的粘合剂层的粘合带，使得当粘合有该胶带的硅晶片为可能时，可以最小化芯片的碎裂或断裂（缺口）或芯片裂纹的发展程度用切片机切成芯片。带的粘合层在15〜35℃的温度下的储能模量G'为1MPa以上，优选为损耗模量G“与储能模量G'的比率表示的tanδ，为0.05以下。粘合剂层优选主要由烯烃聚合物构成。

4. 发明申请

US20050153127A1 Wafer machining adhesive tape, and its manufacturing method and using method 有权
标题翻译：晶圆加工胶带及其制造方法和使用方法
公开(公告)号：US20050153127A1
公开(公告)日：2005-07-14
申请号：US11003373
申请日：2004-12-06
申请人： Shin Aihara , Hitoshi Koga
发明人： Shin Aihara , Hitoshi Koga
IPC分类号： B32B27/00 , B32B27/32 , C09J7/02 , C09J123/02 , C09J153/00 , H01L21/301 , H01L21/68 , H01L21/78 , B32B7/12
CPC分类号： H01L21/6836 , C09J7/22 , C09J7/38 , C09J7/381 , C09J7/385 , C09J2203/326 , C09J2423/00 , C09J2423/006 , C09J2453/00 , H01L21/78 , H01L2221/68327 , Y10T428/28
摘要： An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G′ of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan δ as represented by the ratio of a loss modulus G″ to the storage modulus G′ is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.
摘要翻译：具有在基材层的一面上形成的粘合剂层的粘合带，使得当粘合有该胶带的硅晶片为可能时，可以最小化芯片的碎裂或断裂（缺口）或芯片裂纹的发展程度用切片机切成芯片。带的粘合层在15〜35℃的温度下的储能模量G'为1MPa以上，优选为损耗模量G“与储能模量G'的比率表示的tanδ，为0.05以下。粘合剂层优选主要由烯烃聚合物构成。

5. 发明授权

US4681816A Composite laminates comprising a metallic substrate and vibration damper 失效
标题翻译：复合层压板包括金属基底和振动阻尼器
公开(公告)号：US4681816A
公开(公告)日：1987-07-21
申请号：US748045
申请日：1985-06-24
申请人： Mikio Hashimoto , Yoshinari Nakata , Hitoshi Koga
发明人： Mikio Hashimoto , Yoshinari Nakata , Hitoshi Koga
IPC分类号： B32B15/08 , F16F15/02 , G10K11/168 , C08L63/00 , E04B1/84
CPC分类号： B32B15/08 , G10K11/168 , Y10S260/46 , Y10T428/251 , Y10T428/258 , Y10T428/31699 , Y10T428/31924 , Y10T428/31928
摘要： Composite laminates such as metal plate/vibration damper/metal plate, metal plate/vibration damper/metal plate/vibration damper, metal plate/vibration damper/metal plate/vibration damper/metal plate are disclosed. The vibration damper is composed of ethylene-(meth)acrylic acid salt copolymers or its modified products having a specific melting point and a particular heat of fusion. The composite laminate having at least one vibration damper exhibits excellent vibration damping performance, particularly at high temperatures.
摘要翻译：公开了金属板/减振器/金属板，金属板/振动阻尼器/金属板/振动阻尼器，金属板/振动阻尼器/金属板/振动阻尼器/金属板等复合层压板。振动阻尼器由乙烯 - （甲基）丙烯酸盐共聚物或其具有特定熔点和特定熔融热的改性产物组成。具有至少一个振动阻尼器的复合层压板具有优异的减震性能，特别是在高温下。

6. 发明授权

US4650951A Method of welding laminates each having the structure of metal layer/thermally softenable insulating layer/metal layer 失效
标题翻译：每层具有金属层/可热软化绝缘层/金属层结构的层叠体的焊接方法
公开(公告)号：US4650951A
公开(公告)日：1987-03-17
申请号：US884884
申请日：1986-07-11
申请人： Hitoshi Koga , Takehisa Noborio , Masushi Nishimoto
发明人： Hitoshi Koga , Takehisa Noborio , Masushi Nishimoto
IPC分类号： B23K11/16 , H05K3/32 , H05K3/36 , H05K3/40
CPC分类号： B23K11/163 , H05K3/361 , H05K3/4084 , H05K2201/0129 , H05K2203/0195 , H05K2203/1189 , H05K2203/1572 , H05K3/328
摘要： A method of resistance-welding two laminates each having a basic structure of a metal layer/a thermally softenable insulating layer/a metal layer, which allows welding with excellent welding strength and good outer appearance of a welded spot. In this method, two laminates are prepared in which each metal layer has a thickness of 0.02 to 0.5 mm, and a ratio of the total thickness of the metal layers of each laminate to the thickness of the laminate falls within a range between 1/3 and 2/3. Electrodes held at a temperature above the softening temperature of the insulating layers are urged against the laminates to soften the insulating layers and so bring the metal layers into contact with each other and to resistance-weld the laminates.
摘要翻译：电阻焊接具有金属层/可热软化绝缘层/金属层的基本结构的两个层压体的方法，其允许焊接具有优异的焊接强度和焊接点的良好外观。在该方法中，制备两层叠体，其中每个金属层的厚度为0.02至0.5mm，并且每个层压体的金属层的总厚度与层压板的厚度之比落在1/3 和2/3。保持在高于绝缘层的软化温度的温度的电极被压靠在层压板上以使绝缘层软化，从而使金属层彼此接触并对层压体进行电阻焊接。

7. 发明授权

US4477513A Laminate 失效
标题翻译：层压板
公开(公告)号：US4477513A
公开(公告)日：1984-10-16
申请号：US151833
申请日：1980-05-21
申请人： Hitoshi Koga
发明人： Hitoshi Koga
IPC分类号： B32B15/04 , B29C63/00 , B32B15/08 , E04C2/284 , E04C2/292 , B32B7/00
CPC分类号： B29C63/0021 , B32B15/08 , E04C2/284 , E04C2/292 , Y10T428/31681 , Y10T428/31692 , Y10T442/656
摘要： A laminate comprises a sandwich plate of metal-thermoplastic resin-metal layers and a fiber reinforced plastics overlying at least one surface of the sandwich plate. The laminate is suitable for outer wall plates of various matters.
摘要翻译：层压板包括金属 - 热塑性树脂 - 金属层的夹层板和覆盖在夹层板的至少一个表面上的纤维增强塑料。该层压板适用于各种事物的外壁板。

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