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1. 发明授权

US06235865B1 Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition 有权
标题翻译：硼酸鏻化合物，制法，固化催化剂和环氧树脂组合物
公开(公告)号：US06235865B1
公开(公告)日：2001-05-22
申请号：US09345390
申请日：1999-06-30
申请人： Hisashi Shimizu , Minoru Takei , Toshio Shiobara
发明人： Hisashi Shimizu , Minoru Takei , Toshio Shiobara
IPC分类号： B01J3122
CPC分类号： C08K5/55 , B01J31/0268 , B01J31/146 , C07F9/54 , C08G59/688 , C08L63/00
摘要： Phosphonium borate compounds of formula (1) are novel. R1, R2, R3 and R4 each are a monovalent organic group having an aromatic or heterocyclic ring or a monovalent aliphatic group, at least one of R1, R2, R3 and R4 which are bonded to phosphorus atom and at least one of R1, R2, R3 and R4 which are bonded to boron atom are each an organic group derived by releasing a proton from a proton donor selected from among an aromatic carboxylic acid having at least one carboxyl group, an aromatic carboxylic acid having at least one acid anhydride group and at least one carboxyl group, a phenol compound having at least one phenolic hydroxyl group, an aromatic compound having at least one carboxyl group and at least one phenolic hydroxyl group, and an aliphatic carboxylic acid having at least one carboxyl group. The phosphonium borate compounds are useful as a latent curing catalyst for epoxy resin compositions. The epoxy resin compositions are improved in shelf stability, fast-curing ability and flow and cure into products having moisture resistance and improved electrical properties.
摘要翻译：式（1）的硼酸鏻化合物是新颖的.R1，R2，R3和R4各自是具有芳族或杂环或一价脂族基的一价有机基团，R 1，R 2，R 3和R 4中的至少一个是键合的磷原子和与硼原子键合的R 1，R 2，R 3和R 4中的至少一个各自是通过从质子供体中释放质子衍生的有机基团，所述质子供体选自具有至少一个羧基的芳族羧酸，具有至少一个酸酐基和至少一个羧基的芳族羧酸，具有至少一个酚羟基的酚化合物，至少一个羧基和至少一个酚羟基的芳族化合物和脂族羧酸具有至少一个羧基。硼酸鏻化合物可用作环氧树脂组合物的潜在固化催化剂。环氧树脂组合物在贮存稳定性，快速固化能力和流动性方面得到改进，并且固化成具有防潮性和改善的电性能的产品。

2. 发明授权

US6084037A Epoxy resin composition and semiconductor device 失效
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US6084037A
公开(公告)日：2000-07-04
申请号：US993403
申请日：1997-12-18
申请人： Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
发明人： Hisashi Shimizu , Minoru Takei , Masachika Yoshino , Toshio Shiobara
IPC分类号： C08K3/22 , C08F283/10 , C08G59/40 , C08G59/68 , C08K3/36 , C08K5/548 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08K5/548 , C08F283/10 , C08G59/686 , C08G59/687 , C08L63/00
摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.
摘要翻译：在包含环氧树脂，固化剂和无机填料的环氧树脂组合物中，将偏苯三酸酐的盐与作为固化促进剂的1,8-二氮杂双环（5.4.0）十一碳烯-7和含巯基的硅烷偶联剂。该组合物是稳定的并顺利流动并固化成具有改善的粘合性，耐湿性和电性能的产品。该组合物适用于半导体器件的封装。

3. 发明授权

US5340851A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5340851A
公开(公告)日：1994-08-23
申请号：US17290
申请日：1993-02-12
申请人： Toshio Shiobara , Hisashi Shimizu , Minoru Takei
发明人： Toshio Shiobara , Hisashi Shimizu , Minoru Takei
IPC分类号： C08G59/00 , C08G59/40 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29
CPC分类号： H01L23/293 , C08G59/4042 , C08L63/00 , H01B3/40 , H01L2924/0002
摘要： A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.
摘要翻译：热固性树脂组合物包含（A）具有不含烯丙基的马来酰亚胺基的酰亚胺化合物和具有含烯丙基的酰亚胺基的酰亚胺化合物的混合物，（B）环氧树脂，（C）酚醛树脂，（D）芳族聚合物/有机聚硅氧烷共聚物。组分（B）和/或（C）包括含有与芳环共轭的双键的萘环的化合物。该组合物易于加工并且粘合性良好，并且可以改善机械强度，耐热水性，低热膨胀性和最小化吸水性的产品。

4. 发明授权

US07563854B2 Method of producing high molecular weight organopolysiloxane, composition comprising the high molecular weight organopolysiloxane, and optical semiconductor device sealed with cured product thereof 有权
标题翻译：生产高分子量有机聚硅氧烷的方法，包含高分子量有机聚硅氧烷的组合物和用其固化产物密封的光学半导体器件
公开(公告)号：US07563854B2
公开(公告)日：2009-07-21
申请号：US11586525
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08G77/06
CPC分类号： C08G77/04 , C08G77/06 , C08G77/08 , C08G77/14 , Y10T428/31663
摘要： Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
摘要翻译：本发明提供一种聚苯乙烯换算重均分子量为5×10 4以上的高分子量有机聚硅氧烷的制造方法，其特征在于，包括使具有水解性基团的硅烷化合物进行第一次水解缩合而制造有机聚硅氧烷的工序，该有机聚硅氧烷再次进行水解和缩合。高分子量有机聚硅氧烷是稳定的，耐胶凝的，即使形成厚膜也能耐裂纹。包含高分子量有机聚硅氧烷和缩合催化剂的树脂组合物可用于密封光学元件并用于制造光学半导体器件。

5. 发明授权

US07550204B2 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
标题翻译：用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法
公开(公告)号：US07550204B2
公开(公告)日：2009-06-23
申请号：US11586564
申请日：2006-10-26
申请人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hisashi Shimizu , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： B32B9/04 , C08G77/18
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08G77/70 , C08J7/047 , C08J2483/00 , C08K5/0091 , H01L23/296 , H01L2924/0002 , Y10T428/31663 , H01L2924/00
摘要： The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element. The composition can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion.
摘要翻译：本发明提供了一种用于密封光学装置的组合物，其包含（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为：<？in-line-formula description =“In- 线形式“end =”lead“→> R1a（OX）bSiO（4-ab）/ 2 <？in-line-formula description =”In-line Formulas“end =”tail“？>（其中，R1表示烷基，烯基或芳基; X表示由式-SiR 2 R 3 R 4表示的基团（其中，RE至R 4为一价烃基）和烷基，烯基，烷氧基烷基或酰基的组合; 表示在1.00〜1.5的范围内的数字; b表示满足0 b 2的数，a + b满足1.00 a + b 2），（ii）缩合催化剂，以及由固化组合物，以及密封半导体元件的方法，其包括施加组合物的步骤涉及半导体元件，以及固化已经施加到半导体元件上的组合物的步骤。该组合物可以形成表现出优异的耐热性，耐紫外线性，光学透明性，韧性和粘附性的涂膜。

6. 发明申请

US20060035092A1 Resin composition for sealing LED elements and cured product generated by curing the composition 审中-公开
标题翻译：用于密封LED元件的树脂组合物和通过固化组合物产生的固化产物
公开(公告)号：US20060035092A1
公开(公告)日：2006-02-16
申请号：US11199175
申请日：2005-08-09
申请人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
发明人： Hisashi Shimizu , Tsutomu Kashiwagi , Toshio Shiobara
IPC分类号： B32B27/04 , C08L83/04 , H01L21/00
CPC分类号： C09D183/04 , H01L33/56 , Y10T428/31663
摘要： Provided is a resin composition for sealing LED elements, including (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×103, represented by an average composition formula (1): R1a(OX)bSiO(4-a-b)/2, in which, each R1 represents, independently, an alkyl group, alkenyl group or aryl group of 1 to 6 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.05 to 1.5, b represents a number that satisfies 0
摘要翻译：提供一种用于密封LED元件的树脂组合物，其包含（i）由平均组成式（1）表示的聚苯乙烯换算重均分子量为至少5×10 3的有机聚硅氧烷：R

7. 发明授权

US06210811B1 Epoxy resin composition, laminate film using the same, and semiconductor device 有权
标题翻译：环氧树脂组合物，使用其的层压膜和半导体器件
公开(公告)号：US06210811B1
公开(公告)日：2001-04-03
申请号：US09404301
申请日：1999-09-24
申请人： Tsuyoshi Honda , Miyuki Wakao , Hisashi Shimizu , Toshio Shiobara
发明人： Tsuyoshi Honda , Miyuki Wakao , Hisashi Shimizu , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： H01L23/293 , C08G59/32 , C08G59/3254 , C08L63/00 , H01L21/563 , H01L24/29 , H01L2224/73203 , H01L2224/73204 , H01L2924/01012 , H01L2924/01025 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , Y10T428/12528 , C08L83/00 , H01L2924/3512 , H01L2924/00
摘要： An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.
摘要翻译：一种环氧树脂组合物，其包含含有0-10重量％的2-核化合物和50-100重量％组合并具有1.0-1.7分散性（Mw / Mn）的3至5个核化合物的环氧树脂，无机填料，固化催化剂和任选的酚醛树脂，并且在未固化状态下具有低于15℃的Tg，有效地形成易于在室温下加工的柔性膜。层压膜包括环氧树脂组合物层和保护层。通过用膜密封半导体芯片，获得了具有改善的耐热性，改进的耐湿性，低应力性能的半导体封装。

8. 发明授权

US5182351A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5182351A
公开(公告)日：1993-01-26
申请号：US580668
申请日：1990-09-11
申请人： Toshio Shiobara , Hisashi Shimizu
发明人： Toshio Shiobara , Hisashi Shimizu
IPC分类号： C08F222/40 , C08F20/52 , C08F30/08 , C08F230/08 , C08F290/00 , C08F299/00 , C08F299/08 , C08G59/20 , C08G59/30 , C08G59/40 , C08G73/12 , C08K5/3415 , C08L79/08 , C08L83/04 , C08L83/07
CPC分类号： C08L79/08 , C08F299/08 , C08F30/08 , C08G73/12 , C08G73/125 , C08G73/126 , C08G73/127 , C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/44 , C08G77/70
摘要： A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.
摘要翻译：包含其分子中具有至少一个N-取代的马来酰亚胺基团的马来酰亚胺和具有共轭双键的硅化合物的热固性树脂组合物易于加工，并产生具有改善的耐热性的固化产物。

9. 发明授权

US5298548A Epoxy resin composition and semiconductor devices encapsulated therewith 失效
标题翻译：环氧树脂组合物和封装的半导体器件
公开(公告)号：US5298548A
公开(公告)日：1994-03-29
申请号：US885965
申请日：1992-05-20
申请人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
发明人： Toshio Shiobara , Takayuki Aoki , Kazutoshi Tomiyoshi , Hisashi Shimizu , Takashi Tsuchiya
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/32 , C08G59/38 , C08G59/62 , C08L63/00 , H01B3/40 , H01L23/29 , H01L23/31 , C08G59/22
CPC分类号： H01B3/40 , C08G59/3218 , C08G59/38 , C08L63/00
摘要： An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.
摘要翻译：包含（A）含萘环氧树脂，（B）含联苯的环氧树脂，（C）特定酚醛树脂和（D）无机填料的环氧树脂组合物显示出良好的流动性和固化性，弹性模量，特别是在高于Tg的温度下，低膨胀系数，高Tg，不论低应力如何，吸水率最小化。然后，即使在表面安装时受到热冲击，用本发明组合物封装的半导体器件也保持高度可靠性。

10. 发明授权

US5290882A Thermosetting resin compositions 失效
标题翻译：热固性树脂组合物
公开(公告)号：US5290882A
公开(公告)日：1994-03-01
申请号：US928064
申请日：1992-08-11
申请人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
发明人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
IPC分类号： C08G59/32 , C08G59/40 , C08G77/42 , C08L61/06 , C08L63/00 , C08L79/08 , C08L83/04 , C08L63/04 , C08L63/10
CPC分类号： C08L61/06 , C08G59/3218 , C08G59/4042 , C08G77/42 , C08L63/00 , C08L79/08 , C08L83/04
摘要： A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.
摘要翻译：热固性树脂组合物含有（A）具有马来酰亚胺基团的酰亚胺化合物，（B）环氧树脂，（C）酚醛树脂和任选的（D）芳族聚合物/有机聚硅氧烷共聚物。组分（B）和/或（C）包括含有具有烯丙基的萘环的化合物，优选含有萘环和与芳环共轭的双键的化合物。该组合物易于加工并固化成具有改善的耐热性，低热膨胀性和低吸水性的产品。

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