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1. 发明授权

US08522815B2 Gas shutoff device 有权
标题翻译：燃气关闭装置
公开(公告)号：US08522815B2
公开(公告)日：2013-09-03
申请号：US13140375
申请日：2009-12-16
申请人： Tsuyoshi Honda , Takuhisa Ootani , Kouji Murase
发明人： Tsuyoshi Honda , Takuhisa Ootani , Kouji Murase
IPC分类号： F16K17/00
CPC分类号： F23N1/002 , F23N5/242 , Y10T137/7726 , Y10T137/7734 , Y10T137/7761 , Y10T137/86389 , Y10T137/86397
摘要： With a gas shutoff device in the related art, a non-uniform gas layer can be produced by mixing of a gas of a different type from the gas currently in use during a shift in the amount of heat or installation or replacement, and an unexpected flow rate may be detected due to a disruption in the propagation of ultrasonic waves, thereby causing an erroneous determination of a flow rate abnormality or a sensor abnormality. With the gas shutoff device according to the invention, a valve-closing timer section 14 starts to time based on a valve-closing signal which is output by the flow rate abnormality or the sensor abnormality, and outputs a valve-opening signal to a valve driving section 12 if a release input is accepted from outside within a setting time period. Thus, even when the non-uniform gas layer is produced by mixing the gas of a different type from the gas currently in use during the shift in the amount of heat or installation or replacement, an unexpected flow rate is detected due to the disruption in the propagation of ultrasonic waves, thereby causing the erroneous determination of the flow rate abnormality or the sensor abnormality, and the valve is closed, the erroneous determination is resolved and the gas is available again within a given time period.
摘要翻译：利用现有技术中的燃气切断装置，可以通过在热量或安装或更换的换挡期间将不同类型的气体与当前使用的气体混合而产生不均匀的气体层，可以由于超声波的传播中断而检测出流量，从而导致流量异常或传感器异常的错误判定。利用根据本发明的燃气切断装置，基于由流量异常或传感器异常输出的关闭信号，关闭计时器部14开始时间，并将阀开启信号输出到阀如果在设定时间段内从外部接受释放输入，则驱动部分12。因此，即使当通过在热量或安装或更换的换挡期间将不同类型的气体与当前正在使用的气体混合来生产非均匀气体层时，由于中断而检测到意外的流量超声波的传播，从而导致流量异常或传感器异常的错误判定，并且阀关闭，错误判定被解决，并且气体在给定时间段内再次可用。

2. 发明申请

US20110066387A1 APPLIANCE MONITORING APPARATUS 审中-公开
标题翻译：电器监控装置
公开(公告)号：US20110066387A1
公开(公告)日：2011-03-17
申请号：US12993673
申请日：2009-02-27
申请人： Tsuyoshi Honda , Akira Matsuda , Kouji Murase , Kenji Yasuda , Mitsuo Namba , Kazuo Kubo , Hisashi Saito
发明人： Tsuyoshi Honda , Akira Matsuda , Kouji Murase , Kenji Yasuda , Mitsuo Namba , Kazuo Kubo , Hisashi Saito
IPC分类号： G06F19/00
CPC分类号： F23N5/184 , F23N5/003 , F23N5/24 , F23N2005/185 , F23N2023/48 , F23N2023/54 , F23N2900/05002 , G01F3/22
摘要： A convention appliance monitoring apparatus handles only the amount of gas used and security information for the case of a gas cutoff and can not address social needs for a desire to obtain information about influence (e.g., an amount of CO2 emission) of use of the gas combustion appliance on a terrestrial environment.Based on a gas appliance used by a client and a gas flow signal pertaining the gas appliance which are output from an appliance determination unit 2, CO2 emission data on the gas appliance stored in a CO2 emission data storage unit 3, and CO2 emission data which are to be compared with the gas appliance and stored in a comparative CO2 emission data storage unit 4, a CO2 emission calculation unit 5 calculates an amount of CO2 emission, an comparative amount of CO2 emission and a difference between the amount of CO2 emission and the comparative amount of CO2 emission. Accordingly, it is possible to determine the amount of CO2 emission produced by using the gas appliance and the difference between the amount of CO2 emission and the comparative amount of CO2 emission.
摘要翻译：会议用具监控装置仅处理气体使用量和安全信息，并且不能满足社会需求以获得有关使用气体的影响（例如，二氧化碳排放量）的信息燃烧器具在陆地环境中。基于客户使用的燃气器具和从器具判定单元2输出的与燃气器具相关的气体流量信号，存储在二氧化碳排放数据存储单元3中的燃气器具上的二氧化碳排放数据和二氧化碳排放数据，将其与燃气用具进行比较并存储在比较二氧化碳排放数据存储单元4中，二氧化碳排放量计算单元5计算二氧化碳排放量，二氧化碳排放量的比较量和二氧化碳排放量之间的差异比较二氧化碳排放量。因此，可以确定使用燃气器具产生的二氧化碳排放量和二氧化碳排放量与二氧化碳排放量的比较差之间的差异。

3. 发明申请

US20110023967A1 TEMPORARY DRAINAGE SYSTEM AND TEMPORARY DRAINAGE METHOD 有权
标题翻译：临时排水系统和临时排水方法
公开(公告)号：US20110023967A1
公开(公告)日：2011-02-03
申请号：US12935123
申请日：2009-03-23
申请人： Tsuyoshi Honda
发明人： Tsuyoshi Honda
IPC分类号： E03B7/07 , E03B5/00
CPC分类号： E04G21/28 , Y10T137/0318 , Y10T137/5283 , Y10T137/6969 , Y10T137/6991 , Y10T137/794 , Y10T137/8013 , Y10T137/86035
摘要： A temporary drainage system for draining rain water that flows into a floor under construction to an outside of a building during construction of a multiple-story building includes: a flexible drainage collection hose connected to a penetration hole formed in a floor slab of the floor under construction; a sand-settling vessel provided on a floor slab of a constructed floor of the building and connected to the drainage collection hose; a drainage pit provided on a lowest floor of the building to store drainage water discharged from the sand-settling vessel through a drainage hose; and a drainage pump provided in the drainage pit. The drainage water collected into the drainage pit is discharged to the outside of the building by an operation of the drainage pump.
摘要翻译：在建造多层建筑物时，将在建筑物内流入建筑物内的雨水排入雨水的临时排水系统包括：一个柔性排水收集软管，连接到形成在地板底板上的穿透孔施工; 设置在建筑物的建筑地板的楼板上并连接到排水收集软管的沉降容器; 设置在建筑物最低层的排水坑，以通过排水软管储存从沉降池排出的排水; 以及设置在排水坑内的排水泵。通过排水泵的操作将收集入排水坑的排水排放到建筑物的外部。

4. 发明授权

US06645632B2 Film-type adhesive for electronic components, and electronic components bonded therewith 有权
标题翻译：用于电子部件的膜型粘合剂和与其粘合的电子部件
公开(公告)号：US06645632B2
公开(公告)日：2003-11-11
申请号：US09808186
申请日：2001-03-15
申请人： Tsuyoshi Honda , Nobuhiro Ichiroku , Toshio Shiobara
发明人： Tsuyoshi Honda , Nobuhiro Ichiroku , Toshio Shiobara
IPC分类号： B32B2728
CPC分类号： H01L24/28 , C08L63/00 , C08L79/08 , C09J163/00 , C09J179/08 , H01L23/49513 , H01L24/31 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , H01L2924/00 , H01L2924/3512
摘要： A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.
摘要翻译：用于电子部件的膜型粘合剂包括由特定重复单元构成的聚酰亚胺树脂，其重均分子量为5,000-150,000，与每分子具有至少两个缩水甘油基的环氧树脂组合。粘合剂的聚酰亚胺树脂与环氧树脂的重量比在50/50至5/95的范围内，膜厚度为20-150μm。这种膜型粘合剂使得可以简化和缩短具有各种类型的被粘物表面的电子部件的组装操作的持续时间。

5. 发明申请

US20110247711A1 GAS SHUTOFF DEVICE 有权
标题翻译：气体开关装置
公开(公告)号：US20110247711A1
公开(公告)日：2011-10-13
申请号：US13140375
申请日：2009-12-16
申请人： Tsuyoshi Honda , Takuhisa Ootani , Kouji Murase
发明人： Tsuyoshi Honda , Takuhisa Ootani , Kouji Murase
IPC分类号： F16K31/48
CPC分类号： F23N1/002 , F23N5/242 , Y10T137/7726 , Y10T137/7734 , Y10T137/7761 , Y10T137/86389 , Y10T137/86397
摘要： With a gas shutoff device in the related art, a non-uniform gas layer can be produced by mixing of a gas of a different type from the gas currently in use during a shift in the amount of heat or installation or replacement, and an unexpected flow rate may be detected due to a disruption in the propagation of ultrasonic waves, thereby causing an erroneous determination of a flow rate abnormality or a sensor abnormality. With the gas shutoff device according to the invention, a valve-closing timer section 14 starts to time based on a valve-closing signal which is output by the flow rate abnormality or the sensor abnormality, and outputs a valve-opening signal to a valve driving section 12 if a release input is accepted from outside within a setting time period. Thus, even when the non-uniform gas layer is produced by mixing the gas of a different type from the gas currently in use during the shift in the amount of heat or installation or replacement, an unexpected flow rate is detected due to the disruption in the propagation of ultrasonic waves, thereby causing the erroneous determination of the flow rate abnormality or the sensor abnormality, and the valve is closed, the erroneous determination is resolved and the gas is available again within a given time period.
摘要翻译：利用现有技术中的燃气切断装置，可以通过在热量或安装或更换的换挡期间将不同类型的气体与当前使用的气体混合而产生不均匀的气体层，可以由于超声波的传播中断而检测出流量，从而导致流量异常或传感器异常的错误判定。利用根据本发明的燃气切断装置，基于由流量异常或传感器异常输出的关闭信号，关闭计时器部14开始时间，并将阀开启信号输出到阀如果在设定时间段内从外部接受释放输入，则驱动部分12。因此，即使当通过在热量或安装或更换的换挡期间将不同类型的气体与当前正在使用的气体混合来生产非均匀气体层时，由于中断而检测到意外的流量超声波的传播，从而导致流量异常或传感器异常的错误判定，并且阀关闭，错误判定被解决，并且气体在给定时间段内再次可用。

6. 发明申请

US20110077874A1 APPLIANCE MONITORING APPARATUS 审中-公开
标题翻译：电器监控装置
公开(公告)号：US20110077874A1
公开(公告)日：2011-03-31
申请号：US12993667
申请日：2009-02-27
申请人： Tsuyoshi Honda , Hiroshi Takechi , Kouji Murase , Kenji Yasuda , Mitsuo Namba , Kazuo Kubo , Hisashi Saito
发明人： Tsuyoshi Honda , Hiroshi Takechi , Kouji Murase , Kenji Yasuda , Mitsuo Namba , Kazuo Kubo , Hisashi Saito
IPC分类号： G06F19/00
CPC分类号： F23N5/003 , F23N2025/00 , F23N2900/05002
摘要： A conventional appliance monitoring apparatus handles only the amount of gas used and security information for the case of a gas cutoff and can not address social needs for a desire to obtain information about influence (e.g., an amount of CO2 emission) of use of the gas combustion appliance on a terrestrial environment.A CO2 emission calculation unit 4 calculates an amount of CO2 emission based on a gas appliance used by a client output from an appliance determination unit 2, a gas flow signal thereof, and CO2 emission data pertaining to the gas appliance stored in a CO2 emission data storage unit 3. Thus, it is possible to determine the amount of CO2 emission produced by using the gas appliance by the client.
摘要翻译：传统的电器监控设备仅处理气体使用量和安全信息，并且不能满足社会需求以获得有关使用气体的影响（例如，二氧化碳排放量）的信息燃烧器具在陆地环境中。二氧化碳排放量计算单元4基于从用具判定单元2输出的客户使用的燃气器具，其气体流量信号和与CO2排放数据中存储的燃气器具相关的二氧化碳排放数据，计算二氧化碳排出量存储单元3.因此，可以确定由客户使用燃气器具产生的二氧化碳排放量。

7. 发明申请

US20090133833A1 Epoxy Resin Composition and Die Bonding Material Comprising the Composition 审中-公开
标题翻译：包含组合物的环氧树脂组合物和模片接合材料
公开(公告)号：US20090133833A1
公开(公告)日：2009-05-28
申请号：US11991136
申请日：2006-08-23
申请人： Tsuyoshi Honda , Hiroyuki Takenaka
发明人： Tsuyoshi Honda , Hiroyuki Takenaka
IPC分类号： C09J163/00 , C08L63/00 , C08L67/06 , C08L71/00 , C08L83/05
CPC分类号： H01L24/83 , C08G59/621 , C08L33/06 , C08L63/00 , C08L2205/22 , H01L23/293 , H01L24/29 , H01L24/45 , H01L24/85 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/45144 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/3641 , C08L2666/02 , H01L2924/00 , H01L2924/3512 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0503 , H01L2924/05032 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/48 , H01L2224/05599
摘要： A composition comprising (A) an epoxy resin, (B) an epoxy resin curing agent in such an amount that an equivalent ratio of a functional group of the epoxy resin curing agent (B) to the epoxy group of the epoxy resin (A) ranges from 0.8 to 1.25, (C) thermoplastic resin particles which are solid at 25° C. in an amount of from 3 to 60 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B), and (D) an epoxy resin curing promoter in an amount of from 0.1 to 10 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B). The composition is stable in B-stage and forms a curing product with no void.
摘要翻译：一种组合物，其包含（A）环氧树脂，（B）环氧树脂固化剂，其量使得环氧树脂固化剂（B）的官能团与环氧树脂（A）的环氧基的当量比的范围为0.8〜1.25，（C）在25℃下为固体的热塑性树脂粒子，相对于100重量份环氧树脂（A）和环氧树脂固化剂为100重量份，为3〜60重量份（B）和（D）环氧树脂固化促进剂，相对于100重量份的环氧树脂（A）和环氧树脂固化剂（B），为0.1〜10重量份。组合物在B阶段稳定，形成无空隙的固化产物。

8. 发明授权

US06627328B2 Light-transmissive epoxy resin composition and semiconductor device 有权
标题翻译：透光环氧树脂组合物和半导体器件
公开(公告)号：US06627328B2
公开(公告)日：2003-09-30
申请号：US09950737
申请日：2001-09-13
申请人： Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
发明人： Tatsuya Kanamaru , Tsuyoshi Honda , Eiichi Asano , Toshio Shiobara
IPC分类号： H01L2912
CPC分类号： C08L63/00 , Y10T428/12528 , Y10T428/31511
摘要： An epoxy resin composition comprising (A) an epoxy resin, (B) a curing accelerator, and (C) an inorganic filler is light transmissive when it satisfies formulae (1) and (2): [{2(nA2+nC2)−(nA+nC)2}/2]½
摘要翻译：包含（A）环氧树脂，（B）固化促进剂和（C）无机填料的环氧树脂组合物当满足式（1）和（2）时是透光的：其中nA是在T1° 固化的未填充组合物的c为n C为无机填料的T1℃的折射率，fA为固化的未填充组合物的折射率的温度系数，f C为折射率的温度系数无机填料。固化的组合物在宽温度范围内具有改善的耐热性，耐湿性和低应力以及高透明度。该组合物适用于光学半导体器件的密封。

9. 发明授权

US08110066B2 Adhesive composition suitable to be applied by screen printing 有权
标题翻译：适用于丝网印刷的粘合剂组合物
公开(公告)号：US08110066B2
公开(公告)日：2012-02-07
申请号：US12213003
申请日：2008-06-12
申请人： Tatsuya Kanamaru , Tsuyoshi Honda
发明人： Tatsuya Kanamaru , Tsuyoshi Honda
IPC分类号： B65C9/25 , C09J5/00 , C04B37/00 , B60C1/00 , C08K5/24 , C08G65/48 , C08L51/00
CPC分类号： C09J163/00 , C08K3/013 , C08L83/04 , C08L2666/54 , H01L2224/274 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/83885 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 μm. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.
摘要翻译：一种粘合剂组合物，其包含（A）环氧树脂，（B）固化剂，（C）固化促进剂，（D）无机填料，（E）在25℃下为固体的热塑性树脂颗粒，和（F）通过激光光衍射法测定的累积50％（d50）的粒径为1〜50μm的硅酮粉末。该组合物特别适用于通过丝网印刷施加在基底或硅晶片上。

10. 发明授权

US07901992B2 Die bonding agent and a semiconductor device made by using the same 有权
标题翻译：芯片粘合剂和使用该半导体器件的半导体器件
公开(公告)号：US07901992B2
公开(公告)日：2011-03-08
申请号：US12081992
申请日：2008-04-24
申请人： Tsuyoshi Honda , Tatsuya Kanemaru
发明人： Tsuyoshi Honda , Tatsuya Kanemaru
IPC分类号： H01L21/00
CPC分类号： H01L23/296 , C08K3/36 , C08K5/55 , C08L2666/54 , C09J163/00 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73203 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2924/05432 , H01L2924/05341 , H01L2924/0503 , H01L2924/05032 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A die bonding agent comprising (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, the die bonding agent having a viscosity ratio, V1/V2, ranging (i) from 1.5 to 4 at a temperature of from room temperature to 50° C., and (ii) from 0.5 to less than 1.5 at a temperature at which the die bonding agent hardens in 0.5 hour to 1.5 hours, the viscosities being measured in 10 minutes after the die bonding agent is placed on a sample stage of a Brook Field viscometer, wherein V1 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 0.5 rpm and V2 is a viscosity measured by stirring 0.5 ml of the die bonding agent with a No. 51 spindle at 5 rpm in the Brook Field viscometer.
摘要翻译：一种芯片粘合剂，其包含（A）环氧树脂，（B）固化剂和（C）无机填料，所述芯片粘合剂的粘度比为V1 / V2，范围（i）为1.5〜温度为室温至50℃，和（ii）在0.5〜1.5小时内，在粘合剂硬化的温度下，0.5〜小于1.5，粘合剂在10分钟后测定粘度放置在Brookfield粘度计的样品台上，其中V1是通过以0.5rpm搅拌0.5号锭子的0.5ml模头粘合剂测量的粘度，V2是通过搅拌0.5ml模头粘合在Brookfield粘度计中以5rpm的速度转动51号轴。

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