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1. 发明授权

US08921711B2 Wiring substrate and electronic device 有权
标题翻译：接线基板和电子设备
公开(公告)号：US08921711B2
公开(公告)日：2014-12-30
申请号：US13813629
申请日：2011-07-07
申请人： Hisashi Ishida
发明人： Hisashi Ishida
IPC分类号： H05K9/00 , H05K1/02
CPC分类号： H05K9/00 , H05K1/0236 , H05K2201/0715
摘要： Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).
摘要翻译：抑制来自布线基板的电磁噪声的泄漏。布线基板（1）包括多层布线层，导体的结构（8）和电磁波吸收体（5）。作为电磁噪声产生源的一例的电子部件（2）安装在布线基板（1）上。电子部件（2）具有高频电路。结构（8）使用多层布线层形成，并且被布置成在平面图中将电子部件（2）与壳体中的开口（4）封闭。电磁波吸收体（5）配置成覆盖开口（4）。

2. 发明申请

US20130126227A1 WIRING SUBSTRATE AND ELECTRONIC DEVICE 有权
标题翻译：接线基板和电子设备
公开(公告)号：US20130126227A1
公开(公告)日：2013-05-23
申请号：US13813629
申请日：2011-07-07
申请人： Hisashi Ishida
发明人： Hisashi Ishida
IPC分类号： H05K9/00
CPC分类号： H05K9/00 , H05K1/0236 , H05K2201/0715
摘要： Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).
摘要翻译：抑制来自布线基板的电磁噪声的泄漏。布线基板（1）包括多层布线层，导体的结构（8）和电磁波吸收体（5）。作为电磁噪声产生源的一例的电子部件（2）安装在布线基板（1）上。电子部件（2）具有高频电路。结构（8）使用多层布线层形成，并且被布置成在平面图中将电子部件（2）与壳体中的开口（4）封闭。电磁波吸收体（5）配置成覆盖开口（4）。

3. 发明申请

US20090121566A1 BRUSHLESS MOTOR 审中-公开
标题翻译：无刷电机
公开(公告)号：US20090121566A1
公开(公告)日：2009-05-14
申请号：US12264364
申请日：2008-11-04
申请人： Masaki ISHIZEKI , Hisashi Ishida , Susumu Miyazaki , Kazushi Hamaya
发明人： Masaki ISHIZEKI , Hisashi Ishida , Susumu Miyazaki , Kazushi Hamaya
IPC分类号： H02K11/00
CPC分类号： H02K5/225 , H02K1/148 , H02K3/522 , H02K2203/09
摘要： The brushless motor is provided with: a tubular stator case; a stator core; a rotor; a plurality of teeth which extend radially inward and are integrally formed on an inner peripheral surface of the stator core; a coil bobbin which is mounted between the mutually adjacent teeth; a lead wire which feed power to the coil; and a wiring substrate which relays a connection between the lead wire and the coil, wherein: the coil bobbin has flange portions which protrude outward from peripheral edges of the both ends of the coil bobbin; one of the flange portions of the coil bobbin has an enlarged member which protrudes outward from the surface of the flange portion; the enlarged member has a guide portion which holds the winding end of the coil; and the wiring substrate is connected the coil bobbin while contacting therewith in an axial direction of the stator core.
摘要翻译：无刷电机设有：管状定子箱; 定子铁心; 转子多个齿径向向内延伸并整体地形成在定子芯的内周面上; 安装在相互相邻的齿之间的线圈架; 向线圈供电的引线; 以及中继所述引线与所述线圈之间的连接的布线基板，其中，所述线圈架具有从所述线圈架的两端的周缘向外突出的凸缘部，线圈骨架的一个凸缘部分具有从凸缘部分的表面向外突出的扩大部件; 所述扩大构件具有保持所述线圈的绕组端的引导部; 并且所述布线基板在所述定子铁芯的轴向与所述线圈架线相接触的状态下连接。

4. 发明申请

US20070081308A1 Computer system 有权
标题翻译：电脑系统
公开(公告)号：US20070081308A1
公开(公告)日：2007-04-12
申请号：US11542837
申请日：2006-10-04
申请人： Hisashi Ishida
发明人： Hisashi Ishida
IPC分类号： H05K5/00
CPC分类号： H05K7/1492
摘要： A computer system includes a rack, a computer module and an interface-dedicated module to be mounted therein, and an intra-rack management module. The rack has a rear panel for power supply to and signal connection among modules, and the modules permit plug-in mounting onto the rear panel of the rack. The computer module has behind the computer a dedicated adapter which makes possible plug-in mounting of the computer onto the rack and coordinates signals between the computer and the rear panel.
摘要翻译：计算机系统包括机架，计算机模块和要安装在其中的接口专用模块，以及机架内管理模块。机架具有后面板，用于模块之间的电源和信号连接，并且模块允许将插件安装到机架的后面板上。计算机模块在计算机后面有一个专用适配器，可以将计算机插入机架并将计算机与后面板之间的信号进行协调。

5. 发明授权

US06241539B1 Connector driving apparatus for driving a plurality of connectors relatively to a plurality of mating connectors 有权
标题翻译：用于相对于多个配合连接器驱动多个连接器的连接器驱动装置
公开(公告)号：US06241539B1
公开(公告)日：2001-06-05
申请号：US09251023
申请日：1999-02-18
申请人： Kazuomi Sato , Hisashi Ishida
发明人： Kazuomi Sato , Hisashi Ishida
IPC分类号： H01R1362
CPC分类号： H01R13/193
摘要： In order to drive connectors relatively to mating connectors in a housing for connection and disconnection of the connectors with the mating connectors, the connectors have projections thereon which projects outside of the housing when received in the housing, and a slider is slidably mounted on the housing and having a groove with a cam portion for receiving the projection. When the slider is pulled or pushed, the projection is driven by the cam portion of the groove to drive the connectors. Partitions are mounted in the housing to partition an inner space of the housing into a plurality of rooms for accommodating the connectors so as to separate between adjacent connectors by the partition. Each of the partition has engaging projections engaged with engaging holes formed in the housing wall. One of the engaging holes is registry with the groove of the slider so that the corresponding one of the engaging projection is also received in the groove at the projecting end through the engaging hole. The slider is also provided with a slot for receiving the other engaging projection projecting through the other corresponding engaging hole. Thus, the slider, if it is made with small size, has a desired mechanical strength and can be smoothly moved.
摘要翻译：为了驱动连接器相对于壳体中的配合连接器驱动连接器与配合连接器的连接和断开，连接器具有突出部，其在容纳在壳体中时突出到壳体外部，并且滑块可滑动地安装在壳体并且具有带有用于接收突起的凸轮部分的凹槽。当拉动或推动滑块时，突起由凹槽的凸轮部分驱动以驱动连接器。分隔件安装在壳体中以将壳体的内部空间分隔成多个房间，用于容纳连接器，以便通过隔板在相邻的连接器之间分离。每个隔板具有与形成在壳体壁中的接合孔接合的接合突起。一个接合孔与滑块的凹槽对准，使得接合突起中的相应一个也通过接合孔容纳在突出端的凹槽中。滑块还设置有用于接收突出穿过另一个相应的接合孔的另一接合突起的槽。因此，如果滑块由小尺寸制成，则具有期望的机械强度并且可以平稳地移动。

6. 发明授权

US06227894B1 Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the like 失效
标题翻译：插入和取出连接器装置，其远程控制接合和分离的结构以及用于插入和取出连接器装置等的连接框架结构
公开(公告)号：US06227894B1
公开(公告)日：2001-05-08
申请号：US09589677
申请日：2000-06-07
申请人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
发明人： Toshihiko Maeda , Yoshinori Mizusawa , Osamu Hashiguchi , Kazuomi Sato , Hisashi Ishida , Hiroyuki Tsuzuki , Masahiro Yamada , Masahiro Yamauchi
IPC分类号： H01R450
CPC分类号： H01R13/518 , B63B22/04 , F16B5/02 , H01R13/6272 , H01R13/62905 , H01R13/64 , H04Q1/023 , H04Q1/14 , Y10S439/953 , Y10S439/954
摘要： There is provided an insertion and withdrawal connector apparatus in which a plurality of connectors can move only in a range of capable of engaging and separating with and from a plurality of mating connectors within a connector receiving body. A connector receiving body (1) has a pair of parallel frames (3), a pair of frame blocks (4) positioned at both end portions, and a plurality of partition members (5). One connector (10) and one mating connector are received in each of a plurality of space portions, that is, receiving chambers partitioned by a pair of frames, a pair of frame blocks, and a plurality of partition members. Each of the partition members has a pair of lances (5f, 5g) having a spring characteristic and each of the connectors has a pair of interlocking groove portions (10g) on both side surfaces. The lance (5f) interlocks with the interlocking groove portion on one of the side surfaces in the connector, and the lance (5g) interlocks with the interlocking groove portion on the other of the side surfaces in the connector. Each of the connectors has a convex portion (10d) at an upper end portion on one of the side surfaces and at a lower end portion on the other of the side surfaces, and each of the convex portions interlocks with each of the partition members.
摘要翻译：提供了插入和取出连接器装置，其中多个连接器只能在能够与连接器接收体内的多个配合连接器接合和分离的范围内移动。连接器接收体（1）具有一对平行框架（3），位于两端部的一对框架块（4）和多个分隔构件（5）。一个连接器（10）和一个配合连接器被接收在多个空间部分中的每一个中，即，由一对框架分隔的接收室，一对框架块和多个分隔构件。每个分隔构件具有一对具有弹簧特性的喷枪（5f，5g），并且每个连接器在两个侧表面上具有一对互锁槽部分（10g）。喷枪（5f）与连接器中的一个侧表面上的互锁槽部互锁，并且喷枪（5g）与连接器中的另一侧面上的互锁槽部互锁。每个连接器在一个侧表面上的上端部和另一个侧表面的下端部处具有凸部（10d），并且每个凸部与每个分隔构件互锁。

7. 发明授权

US5795174A Multi-connector supporting device with connection/disconnection mechanism 失效
标题翻译：具有连接/断开机构的多连接器支撑装置
公开(公告)号：US5795174A
公开(公告)日：1998-08-18
申请号：US623174
申请日：1996-03-28
申请人： Kazuki Saito , Sunao Sekiguchi , Hisashi Ishida
发明人： Kazuki Saito , Sunao Sekiguchi , Hisashi Ishida
IPC分类号： H01R13/518 , H01R13/629 , H01R13/631 , H01R13/62
CPC分类号： H01R13/62905 , H01R13/518 , H01R13/6315
摘要： A multi connector device comprising a plurality of connector pairs of first connectors and second connectors mating therewith, and a multi-connector support housing for accommodating the connector pairs. The multi-connector support housing comprises a support housing defining a plurality of connector accommodating chambers therein which are arranged in order and accommodate the connector pairs therein, respectively. A plurality of pairs of guide engaging portions are formed on the support housing at the connector accommodating chambers and engaging the connector pairs accommodated in the chambers and guiding the connector pairs to move in connecting and disconnecting directions in the chambers, respectively. A slider as a connector driving member is removably assembled onto the support housing to drive the connector pairs in a selected one of the connecting and disconnecting directions. In a specific structure, the support housing comprises two housing members which are removably jointed together to form the support housing and accommodate the first connectors and the second connectors, respectively.
摘要翻译：一种多连接器装置，包括多个连接器对的第一连接器和与其配合的第二连接器，以及用于容纳连接器对的多连接器支撑壳体。多连接器支撑壳体包括限定其中的多个连接器容纳室的支撑壳体，它们分别依次布置并容纳其中的连接器对。在连接器容纳室处的支撑壳体上形成有多对引导接合部分，并且与容纳在腔室中的连接器对接合并分别引导连接器对在腔室中的连接和断开方向上移动。作为连接器驱动构件的滑块可移除地组装到支撑壳体上以沿连接和断开方向中选定的一个驱动连接器对。在特定结构中，支撑壳体包括两个壳体构件，其可移除地接合在一起以形成支撑壳体并分别容纳第一连接器和第二连接器。

8. 发明授权

US5426849A Method of producing a polyimide multilayer wiring board 失效
标题翻译：聚酰亚胺多层布线板的制造方法
公开(公告)号：US5426849A
公开(公告)日：1995-06-27
申请号：US70923
申请日：1993-07-28
申请人： Kohji Kimbara , Shinichi Hasegawa , Hisashi Ishida
发明人： Kohji Kimbara , Shinichi Hasegawa , Hisashi Ishida
IPC分类号： H01L21/48 , H01L21/68 , H01L23/538 , H05K1/03 , H05K3/00 , H05K3/28 , H05K3/32 , H05K3/40 , H05K3/46 , H01R9/09 , H05K3/36
CPC分类号： H01L21/6835 , H01L21/4857 , H01L23/5383 , H01L23/5385 , H01L23/5387 , H05K3/4614 , H05K3/4629 , H01L2221/68345 , H01L2221/68363 , H01L2924/0002 , H01L2924/01078 , H01L2924/15312 , H01L2924/3011 , H05K1/0306 , H05K2201/0154 , H05K2201/0195 , H05K2201/0305 , H05K2203/0152 , H05K2203/1572 , H05K3/0023 , H05K3/0052 , H05K3/007 , H05K3/28 , H05K3/323 , H05K3/4038 , H05K3/4605 , H05K3/4623 , H05K3/4644 , H05K3/4647 , Y10T29/49126 , Y10T29/49149
摘要： A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.
摘要翻译：通过使用多个层叠块来构成聚酰亚胺多层布线板，每个层叠块具有多个布线层和聚酰亚胺的层间绝缘层。在具有基板的基块上，其它块被放置在另一个块的顶部上，用在每个块中使用的聚酰亚胺或另一粘合剂彼此粘合，并且通过使用例如形成在每个块上的金属凸块彼此电连接。除了基块之外的每个块形成在临时基板上，并且在将每个块结合到基块或先前结合的块之后，移除临时基板。可以在缩短的时间内以提高的产量制造该多层布线基板。

9. 发明授权

US09313877B2 Electronic device and noise suppression method 有权
标题翻译：电子设备和噪声抑制方法
公开(公告)号：US09313877B2
公开(公告)日：2016-04-12
申请号：US13508974
申请日：2010-10-20
申请人： Hisashi Ishida
发明人： Hisashi Ishida
IPC分类号： H05K1/11 , H05K1/02 , H05K1/14
CPC分类号： H05K1/0236 , H05K1/0233 , H05K1/141 , H05K2201/09727 , H05K2201/10265 , H05K2201/10704 , H05K2201/10734 , Y10T29/49155
摘要： A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure.
摘要翻译：第一互连基板包括第一导体图案。第二互连基板包括第二导体图案。第二导体图案的至少一部分形成在与第一导体图案相对的区域中。第一导体图案或第二导体图案中的至少一个具有重复的结构。第一导体图案和第二导体图案构成电磁带隙（EBG）结构的至少一部分。

10. 发明申请

US20120217653A1 SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD 审中-公开
标题翻译：半导体器件和噪声抑制方法
公开(公告)号：US20120217653A1
公开(公告)日：2012-08-30
申请号：US13508073
申请日：2010-09-01
申请人： Koichi Takemura , Hisashi Ishida
发明人： Koichi Takemura , Hisashi Ishida
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/48 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/552 , H01L24/16 , H01L24/17 , H01L24/32 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2225/06513 , H01L2225/06517 , H01L2225/06531 , H01L2225/06537 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01033 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2224/05552 , H01L2924/00
摘要： A first semiconductor chip (200) is mounted on a second semiconductor chip (100). The first semiconductor chip (200) has a first conductor pattern (222). The second semiconductor chip (100) has a second conductor pattern (122). The second conductor pattern (122) is formed at a region overlapping the first conductor pattern (222) in a plan view. At least one element selected from a group consisting of the first conductor pattern (222) and the second conductor pattern (122) has a repetitive structure.
摘要翻译：第一半导体芯片（200）安装在第二半导体芯片（100）上。第一半导体芯片（200）具有第一导体图案（222）。第二半导体芯片（100）具有第二导体图案（122）。第二导体图案（122）形成在与俯视图中的第一导体图案（222）重叠的区域。选自由第一导体图案（222）和第二导体图案（122）组成的组中的至少一个元件具有重复结构。

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