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1. 发明授权

US06319749B1 Lead frame, semiconductor package having the same and method for manufacturing the same 失效
标题翻译：引线框架，半导体封装与其制造方法相同
公开(公告)号：US06319749B1
公开(公告)日：2001-11-20
申请号：US09562750
申请日：2000-05-02
申请人： Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
发明人： Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
IPC分类号： H01L2144
CPC分类号： H01L23/3107 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15184 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
摘要翻译：在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架例如，通过形成环代替外引线形成。通过将引线框架安装在半导体芯片上来形成半导体封装。

2. 发明授权

US6107678A Lead frame and semiconductor package having a lead frame 失效
标题翻译：引线框架和具有引线框架的半导体封装
公开(公告)号：US6107678A
公开(公告)日：2000-08-22
申请号：US909814
申请日：1997-08-12
申请人： Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
发明人： Hiroyuki Shigeta , Kenji Osawa , Kazuhiro Sato , Haruhiko Makino , Makoto Ito
IPC分类号： H01L23/31 , H01L23/48 , H01L23/495 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3107 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15184 , H01L2924/181
摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portiones. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.
摘要翻译：在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架例如，通过形成环代替外引线形成。通过将引线框架安装在半导体芯片上来形成半导体封装。

3. 发明授权

US06492199B2 Method of manufacturing a semiconductor package with improved cross talk and grounding 失效
标题翻译：制造具有改进的串扰和接地的半导体封装的方法
公开(公告)号：US06492199B2
公开(公告)日：2002-12-10
申请号：US09773653
申请日：2001-01-31
申请人： Kenji Osawa , Kazuhiro Sato , Makoto Ito
发明人： Kenji Osawa , Kazuhiro Sato , Makoto Ito
IPC分类号： H01L2148
CPC分类号： H01L23/24 , H01L23/495 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.
摘要翻译：一种制造半导体芯片的方法，该半导体芯片在芯片前表面上具有设置在导电外圈内部的电极焊盘。薄片电路设置在芯片正面侧。在薄膜电路上形成外部连接热量，从而在其上突出。第一引线将电极焊盘的一部分电连接到外部连接端子的一部分。第二引线将接地或电源电极焊盘电连接到外环，而第三引线将接地或电源外部连接端子电连接到外环。

4. 发明授权

US06700184B1 Lead frame and semiconductor device having the same 失效
标题翻译：引线框架和具有相同的半导体器件
公开(公告)号：US06700184B1
公开(公告)日：2004-03-02
申请号：US09009248
申请日：1998-01-20
申请人： Kenji Osawa , Haruhiko Makino
发明人： Kenji Osawa , Haruhiko Makino
IPC分类号： H01L23495
CPC分类号： H01L24/50 , H01L23/3114 , H01L23/3142 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48472 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12044 , H01L2924/15184 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： There is provided a semiconductor device and a lead frame that form a stable external ring structure wherein bonding strength and mechanical strength between the external ring and sealing resin is improved. A semiconductor device (1) is formed which comprises a semiconductor chip (2) having a plurality of electrode pads (3) formed at the periphery of a front surface thereof, a wiring film (5) located and formed on the front surface side of the semiconductor chip (2) by laminating an insulation film (7) on a lead pattern (6), outer connection terminals (8) formed so as to protrude above the wiring film (5), a plurality of leads (9) extending form the wiring film (5) and connected to the electrode pads (3) on the semiconductor chip (2) at extended tip ends thereof, an external ring (11) provided so as to surround the semiconductor chip (2) and formed with a plurality of through holes or blind holes (15), and a sealing resin (12) filled between the semiconductor chip (2) and the external ring (11).
摘要翻译：提供形成稳定的外环结构的半导体器件和引线框架，其中提高了外环和密封树脂之间的结合强度和机械强度。形成半导体器件（1），其包括：半导体芯片（2），其具有形成在其前表面周围的多个电极焊盘（3）;布线膜（5），位于并形成在其前表面半导体芯片（2）通过在引线图案（6）上层叠绝缘膜（7），形成为突出在布线膜（5）上方的外部连接端子（8），多个引线（9）延伸形成布线膜（5），并且在其延伸的末端与半导体芯片（2）上的电极焊盘（3）连接，设置为围绕半导体芯片（2）并形成多个的外部环（11）的通孔或盲孔（15）以及填充在半导体芯片（2）和外部环（11）之间的密封树脂（12）。

5. 发明授权

US6153925A Film circuit 失效
标题翻译：电影电路
公开(公告)号：US6153925A
公开(公告)日：2000-11-28
申请号：US48550
申请日：1998-03-26
申请人： Kazuhiro Sato , Kenji Osawa
发明人： Kazuhiro Sato , Kenji Osawa
IPC分类号： H01L21/60 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/498
CPC分类号： H01L23/3107 , H01L23/495 , H01L23/4985 , H01L24/50 , Y10S438/977
摘要： A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
摘要翻译：围绕通过电极的电连接到互连部分的半导体元件的加强环通过悬挂部分设置为一体。通过使用例如通过使用三层以上的层叠体作为基底的引线框架成形技术来形成环来代替外部引线来制造膜电路，在一侧形成内部引线引线由另一侧的表面层形成。以这种方式，在由绝缘膜和在绝缘膜的至少一个主平面上电连接电极和半导体元件的其他电子部件的多个互连部分（引线）的薄膜电路中，仅通过将薄膜电路放置在半导体元件上而相对于半导体元件对准半导体元件周围的环，并且依次降低半导体器件的组装要求。

6. 发明授权

US5843810A Film circuit and method of manufacturing the same 失效
标题翻译：薄膜电路及其制造方法
公开(公告)号：US5843810A
公开(公告)日：1998-12-01
申请号：US794203
申请日：1997-01-31
申请人： Kazuhiro Sato , Kenji Osawa
发明人： Kazuhiro Sato , Kenji Osawa
IPC分类号： H01L21/60 , H01L23/12 , H01L23/31 , H01L23/495 , H01L23/498 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3107 , H01L23/495 , H01L23/4985 , H01L24/50 , Y10S438/977
摘要： A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
摘要翻译：围绕通过电极的电连接到互连部分的半导体元件的加强环通过悬挂部分设置为一体。通过使用例如通过使用三层以上的层叠体作为基底的引线框架成形技术来形成环来代替外部引线来制造膜电路，在一侧形成内部引线引线由另一侧的表面层形成。以这种方式，在由绝缘膜和在绝缘膜的至少一个主平面上电连接电极和半导体元件的其他电子部件的多个互连部分（引线）的薄膜电路中，仅通过将薄膜电路放置在半导体元件上而相对于半导体元件对准半导体元件周围的环，并且依次降低半导体器件的组装要求。

7. 发明授权

US6077727A Method for manufacturing lead frame 失效
标题翻译：具有细的铅双层结构的引线框架的制造方法
公开(公告)号：US6077727A
公开(公告)日：2000-06-20
申请号：US786285
申请日：1997-01-22
申请人： Kenji Osawa , Makoto Ito
发明人： Kenji Osawa , Makoto Ito
IPC分类号： H01L21/60 , H01L21/48 , H01L23/495 , H01L23/50 , H01L21/44
CPC分类号： H01L24/50 , H01L21/4828 , H01L23/49572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082
摘要： There is provided a method for manufacturing a lead frame which can easily manufacture a high quality lead frame.A pattern layer is selectively formed on a copper plate and the surface of the substrate having formed this pattern layer is then plated with gold to form a gold layer using the pattern layer as the mask. Next, the gold layer is then plated with copper to form a copper layer, thereby forming a fine lead consisting of two layers of gold layer and copper layer. Thereafter, the pattern layer is selectively removed, an insulated resist film is formed and the copper plate is etched. In this case, the gold layer is used as the etching stop layer. Thereby, the lead frame having the fine lead of double-layer structure can be formed.
摘要翻译：提供一种可以容易地制造高品质引线框的引线框的制造方法。在铜板上选择性地形成图案层，并且使用图案层作为掩模，将形成该图案层的基板的表面镀金以形成金层。接着，用铜镀金层形成铜层，由此形成由两层金层和铜层构成的细小导线。此后，选择性地去除图案层，形成绝缘抗蚀剂膜，并蚀刻铜板。在这种情况下，金层用作蚀刻停止层。由此，可以形成具有双层结构的细导线的引线框架。

8. 发明授权

US09402407B2 Method for preparation of eucalyptus extract 有权
标题翻译：桉树提取物的制备方法
公开(公告)号：US09402407B2
公开(公告)日：2016-08-02
申请号：US12999896
申请日：2009-06-17
申请人： Yuuichi Maeda , Atsushi Narise , Sanae Kikuchi , Kenji Osawa
发明人： Yuuichi Maeda , Atsushi Narise , Sanae Kikuchi , Kenji Osawa
IPC分类号： A61K36/61 , B01D3/00 , C02F1/02 , A23G3/48 , A23G3/34 , A23L1/30 , A61K36/14
CPC分类号： A23G3/48 , A23G3/34 , A23L33/105 , A61K36/14 , A61K36/61
摘要： A method for preparing a Eucalyptus extract which decreases the Eucalyptus-specific odor and obtains the effective ingredient in high purity and high yield as a physiologically-active ingredient. An essential oil constituent is removed from the Eucalyptus plant and the residue is extracted with water or an organic solvent aqueous solution. Next, the obtained extraction residue is further extracted with an organic solvent aqueous solution or an organic solvent, whereby Macrocarpal A, Macrocarpal B, and Macrocarpal C contained in the Eucalyptus as a physiological active substance are prepared in higher content than using conventional methods. Further, the extract has improved good taste, appearance, and other desirable properties.
摘要翻译：一种制备桉树提取物的方法，其降低桉树特异性气味，并获得作为生理活性成分的高纯度和高产率的有效成分。从桉树植物中除去精油成分，残留物用水或有机溶剂水溶液萃取。接下来，用有机溶剂水溶液或有机溶剂进一步提取所得提取残渣，由此制备作为生理活性物质的桉树中的Macrocarpal A，Macrocarpal B和Macrocarpal C的含量高于使用常规方法。此外，提取物具有改善的良好味道，外观和其它期望的性质。

9. 发明申请

US20120253014A1 PREVENTIVE AGENT FOR ATOPIC DERMATITIS 审中-公开
标题翻译：预防性代理人
公开(公告)号：US20120253014A1
公开(公告)日：2012-10-04
申请号：US13514975
申请日：2010-12-07
申请人： Hiroaki Higuchi , Atsushi Narise , Kenji Osawa , Katsumasa Shimizu , Masanori Ito
发明人： Hiroaki Higuchi , Atsushi Narise , Kenji Osawa , Katsumasa Shimizu , Masanori Ito
IPC分类号： C07K14/78
CPC分类号： A61K38/39 , A23L2/66 , A23L29/284 , A23L33/17 , A23V2002/00 , A23V2200/318 , A23V2250/5422
摘要： An object of the present invention is to provide a preventive agent for atopic dermatitis and food products containing the agent. The present inventors conducted extensive studies and, as the result, found that atopic dermatitis can be prevented by orally ingesting collagen. The present invention provides a preventive agent for atopic dermatitis comprising collagen and food products containing the preventive agent for atopic dermatitis.
摘要翻译：本发明的目的是提供特应性皮炎预防剂和含有该药剂的食品。本发明人进行了广泛的研究，结果发现可以通过口服摄取胶原来防止特应性皮炎。本发明提供特应性皮炎预防剂，其包含含有特应性皮炎预防剂的胶原蛋白和食品。

10. 发明申请

US20120015063A1 COMPOSITION FOR TREATMENT AND/OR PREVENTION OF SKIN DISORDER 审中-公开
标题翻译：用于治疗和/或预防皮肤病的组合物
公开(公告)号：US20120015063A1
公开(公告)日：2012-01-19
申请号：US13258579
申请日：2010-03-30
申请人： Hiroaki Higuchi , Reiko Kuroda , Atsushi Narise , Katsumasa Shimizu , Kenji Osawa , Yoshihiro Nomura
发明人： Hiroaki Higuchi , Reiko Kuroda , Atsushi Narise , Katsumasa Shimizu , Kenji Osawa , Yoshihiro Nomura
IPC分类号： A61K36/38 , A61P39/06 , A61P17/02 , A61P17/00
CPC分类号： A61K36/38 , A23L33/105 , A23V2002/00 , A61K8/97 , A61K2800/92 , A61Q19/004 , A61Q19/007 , A61Q19/08 , A23V2200/318 , A23V2250/21
摘要： To provide a composition for treatment and/or prevention of skin disorder, intensive research has been conducted. As a result, a mangosteen (Garcinia mangostana L.) pericarp extract has been found to have a reducing effect on the skin disorder. The present invention provides a composition for treatment and/or prevention of skin disorder, the composition including a mangosteen pericarp extract.
摘要翻译：为了提供治疗和/或预防皮肤病症的组合物，已经进行了深入研究。结果，已经发现山竹（Garcinia mangostana L.）果皮提取物对皮肤病症具有减少的作用。本发明提供了一种治疗和/或预防皮肤病症的组合物，该组合物包括山竹果皮提取物。

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