专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5458687A Method of and apparatus for securing and cooling/heating a wafer 失效
标题翻译：用于固定和冷却/加热晶片的方法和设备
公开(公告)号：US5458687A
公开(公告)日：1995-10-17
申请号：US154078
申请日：1993-11-18
申请人： Hiroyuki Shichida , Naoyuki Tamura , Akitaka Makino
发明人： Hiroyuki Shichida , Naoyuki Tamura , Akitaka Makino
IPC分类号： C23C16/50 , C23C16/458 , C23C16/511 , C23F4/00 , H01J37/02 , H01L21/302 , H01L21/3065 , H01L21/683 , C23C16/00
CPC分类号： H01J37/3244 , C23C16/4586 , H01J37/026 , H01L21/6831 , H01J2237/0203 , H01J2237/2001
摘要： A wafer processing apparatus comprises a vacuum processing chamber, and a wafer holder disposed within the vacuum processing chamber to hold a wafer to be processed fixedly thereon by electrostatic attraction. A cooling or heating gas is supplied into the space between the surface of the wafer holder and the backside of a wafer set on the wafer holder to cool or heat the wafer. In case the electrostatic attraction disappears accidentally due to, for example, power failure, the cooling or heating gas in the space between the surface of the wafer holder and the backside of the wafer set on the wafer holder is discharged quickly upon the disappearance of the electrostatic attraction between the wafer holder and the wafer to prevent the wafer being caused to float and being dislocated by the pressure of the cooling or heating gas existing in the space between the surface of the wafer holder and the backside of the wafer.
摘要翻译：晶片处理装置包括真空处理室和设置在真空处理室内的晶片保持器，以通过静电吸引将待固化的晶片保持在其上。将冷却或加热气体供应到晶片保持器的表面和晶片保持器上设置的晶片的背面之间的空间中以冷却或加热晶片。在静电吸引由于例如电源故障而意外地消失的情况下，在晶片保持器的表面和晶片保持器上设置的晶片的背面之间的空间中的冷却或加热气体在消失时被快速放电晶片保持器和晶片之间的静电吸引，以防止晶片由于存在于晶片保持器的表面和晶片的背面之间的空间中的冷却或加热气体的压力而浮起而脱位。

2. 外观设计

USD557226S1 Electrode cover for a plasma processing apparatus 有权
标题翻译：等离子体处理装置的电极盖
公开(公告)号：USD557226S1
公开(公告)日：2007-12-11
申请号：US29236981
申请日：2005-08-25
申请人： Takeo Uchino , Hiroyuki Shichida , Masakazu Isozaki , Tsunehiko Tsubone , Akitaka Makino
设计人： Takeo Uchino , Hiroyuki Shichida , Masakazu Isozaki , Tsunehiko Tsubone , Akitaka Makino

3. 发明授权

US06544379B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06544379B2
公开(公告)日：2003-04-08
申请号：US09778780
申请日：2001-02-08
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

4. 发明授权

US5580420A Plasma generating method and apparatus and plasma processing method and apparatus 失效
标题翻译：等离子体发生方法及装置及等离子体处理方法及装置
公开(公告)号：US5580420A
公开(公告)日：1996-12-03
申请号：US307272
申请日：1994-09-16
申请人： Katsuya Watanabe , Tetsunori Kaji , Naoyuki Tamura , Kenji Nakata , Hiroyuki Shichida , Seiichi Watanabe , Sadayuki Okudaira , Keizo Suzuki
发明人： Katsuya Watanabe , Tetsunori Kaji , Naoyuki Tamura , Kenji Nakata , Hiroyuki Shichida , Seiichi Watanabe , Sadayuki Okudaira , Keizo Suzuki
IPC分类号： H01J37/32 , H01L21/00
CPC分类号： H01J37/32238 , H01J37/32192 , H01J37/32247 , H01J37/32275 , H01J37/32678
摘要： A microwave penetrating window and a cavity which are substantially equal in diameter to a plasma generating chamber are successively connected to the plasma generating chamber and microwaves are introduced via the cavity into the plasma generating chamber. A processing gas in the plasma generating chamber is converted into a plasma by means of the microwaves introduced into the plasma generating chamber and the microwaves in specific modes are resonated in between a microwave reflective interface with the plasma generated in the plasma generating chamber and the reflective edge face of the cavity. The microwaves in the specific modes are thus formed in the cavity and the energy of the microwaves in the specific modes is increased by resonance. The boosted energy is added to the plasma and the plasma is densified accordingly. Moreover, a plasma excellent in uniformity and stability can be generated by resonating the microwaves in the specific modes in the presence of a uniform electromagnetic field.
摘要翻译：与等离子体发生室直径基本相等的微波穿透窗和空腔连续地连接到等离子体发生室，并且微波经由腔引入等离子体发生室。等离子体发生室中的处理气体通过引入到等离子体发生室中的微波转换为等离子体，并且特定模式中的微波共振在与等离子体发生室中产生的等离子体的微波反射界面和反射空腔的边缘面。因此，特定模式中的微波形成在空腔中，并且特定模式中的微波的能量通过共振增加。将升高的能量加入到等离子体中，并且等离子体相应地致密化。此外，通过在存在均匀电磁场的情况下在特定模式中谐振微波，可以产生均匀性和稳定性优异的等离子体。

5. 发明授权

US06676805B2 Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US06676805B2
公开(公告)日：2004-01-13
申请号：US10107138
申请日：2002-03-28
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
摘要翻译：可以减少背面上的异物的保持基板的方法和系统。基板保持系统包括：在与基板周边相对应的样品台上具有光滑表面的环形防漏表面，在基板周边内的多个接触保持部分，以及用于固定基板的静电吸引装置通过使基板的背面与环状的防漏面和接触保持部接触。基板在环状防漏面与冷却面接触，接触保持部位置于环状防漏面内。衬底的背面和冷却表面在剩余区域的大部分中彼此不接触。

6. 发明授权

US5906684A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5906684A
公开(公告)日：1999-05-25
申请号：US50417
申请日：1998-03-31
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , C23C16/00 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。将基板暴露于环状防漏表面处的冷却表面和位于环形防漏表面内的位置处的接触保持部。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

7. 发明授权

US06645871B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06645871B2
公开(公告)日：2003-11-11
申请号：US10024723
申请日：2001-12-21
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

8. 发明授权

US06610170B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06610170B2
公开(公告)日：2003-08-26
申请号：US10107352
申请日：2002-03-28
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

9. 发明授权

US5961774A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5961774A
公开(公告)日：1999-10-05
申请号：US904623
申请日：1997-08-01
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exosed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物的量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。衬底被放置在环形防漏表面处的冷却表面和放置在环形防漏表面内的位置处的接触保持部分。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

10. 发明授权

US06217705B1 Method of holding substrate and substrate holding system 有权
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US06217705B1
公开(公告)日：2001-04-17
申请号：US09478992
申请日：2000-01-07
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshitumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshitumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member. An electrically conductive material member grounded to a standard electric potential is placed on and in contact with a surface of the electrically insulating material member. Three kinds of members are overlaid and fixed to each other in order of the metallic member having the dielectric film, the electrically insulating material member and the standard electric potential member. A coolant hole penetrates from the standard electric potential member side to the coolant flow passage of the metallic member being formed, at least three through holes penetrating the three kinds of members being formed and movable members linked to a substrate transporting mechanism being inserted in the through holes.
摘要翻译：提供了通过使用静电力将基板保持在基板蚀刻装置中的基板保持系统。还提供一种电绝缘构件，其具有与基板的处理表面大致相同水平面的顶表面，并且具有与形成基板周边的基板的表面相邻的内侧表面。电绝缘构件的内侧表面基本上与基板的被处理表面垂直的方向平行。在具有用于循环冷却剂的流路的金属构件的一个表面上形成电介质膜以控制衬底的温度。电绝缘材料构件放置在金属构件的表面上并与金属构件的表面接触。接地到标准电位的导电材料构件放置在电绝缘材料构件的表面上并与电绝缘材料构件的表面接触。按照具有电介质膜的金属构件，电绝缘材料构件和标准电位构件的顺序将三种构件重叠并固定。冷却剂孔从标准电位部件侧穿过形成的金属部件的冷却剂流路，至少形成贯通形成有三个部件的3个贯通孔，与基板传送机构连结的可动部件插入贯通孔孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式