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1. 发明授权

US06217705B1 Method of holding substrate and substrate holding system 有权
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US06217705B1
公开(公告)日：2001-04-17
申请号：US09478992
申请日：2000-01-07
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshitumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshitumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A substrate holding system is provided for holding a substrate in a substrate etching apparatus by using electrostatic force. An electrical insulating member is also provided having a top surface approximately at the same level as the treated surface of the substrate and having an inner side surface in adjacent relationship with a surface of the substrate forming the periphery of the substrate. The inner side surface of the electrical insulating member faces the periphery of the substrate in substantially parallel relationship with a direction normal to the treated surface of the substrate. A dielectric film is formed on one surface of a metallic member having a flow passage for circulating a coolant to control the temperature of the substrate. An electrically insulating material member is placed on and in contact with a surface of the metallic member. An electrically conductive material member grounded to a standard electric potential is placed on and in contact with a surface of the electrically insulating material member. Three kinds of members are overlaid and fixed to each other in order of the metallic member having the dielectric film, the electrically insulating material member and the standard electric potential member. A coolant hole penetrates from the standard electric potential member side to the coolant flow passage of the metallic member being formed, at least three through holes penetrating the three kinds of members being formed and movable members linked to a substrate transporting mechanism being inserted in the through holes.
摘要翻译：提供了通过使用静电力将基板保持在基板蚀刻装置中的基板保持系统。还提供一种电绝缘构件，其具有与基板的处理表面大致相同水平面的顶表面，并且具有与形成基板周边的基板的表面相邻的内侧表面。电绝缘构件的内侧表面基本上与基板的被处理表面垂直的方向平行。在具有用于循环冷却剂的流路的金属构件的一个表面上形成电介质膜以控制衬底的温度。电绝缘材料构件放置在金属构件的表面上并与金属构件的表面接触。接地到标准电位的导电材料构件放置在电绝缘材料构件的表面上并与电绝缘材料构件的表面接触。按照具有电介质膜的金属构件，电绝缘材料构件和标准电位构件的顺序将三种构件重叠并固定。冷却剂孔从标准电位部件侧穿过形成的金属部件的冷却剂流路，至少形成贯通形成有三个部件的3个贯通孔，与基板传送机构连结的可动部件插入贯通孔孔。

2. 发明授权

US06676805B2 Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US06676805B2
公开(公告)日：2004-01-13
申请号：US10107138
申请日：2002-03-28
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
摘要翻译：可以减少背面上的异物的保持基板的方法和系统。基板保持系统包括：在与基板周边相对应的样品台上具有光滑表面的环形防漏表面，在基板周边内的多个接触保持部分，以及用于固定基板的静电吸引装置通过使基板的背面与环状的防漏面和接触保持部接触。基板在环状防漏面与冷却面接触，接触保持部位置于环状防漏面内。衬底的背面和冷却表面在剩余区域的大部分中彼此不接触。

3. 发明授权

US5906684A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5906684A
公开(公告)日：1999-05-25
申请号：US50417
申请日：1998-03-31
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , C23C16/00 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。将基板暴露于环状防漏表面处的冷却表面和位于环形防漏表面内的位置处的接触保持部。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

4. 发明授权

US06544379B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06544379B2
公开(公告)日：2003-04-08
申请号：US09778780
申请日：2001-02-08
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

5. 发明授权

US5985035A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5985035A
公开(公告)日：1999-11-16
申请号：US109033
申请日：1998-07-02
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , C23C16/00 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物的量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。将基板暴露于环状防漏表面处的冷却表面和位于环形防漏表面内的位置处的接触保持部。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

6. 发明授权

US5792304A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5792304A
公开(公告)日：1998-08-11
申请号：US307238
申请日：1994-09-16
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of a holding substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased, and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。将基板暴露于环状防漏表面处的冷却表面和位于环形防漏表面内的位置处的接触保持部。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

7. 发明授权

US06645871B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06645871B2
公开(公告)日：2003-11-11
申请号：US10024723
申请日：2001-12-21
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

8. 发明授权

US06610170B2 Method of holding substrate and substrate holding system 失效
公开(公告)号：US06610170B2
公开(公告)日：2003-08-26
申请号：US10107352
申请日：2002-03-28
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H05H100
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.

9. 发明授权

US5961774A Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US5961774A
公开(公告)日：1999-10-05
申请号：US904623
申请日：1997-08-01
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , H05H1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： In a method of holding a substrate and a substrate holding system, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exosed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：在保持基板和基板保持系统的方法中，可以减少基板的背面上的异物的量，并且只有少量的异物从安装台传递到基板。为此，基板保持系统具有环形防漏表面，在对应于基板的周边的样品台上提供平滑的支撑表面，多个接触保持部分抵靠在样品台上的基板上，与基板周边相对应的位置和与基板中心相对应的位置，以及静电吸引装置，用于通过使基板的背面与环状的防漏表面接触而固定基板，以及接触保持部。衬底被放置在环形防漏表面处的冷却表面和放置在环形防漏表面内的位置处的接触保持部分。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

10. 发明授权

US06899789B2 Method of holding substrate and substrate holding system 失效
标题翻译：保持基板和基板保持系统的方法
公开(公告)号：US06899789B2
公开(公告)日：2005-05-31
申请号：US10437309
申请日：2003-05-14
申请人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
发明人： Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683 , H05H1/00 , C23C16/00 , C23F1/00
CPC分类号： H01L21/6835 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L2924/3025 , Y10T279/23
摘要： A method and system of holding a substrate to decrease foreign substances on the back surface thereof. The substrate holding system includes a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface thereof to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.
摘要翻译：保持基板以减少其背面上的异物的方法和系统。基板保持系统包括：环状防漏表面，其具有与基板周边对应的试样台上的光滑表面，基板周围的接触保持部分，以及静电吸引装置，用于通过使基板其背面到环状防漏面和接触保持部。基板与环状防漏表面的接触保持部分和环形防漏表面内的位置接触。基板的后表面和冷却表面在剩余区域的大部分中彼此不接触。

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