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    • 2. 发明授权
    • Soldering apparatus
    • 焊接设备
    • US08205783B2
    • 2012-06-26
    • US13083426
    • 2011-04-08
    • Tadayoshi OhtashiroHiroyuki Inoue
    • Tadayoshi OhtashiroHiroyuki Inoue
    • B23K37/00B23K31/02
    • B23K1/0016F27B9/40H05K3/3494H05K2203/163
    • In a reflow soldering apparatus, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the soldering apparatus to issue an alarm at this set time. A control unit thereof calculates a period of time when the alarm issues based on the set warning-issue-time before circuit-board-discharge and the like. After a sensor of entrance side has detected that the circuit board enters into main body of the reflow soldering apparatus, the control unit determines whether or not the starting time of the alarm sound has been elapsed. The control unit controls the information unit to sound the alarm when the control unit determines that the starting time of the warning issue has elapsed.
    • 在回流焊接装置中,当将生产模式从生产模式改变为温度曲线模式时,将警告发布时间设定为电路板到达出口之前的时间点(例如数秒) 焊接装置的主体在此设定时间发出报警。 其控制单元基于电路板放电之前的设定的警告发布时间等来计算报警发生的时间段。 在入口侧的传感器检测到电路板进入回流焊接装置的主体之后,控制单元确定是否已经过去了报警声的开始时间。 当控制单元确定警告发生的开始时间已经过去时,控制单元控制信息单元发出警报。