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    • 9. 发明申请
    • CHARGED PARTICLE MICROSCOPE AND MEASUREMENT IMAGE CORRECTION METHOD THEREOF
    • 充电颗粒显微镜及其测量图像校正方法
    • US20130300854A1
    • 2013-11-14
    • US13981326
    • 2011-11-02
    • Shuangqi DongNorio SatoSusumu Koyama
    • Shuangqi DongNorio SatoSusumu Koyama
    • H04N5/217
    • H04N5/217H01J37/222H01J37/26H01J2237/153
    • A charged particle microscope corrects distortion in an image caused by effects of drift in the sampling stage by measuring the correction reference image in a shorter time than the observation image, making corrections by comparing the shape of the observation image with the shape of the correction reference image, and reducing distortion in the observation images. The reference image for distortion correction is measured at the same position and magnification as when acquiring images for observation. In order to reduce effects from drift, the reference image is at this time measured within a shorter time than the essential observation image. The shape of the observation image is corrected by comparing the shapes of the reference image and observation image, and correcting the shape of the observation image to match the reference image.
    • 带电粒子显微镜通过在比观察图像更短的时间内测量校正参考图像来校正由采样阶段的漂移效应引起的图像中的失真,通过将观察图像的形状与校正基准的形状进行比较来进行校正 图像,减少观察图像的失真。 与获取观察图像时相同的位置和倍率测量用于失真校正的参考图像。 为了减少漂移的影响,此时在比基本观察图像更短的时间内测量参考图像。 通过比较参考图像和观察图像的形状以及校正观察图像的形状以匹配参考图像来校正观察图像的形状。
    • 10. 发明申请
    • SEMICONDUCTOR WAFER TESTING APPARATUS
    • 半导体测试仪器
    • US20110279143A1
    • 2011-11-17
    • US13133970
    • 2009-09-18
    • Tadanobu TobaKatsunori HiranoNorio SatoMasahiro Ohashi
    • Tadanobu TobaKatsunori HiranoNorio SatoMasahiro Ohashi
    • G01R31/26
    • G01B15/00G01R31/307H01L22/12
    • Disclosed is a semiconductor wafer testing apparatus that resolves the following problems which arise when semiconductor wafers become larger: (1) complexity of stage acceleration/deceleration control; (2) throughput reduction; and (3) increased vibration of the stage support platform during the stage inversion operation (deterioration in resolution). In the semiconductor wafer testing apparatus for resolving these problems, a wafer is rotated, an electro beam is irradiated onto the rotating wafer from a scanning electron microscope, and secondary electrons emitted from the wafer are detected. The detected secondary electrons are A/D converted by an image processing unit, realigned by an image data realignment unit, and then image-processed for display. As a result, image information of all dies of a wafer can be acquired without a large amount of movement of the stage in the X and the Y directions.
    • 公开了一种半导体晶片测试装置,其解决了当半导体晶片变大时出现的以下问题:(1)阶段加速/减速控制的复杂性; (2)吞吐量减少; 和(3)在舞台反转操作期间舞台支撑平台的振动增加(分辨率降低)。 在用于解决这些问题的半导体晶片测试装置中,旋转晶片,电子束从扫描电子显微镜照射到旋转晶片上,并且检测从晶片发射的二次电子。 所检测的二次电子被图像处理单元进行A / D转换,由图像数据重新对准单元重新对准,然后进行图像处理以进行显示。 结果,可以获得晶片的所有管芯的图像信息,而不需要在X和Y方向上的台的大量移动。