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1. 发明授权

US5738976A Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein 失效
标题翻译：光固化型有机聚硅氧烷组合物及其中使用的（甲基）丙烯酰氧基的有机聚硅氧烷的制造方法
公开(公告)号：US5738976A
公开(公告)日：1998-04-14
申请号：US617240
申请日：1996-03-18
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
IPC分类号： C08G77/20 , G03F7/075
CPC分类号： G03F7/0757 , C08G77/20
摘要： The composition comprises a (meth)acryloyloxyl group-containing organopolysiloxane having an average molecular weight of 3,000 to 100,000, in terms of polystyrene, and a photosensitizer. Such an organopolysiloxane having an average molecular weight of 3,000 or more is produced by subjecting (meth)acryloyloxypropyltrimethoxysilane and phenyltrimethoxysilane to cohydrolysis and subsequent condensation polymerization to produce a cohydrolysis-condensation polymerization product and then reacting and silylating the same product with a silylating agent such as hexamethyldisilazane. The composition containing such a high molecular weight (meth)acryloyloxyl-group-containing organopolysiloxane is excellent in sensitivity, resolution and storage stability and has little tackiness in uncured state after being coated, as well as being excellent in heat resistance after being cured. Thus, the composition is useful for photosensitive heat-resistant materials for use in semiconductor lithography and photosensitive heat-resistant materials for use in semiconductor passivation.
摘要翻译：该组合物包含平均分子量为3,000至100,000（以聚苯乙烯换算）和光敏剂的（甲基）丙烯酰氧基的有机聚硅氧烷。通过使（甲基）丙烯酰氧基丙基三甲氧基硅烷和苯基三甲氧基硅烷进行共水解和随后的缩聚以产生共水解 - 缩聚产物，然后使相同的产物与甲硅烷基化试剂反应和甲硅烷化，从而制备平均分子量为3,000以上的有机聚硅氧烷，六甲基二硅氮烷。含有这种高分子量（甲基）丙烯酰氧基的有机聚硅氧烷的组合物的灵敏度，分辨率和储存稳定性优异，并且在涂布后的未固化状态下具有很小的粘合性，并且在固化后的耐热性优异。因此，该组合物可用于半导体光刻用的感光耐热材料和用于半导体钝化的感光耐热材料。

2. 发明授权

US5346979A Curable resin, process for making and electronic part protective coating 失效
标题翻译：可固化树脂，制造工艺和电子部件保护涂层
公开(公告)号：US5346979A
公开(公告)日：1994-09-13
申请号：US3398
申请日：1993-01-12
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C07F7/10 , C08G73/10 , C08G77/48 , C08G77/54 , H01B3/46 , C08G77/26
CPC分类号： C08G73/106 , C08G73/101 , C08G73/1039
摘要： A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. ##STR1##
摘要翻译：提供了结构式（1）或（2）的新型可固化聚酰亚胺树脂，其中R1和R2独立地是取代或未取代的一价C1-10烃基，R3是二价C1-10有机基团，X是含四价有机基团芳香族或脂肪族环，Y为二价有机基团，Z为含有芳香环的二价有机基团，W为含有芳环的三价有机基团，m为1〜3的整数，n为可以通过使聚酰亚胺与硅化合物反应来制备。固化树脂与溶剂形成具有低粘度和储存稳定性的溶液，并且在低于300℃的相对低的温度下固化成具有耐热性，机械强度，电性能，耐溶剂性和基材粘附性的涂层。

3. 发明授权

US5314979A Optical fibers and core - forming compositions 失效
标题翻译：光纤和芯成型组合物
公开(公告)号：US5314979A
公开(公告)日：1994-05-24
申请号：US803552
申请日：1991-12-09
申请人： Hiroshige Okinoshima , Shohei Kozakai , Tomiya Abe
发明人： Hiroshige Okinoshima , Shohei Kozakai , Tomiya Abe
IPC分类号： C08L83/04 , G02B1/04 , C08G77/04
CPC分类号： G02B1/046 , C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20
摘要： A composition comprising (A) an organopolysiloxane having a unit of the formula: R.sup.1 SiO.sub.3/2 wherein R.sup.1 is methyl, phenyl or vinyl in its molecule and having at least 0.05 alkenyl groups each directly attached to a silicon atom per silicon atom, (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms each directly attached to a silicon atom per molecule, (C) a platinum catalyst, and (D) an organosilane or organopolysiloxane of the formula: R.sup.2.sub.a (R.sup.3 O).sub.b SiO.sub.(4-a-b)/2 wherein R.sup.2 and R.sup.3 are hydrogen, methyl, phenyl or vinyl maintains good light transmission in cured form when exposed to humidity and is thus suitable for forming cores of optical fibers. Similar benefits are obtained with a composition comprising components (A) and (B), (C') a platinum catalyst and/or a radical polymerization initiator, and (E) a carboxylate.
摘要翻译：（A）具有下式的有机聚硅氧烷：R1SiO3 / 2其中R1是甲基，分子内是苯基或乙烯基并且每个硅原子直接连接到硅原子上的至少0.05个烯基;（B）具有至少2个氢原子的有机氢聚硅氧烷，每个分子直接连接到硅原子，（C）铂催化剂和（D）下式的有机硅烷或有机聚硅氧烷：（R 2 O）（R 3 O）b SiO（4-ab） R2和R3是氢，甲基，苯基或乙烯基在暴露于湿度时，以固化形式保持良好的透光性，因此适合于形成光纤芯。使用包含组分（A）和（B），（C'）铂催化剂和/或自由基聚合引发剂的组合物和（E）羧酸酯获得类似的益处。

4. 发明授权

US5302856A Semiconductor rectifying device and full-wave rectifier fabricated using the same 失效
标题翻译：半导体整流装置及使用其制造的全波整流器
公开(公告)号：US5302856A
公开(公告)日：1994-04-12
申请号：US772871
申请日：1991-10-08
申请人： Kazutoyo Narita , Yoichi Nakashima , Hiroshige Okinoshima , Tadashi Nosaka
发明人： Kazutoyo Narita , Yoichi Nakashima , Hiroshige Okinoshima , Tadashi Nosaka
IPC分类号： H01L25/07 , H01L23/24 , H01L23/29 , H01L23/31 , H01L25/11 , H02K11/04 , H01L23/02
CPC分类号： H01L24/01 , H01L23/24 , H01L23/295 , H01L25/112 , H02K11/046 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/12036 , H01L2924/351
摘要： A semiconductor rectifying device, suitable for installation in vehicles, comprises a cup-shaped metallic container, a semiconductor chip having a pn junction, one of whose main surfaces is bonded to the bottom surface of the container, a lead bonded to the other main surface of the semiconductor chip, and a silicone resin layer containing silica powder, with which layer an exposed portion of the semiconductor chip is covered.
摘要翻译：一种适用于车辆安装的半导体整流装置，包括杯形金属容器，具有pn结的半导体芯片，其一个主表面接合到容器的底面，将引线接合到另一个主表面和含有二氧化硅粉末的有机硅树脂层，半导体芯片的露出部分覆盖该层。

5. 发明授权

US5258487A Polyamido-acid copolymer and its manufacture 失效
标题翻译：聚酰胺酸共聚物及其制造
公开(公告)号：US5258487A
公开(公告)日：1993-11-02
申请号：US739434
申请日：1991-08-02
申请人： Hiroshige Okinoshima , Hiroshi Kanbara
发明人： Hiroshige Okinoshima , Hiroshi Kanbara
IPC分类号： C08G73/10 , C08G77/42 , C08G77/455 , C08G77/48 , C08G69/26
CPC分类号： C08G73/106 , C08G77/455
摘要： The present polyamido-acid copolymer has a polymerization backbone chain represented by the following formula: ##STR1## wherein q represents a bivalent organic group and R represents a tetravalent aromatic group. This copolymer forms a polyimide resin film excellent in adhesion to various inorganic substances and mechanical strength.
摘要翻译：本发明的聚酰胺酸共聚物具有由下式表示的聚合主链：其中q表示二价有机基团，R表示四价芳香族基团。该共聚物形成对各种无机物质的粘附性和机械强度优异的聚酰亚胺树脂膜。

6. 发明授权

US5143948A Semiconductor element protecting compositions 失效
标题翻译：半导体元件保护组合物
公开(公告)号：US5143948A
公开(公告)日：1992-09-01
申请号：US561865
申请日：1990-08-02
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08G73/10 , C08G77/455 , C08K3/36 , C08K5/544 , C08K9/06 , C08L79/08 , C09D179/08 , H01B3/30 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G73/1042 , C08G73/105 , C08G73/106 , C08G77/455 , C08K3/36 , C08L79/08 , H01B3/306 , H01L2924/0002
摘要： A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements.
摘要翻译：通过聚合（A）基本上由10〜50摩尔％的2,2-双（3,4-苯二羧酸酐）全氟丙烷和90〜50摩尔％的1,2,4,5-苯四酸二酐组成的四羧酸二酐组分，类似的酸二酐和（B）基本上由10至80mol％的硅二胺和90至20mol％的醚二胺组成的二胺组分。将聚酰亚胺树脂溶解在有机溶剂中并与细碎的二氧化硅混合以形成可用于保护半导体元件的组合物。

7. 发明授权

US5376733A Precursor composition capable of yielding a polyimidesilicone resin 失效
标题翻译：能够产生聚酰亚胺树脂的前体组合物
公开(公告)号：US5376733A
公开(公告)日：1994-12-27
申请号：US216385
申请日：1994-03-23
申请人： Hiroshige Okinoshima , Hideto Kato , Satoshi Toyoda
发明人： Hiroshige Okinoshima , Hideto Kato , Satoshi Toyoda
IPC分类号： C08G73/10 , C08G77/14 , C08G77/388 , C08G77/455 , C08L79/08 , C08L83/04 , C08L83/06 , C08L83/08
CPC分类号： C08G73/106 , C08G77/455
摘要： A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.
摘要翻译：一种聚酰亚胺树脂前体组合物，其包含以下通式的聚硅氧烷，其中R是具有至多10个碳原子的一价有机基团，R 1表示氢原子或具有至多10个碳原子的一价有机基团，m 是不小于3的整数，和由聚酰胺酸获得的聚酰胺酸或聚酰亚胺。该组合物在短时间内在相对低的温度下固化，以提供具有改进的溶剂和耐热性以及对各种基材的良好粘附性的固化膜。

8. 发明授权

US5081199A Curable silicone composition 失效
标题翻译：可固化硅酮组合物
公开(公告)号：US5081199A
公开(公告)日：1992-01-14
申请号：US441046
申请日：1989-11-24
申请人： Hiroshige Okinoshima
发明人： Hiroshige Okinoshima
IPC分类号： C08L83/07 , C08L83/04 , C08L83/14 , C08L83/16
CPC分类号： C08L83/04 , C08G77/18 , C08G77/20 , C08G77/70
摘要： A curable silicone composition comprising an organosilicon compound (A) having at least two alkynyl groups in its molecule and an organosilicon compound (B) having in its molecule at least two organic groups containing a vinyl group. The composition of this invention is advantageous in that it has a high stability particularly at room temperature, and hence a superior storage stability and workability.
摘要翻译：一种可固化的有机硅组合物，其包含在其分子中具有至少两个炔基的有机硅化合物（A）和在其分子中具有至少两个含有乙烯基的有机基团的有机硅化合物（B）。本发明的组合物的优点在于其具有高的稳定性，特别是在室温下，因此具有优异的储存稳定性和可加工性。

9. 发明授权

US5059705A Butadienyl group-containing siloxane compounds and method of producing the same 失效
标题翻译：含丁二烯基的含硅氧烷化合物及其生产方法
公开(公告)号：US5059705A
公开(公告)日：1991-10-22
申请号：US662038
申请日：1991-02-28
申请人： Hiroshige Okinoshima , Hiroshi Kanbara
发明人： Hiroshige Okinoshima , Hiroshi Kanbara
IPC分类号： C07F7/08 , C08G77/04 , C08G77/20 , C08G77/38
CPC分类号： C08G77/38 , C07F7/0849 , C08G77/045 , C08G77/20
摘要： Siloxane compounds having the following formula [1]: ##STR1## wherein each R is a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 10 carbon atoms, and n is an integer of from 0 to 100. The compounds are extremely high in reactivity and, therefore, useful as an intermediate or modifying agent in the synthesis of silicone resins and other various organic resins.

10. 发明授权

US5051467A Silicone rubber compositions 失效
标题翻译：硅橡胶组合物
公开(公告)号：US5051467A
公开(公告)日：1991-09-24
申请号：US441555
申请日：1989-11-27
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20
摘要： A silicon rubber composition comprising (I) a vinyl-containing diorganopolysiloxane, (II) an organohydrogenpolysiloxane, and (III) platinum or a platinum compound is improved in adhesive bond to various substrates under low-temperature curing conditions by blending (IV) an ester siloxane compound free of a silicon-to-carbon bond and (V) an epoxy-containing polysiloxane compound.
摘要翻译：在低温固化条件下，通过混合（Ⅳ）酯，改善了在（I）含乙烯基的二有机聚硅氧烷，（II）有机氢聚硅氧烷和（Ⅲ）铂或铂化合物）中粘合到各种基材上的硅橡胶组合物不含硅 - 碳键的硅氧烷化合物和（Ⅴ）含环氧基的聚硅氧烷化合物。

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