专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5376733A Precursor composition capable of yielding a polyimidesilicone resin 失效
标题翻译：能够产生聚酰亚胺树脂的前体组合物
公开(公告)号：US5376733A
公开(公告)日：1994-12-27
申请号：US216385
申请日：1994-03-23
申请人： Hiroshige Okinoshima , Hideto Kato , Satoshi Toyoda
发明人： Hiroshige Okinoshima , Hideto Kato , Satoshi Toyoda
IPC分类号： C08G73/10 , C08G77/14 , C08G77/388 , C08G77/455 , C08L79/08 , C08L83/04 , C08L83/06 , C08L83/08
CPC分类号： C08G73/106 , C08G77/455
摘要： A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.
摘要翻译：一种聚酰亚胺树脂前体组合物，其包含以下通式的聚硅氧烷，其中R是具有至多10个碳原子的一价有机基团，R 1表示氢原子或具有至多10个碳原子的一价有机基团，m 是不小于3的整数，和由聚酰胺酸获得的聚酰胺酸或聚酰亚胺。该组合物在短时间内在相对低的温度下固化，以提供具有改进的溶剂和耐热性以及对各种基材的良好粘附性的固化膜。

2. 发明授权

US5346979A Curable resin, process for making and electronic part protective coating 失效
标题翻译：可固化树脂，制造工艺和电子部件保护涂层
公开(公告)号：US5346979A
公开(公告)日：1994-09-13
申请号：US3398
申请日：1993-01-12
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C07F7/10 , C08G73/10 , C08G77/48 , C08G77/54 , H01B3/46 , C08G77/26
CPC分类号： C08G73/106 , C08G73/101 , C08G73/1039
摘要： A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. ##STR1##
摘要翻译：提供了结构式（1）或（2）的新型可固化聚酰亚胺树脂，其中R1和R2独立地是取代或未取代的一价C1-10烃基，R3是二价C1-10有机基团，X是含四价有机基团芳香族或脂肪族环，Y为二价有机基团，Z为含有芳香环的二价有机基团，W为含有芳环的三价有机基团，m为1〜3的整数，n为可以通过使聚酰亚胺与硅化合物反应来制备。固化树脂与溶剂形成具有低粘度和储存稳定性的溶液，并且在低于300℃的相对低的温度下固化成具有耐热性，机械强度，电性能，耐溶剂性和基材粘附性的涂层。

3. 发明授权

US5143948A Semiconductor element protecting compositions 失效
标题翻译：半导体元件保护组合物
公开(公告)号：US5143948A
公开(公告)日：1992-09-01
申请号：US561865
申请日：1990-08-02
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08G73/10 , C08G77/455 , C08K3/36 , C08K5/544 , C08K9/06 , C08L79/08 , C09D179/08 , H01B3/30 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G73/1042 , C08G73/105 , C08G73/106 , C08G77/455 , C08K3/36 , C08L79/08 , H01B3/306 , H01L2924/0002
摘要： A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromellitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is dissolved in an organic solvent and blended with finely divided silica to form a composition which is useful for protecting semiconductor elements.
摘要翻译：通过聚合（A）基本上由10〜50摩尔％的2,2-双（3,4-苯二羧酸酐）全氟丙烷和90〜50摩尔％的1,2,4,5-苯四酸二酐组成的四羧酸二酐组分，类似的酸二酐和（B）基本上由10至80mol％的硅二胺和90至20mol％的醚二胺组成的二胺组分。将聚酰亚胺树脂溶解在有机溶剂中并与细碎的二氧化硅混合以形成可用于保护半导体元件的组合物。

4. 发明授权

US5441845A Photosensitive resin composition comprising a polyimide precursor and a photosensitive diazoquinone 失效
标题翻译：包含聚酰亚胺前体和光敏重氮醌的感光树脂组合物
公开(公告)号：US5441845A
公开(公告)日：1995-08-15
申请号：US197519
申请日：1994-02-16
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： G03F7/022 , C08G73/10 , C08L79/00 , C08L79/08 , G03F7/023 , G03F7/037 , G03F7/038 , G03F7/039 , G03F7/075 , H01L21/027 , H01L21/312 , H01L23/29 , H01L23/31 , H05K3/06 , H05K3/28
CPC分类号： G03F7/0757 , G03F7/0233
摘要： A photosensitive resin composition which is adapted for protecting articles and particularly, electronic parts, therewith comprises a polyimide precursor of the following general formula ##STR1## wherein each X individually represents a tetravalent organic group, each Y individually represents a divalent organic group, R.sup.1, R.sup.2 and R.sup.3 may be the same or different and represent a hydrogen atom or a monovalent organic group having form 1 to 10 carbon atoms, and p, q and m are, respectively, an integer of 1 or over, and a photosensitive diazoquinone compound.
摘要翻译：适用于保护制品，特别是电子部件的感光性树脂组合物包含具有以下通式的聚酰亚胺前体四价有机基团，每个Y各自表示二价有机基团，R 1，R 2和R 3可以是相同或不同，表示氢原子或具有1〜10个碳原子的一价有机基团，p，q和m分别为1以上的整数，和感光性重氮醌化合物。

5. 发明授权

US5292619A Photosensitive polymer composition 失效
标题翻译：光敏聚合物组合物
公开(公告)号：US5292619A
公开(公告)日：1994-03-08
申请号：US853683
申请日：1992-03-17
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08F283/04 , C08K5/21 , C08L79/08 , C09D179/08 , G02F1/1337 , G03F7/027 , G03F7/037 , G03F7/038 , G03F7/075 , H01L21/312 , G03C1/725
CPC分类号： G03F7/0757 , G03F7/037 , G03F7/0387
摘要： A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula (I): ##STR1## wherein x is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula (II): ##STR2## wherein R.sup.1 is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R.sup.2 and R.sup.3 are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.
摘要翻译：一种光敏聚合物组合物，其包含主要包含式（I）的重复单元的聚合物：（*化学结构*）（I）其中x是三价或四价有机基团，Y是二价有机基团，并且n等于1或2，和具有式（II）的脲键的化合物：（*化学结构*）（II）其中R1是具有能够在暴露于二聚体或聚合物时形成二聚体或聚合物的官能团的基团辐射，R2和R3独立地是氢原子或一价有机基团是稳定的并且可用作具有足够光敏性以形成半导体元件表面保护膜的相对厚的涂层。

6. 发明授权

US5041513A Polyimide resin compositions 失效
标题翻译：聚酰亚胺树脂组合物
公开(公告)号：US5041513A
公开(公告)日：1991-08-20
申请号：US531097
申请日：1990-05-31
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08G73/10 , C08G77/455 , C09D5/25 , C09D179/08 , H01B3/30
CPC分类号： C08G73/106 , C08G73/1042 , C08G77/455 , H01B3/306
摘要： A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromelitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is soluble in ordinary organic solvents to form solutions which are readily applicable to substrates, typically providing insulating protective coatings on electronic parts.
摘要翻译：通过聚合（A）基本上由10〜50摩尔％的2,2-双（3,4-苯二羧酸酐）全氟丙烷和90〜50摩尔％的顺丁烯二酸二酐组成的四羧酸二酐组分而制备聚酰亚胺树脂，或类似的酸二酐和（B）基本上由10至80mol％的硅二胺和90至20mol％的醚二胺组成的二胺组分。聚酰亚胺树脂可溶于普通有机溶剂中以形成容易适用于基材的溶液，通常在电子部件上提供绝缘保护涂层。

7. 发明授权

US5272222A Curable resin compositions and electronic part protective coatings 失效
标题翻译：可固化树脂组合物和电子部件保护涂层
公开(公告)号：US5272222A
公开(公告)日：1993-12-21
申请号：US889377
申请日：1992-05-28
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08G73/10 , C08G77/42 , C08G77/455 , C08L79/08 , C08L83/04 , C08L83/10 , H01B3/46 , H01L23/29 , H01L23/31
CPC分类号： H01L23/293 , C08G73/106 , C08G77/455 , C08L79/08 , C08L83/04 , C08L83/10 , H01B3/46 , C08G77/16 , C08G77/18 , H01L2924/0002
摘要： A curable resin composition comprising a mixture or cocondensate of a compound containing imide and alkoxysilyl groups and an organosilane or organopolysiloxane is shelf stable and cures into a film which is improved in heat resistance, mechanical strength, electrical properties, solvent resistance and adhesion to substrates and thus suitable as a protective film on electronic parts.
摘要翻译：包含含有酰亚胺和烷氧基甲硅烷基的化合物和有机硅烷或有机聚硅氧烷的混合物或共缩合物的可固化树脂组合物是稳定的并且固化成耐热性，机械强度，电性能，耐溶剂性和与基材的粘附性的膜，因此适合作为电子部件上的保护膜。

8. 发明授权

US5109058A Curable resin solution compositions, their preparation, and electronic part protective coatings 失效
标题翻译：可固化树脂溶液组合物，其制备和电子部件保护涂料
公开(公告)号：US5109058A
公开(公告)日：1992-04-28
申请号：US739449
申请日：1991-08-02
申请人： Hiroshige Okinoshima , Hideto Kato
发明人： Hiroshige Okinoshima , Hideto Kato
IPC分类号： C08G73/10 , C09D179/08 , H01B3/30 , H01B3/46 , H01L23/29 , H05K3/28
CPC分类号： C09D179/08 , C08G73/106 , H01B3/306 , H01B3/46 , H01L23/293 , H05K3/285 , H01L2924/0002 , H05K2201/09872
摘要： A solution composition of a polyimide resin type curable resin having imide and alkoxysilyl groups is prepared by reacting a polyimide with a silicon compound in an organic solvent. The solution can be cured through relatively mild heating into coatings having enhanced substrate adherence and solvent resistance and thus suitable as protective coatings on electronic parts.
摘要翻译：通过在有机溶剂中使聚酰亚胺与硅化合物反应制备具有酰亚胺和烷氧基甲硅烷基的聚酰亚胺树脂型固化性树脂的溶液组合物。该溶液可以通过相对温和的加热固化成具有增强的基底粘附性和耐溶剂性的涂层，因此适合作为电子部件上的保护涂层。

9. 发明授权

US5738976A Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein 失效
标题翻译：光固化型有机聚硅氧烷组合物及其中使用的（甲基）丙烯酰氧基的有机聚硅氧烷的制造方法
公开(公告)号：US5738976A
公开(公告)日：1998-04-14
申请号：US617240
申请日：1996-03-18
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
IPC分类号： C08G77/20 , G03F7/075
CPC分类号： G03F7/0757 , C08G77/20
摘要： The composition comprises a (meth)acryloyloxyl group-containing organopolysiloxane having an average molecular weight of 3,000 to 100,000, in terms of polystyrene, and a photosensitizer. Such an organopolysiloxane having an average molecular weight of 3,000 or more is produced by subjecting (meth)acryloyloxypropyltrimethoxysilane and phenyltrimethoxysilane to cohydrolysis and subsequent condensation polymerization to produce a cohydrolysis-condensation polymerization product and then reacting and silylating the same product with a silylating agent such as hexamethyldisilazane. The composition containing such a high molecular weight (meth)acryloyloxyl-group-containing organopolysiloxane is excellent in sensitivity, resolution and storage stability and has little tackiness in uncured state after being coated, as well as being excellent in heat resistance after being cured. Thus, the composition is useful for photosensitive heat-resistant materials for use in semiconductor lithography and photosensitive heat-resistant materials for use in semiconductor passivation.
摘要翻译：该组合物包含平均分子量为3,000至100,000（以聚苯乙烯换算）和光敏剂的（甲基）丙烯酰氧基的有机聚硅氧烷。通过使（甲基）丙烯酰氧基丙基三甲氧基硅烷和苯基三甲氧基硅烷进行共水解和随后的缩聚以产生共水解 - 缩聚产物，然后使相同的产物与甲硅烷基化试剂反应和甲硅烷化，从而制备平均分子量为3,000以上的有机聚硅氧烷，六甲基二硅氮烷。含有这种高分子量（甲基）丙烯酰氧基的有机聚硅氧烷的组合物的灵敏度，分辨率和储存稳定性优异，并且在涂布后的未固化状态下具有很小的粘合性，并且在固化后的耐热性优异。因此，该组合物可用于半导体光刻用的感光耐热材料和用于半导体钝化的感光耐热材料。

10. 发明授权

US5314979A Optical fibers and core - forming compositions 失效
标题翻译：光纤和芯成型组合物
公开(公告)号：US5314979A
公开(公告)日：1994-05-24
申请号：US803552
申请日：1991-12-09
申请人： Hiroshige Okinoshima , Shohei Kozakai , Tomiya Abe
发明人： Hiroshige Okinoshima , Shohei Kozakai , Tomiya Abe
IPC分类号： C08L83/04 , G02B1/04 , C08G77/04
CPC分类号： G02B1/046 , C08L83/04 , C08G77/12 , C08G77/16 , C08G77/20
摘要： A composition comprising (A) an organopolysiloxane having a unit of the formula: R.sup.1 SiO.sub.3/2 wherein R.sup.1 is methyl, phenyl or vinyl in its molecule and having at least 0.05 alkenyl groups each directly attached to a silicon atom per silicon atom, (B) an organohydrogenpolysiloxane having at least 2 hydrogen atoms each directly attached to a silicon atom per molecule, (C) a platinum catalyst, and (D) an organosilane or organopolysiloxane of the formula: R.sup.2.sub.a (R.sup.3 O).sub.b SiO.sub.(4-a-b)/2 wherein R.sup.2 and R.sup.3 are hydrogen, methyl, phenyl or vinyl maintains good light transmission in cured form when exposed to humidity and is thus suitable for forming cores of optical fibers. Similar benefits are obtained with a composition comprising components (A) and (B), (C') a platinum catalyst and/or a radical polymerization initiator, and (E) a carboxylate.
摘要翻译：（A）具有下式的有机聚硅氧烷：R1SiO3 / 2其中R1是甲基，分子内是苯基或乙烯基并且每个硅原子直接连接到硅原子上的至少0.05个烯基;（B）具有至少2个氢原子的有机氢聚硅氧烷，每个分子直接连接到硅原子，（C）铂催化剂和（D）下式的有机硅烷或有机聚硅氧烷：（R 2 O）（R 3 O）b SiO（4-ab） R2和R3是氢，甲基，苯基或乙烯基在暴露于湿度时，以固化形式保持良好的透光性，因此适合于形成光纤芯。使用包含组分（A）和（B），（C'）铂催化剂和/或自由基聚合引发剂的组合物和（E）羧酸酯获得类似的益处。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式