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1. 发明授权

US5738976A Photo-curable organopolysiloxane composition and a method for producing a (meth) acryloyloxyl group-containing organopolysiloxane used therein 失效
标题翻译：光固化型有机聚硅氧烷组合物及其中使用的（甲基）丙烯酰氧基的有机聚硅氧烷的制造方法
公开(公告)号：US5738976A
公开(公告)日：1998-04-14
申请号：US617240
申请日：1996-03-18
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
IPC分类号： C08G77/20 , G03F7/075
CPC分类号： G03F7/0757 , C08G77/20
摘要： The composition comprises a (meth)acryloyloxyl group-containing organopolysiloxane having an average molecular weight of 3,000 to 100,000, in terms of polystyrene, and a photosensitizer. Such an organopolysiloxane having an average molecular weight of 3,000 or more is produced by subjecting (meth)acryloyloxypropyltrimethoxysilane and phenyltrimethoxysilane to cohydrolysis and subsequent condensation polymerization to produce a cohydrolysis-condensation polymerization product and then reacting and silylating the same product with a silylating agent such as hexamethyldisilazane. The composition containing such a high molecular weight (meth)acryloyloxyl-group-containing organopolysiloxane is excellent in sensitivity, resolution and storage stability and has little tackiness in uncured state after being coated, as well as being excellent in heat resistance after being cured. Thus, the composition is useful for photosensitive heat-resistant materials for use in semiconductor lithography and photosensitive heat-resistant materials for use in semiconductor passivation.
摘要翻译：该组合物包含平均分子量为3,000至100,000（以聚苯乙烯换算）和光敏剂的（甲基）丙烯酰氧基的有机聚硅氧烷。通过使（甲基）丙烯酰氧基丙基三甲氧基硅烷和苯基三甲氧基硅烷进行共水解和随后的缩聚以产生共水解 - 缩聚产物，然后使相同的产物与甲硅烷基化试剂反应和甲硅烷化，从而制备平均分子量为3,000以上的有机聚硅氧烷，六甲基二硅氮烷。含有这种高分子量（甲基）丙烯酰氧基的有机聚硅氧烷的组合物的灵敏度，分辨率和储存稳定性优异，并且在涂布后的未固化状态下具有很小的粘合性，并且在固化后的耐热性优异。因此，该组合物可用于半导体光刻用的感光耐热材料和用于半导体钝化的感光耐热材料。

2. 发明授权

US5051467A Silicone rubber compositions 失效
标题翻译：硅橡胶组合物
公开(公告)号：US5051467A
公开(公告)日：1991-09-24
申请号：US441555
申请日：1989-11-27
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi
IPC分类号： C08L83/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20
摘要： A silicon rubber composition comprising (I) a vinyl-containing diorganopolysiloxane, (II) an organohydrogenpolysiloxane, and (III) platinum or a platinum compound is improved in adhesive bond to various substrates under low-temperature curing conditions by blending (IV) an ester siloxane compound free of a silicon-to-carbon bond and (V) an epoxy-containing polysiloxane compound.
摘要翻译：在低温固化条件下，通过混合（Ⅳ）酯，改善了在（I）含乙烯基的二有机聚硅氧烷，（II）有机氢聚硅氧烷和（Ⅲ）铂或铂化合物）中粘合到各种基材上的硅橡胶组合物不含硅 - 碳键的硅氧烷化合物和（Ⅴ）含环氧基的聚硅氧烷化合物。

3. 发明授权

US6069201A Zinc oxide-filled addition-curable silicone rubber compositions 有权
标题翻译：氧化锌填充的可加成固化的硅橡胶组合物
公开(公告)号：US6069201A
公开(公告)日：2000-05-30
申请号：US152075
申请日：1998-09-11
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi
IPC分类号： C08K3/22 , C08K9/06 , C08L83/04 , C08J3/22
CPC分类号： C08K9/06 , C08K3/22 , C08L83/04 , C08G77/12 , C08G77/20
摘要： A zinc oxide-filled addition-curable silicone rubber composition comprises (A) a diorganopolysiloxane containing at least two alkenyl groups in its molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to silicon atoms in its molecule, (C) a platinum family metal catalyst, and (D) a zinc oxide powder surface treated with a tetraalkoxy silane and/or a partial hydrolysis-condensation product thereof. The composition can further comprise (E) a high thermal-conductive filler. The composition scarcely generates hydrogen gas during storage so as to have an excellent storage stability and provides a cured product excellent in heat resistance, electrical insulating properties, and adhesion to various metals, semiconductors, etc. while keeping good physical properties as a rubber. Further, the composition is easy to deal with and provides a cured product with a high thermal-conductivity and also excellent mechanical properties without lowering adhesion and requiring redispersia compoundven when filled with a high thermal-conductive filler.
摘要翻译：氧化锌填充的可加成固化的硅橡胶组合物包含（A）在其分子中含有至少两个烯基的二有机聚硅氧烷，（B）含有至少两个与其分子中的硅原子键合的氢原子的有机氢聚硅氧烷，（C）铂族金属催化剂和（D）用四烷氧基硅烷和/或其部分水解缩合产物处理的氧化锌粉末表面。组合物还可以包含（E）高导热填料。该组合物在储存期间几乎不产生氢气，从而具有优异的储存稳定性，并且在保持良好的物理性能的同时，提供耐热性，电绝缘性以及对各种金属，半导体等的粘合性优异的固化产物。此外，组合物易于处理并提供具有高导热性和优异机械性能的固化产物，而不会降低粘合性并且当填充高导热填料时需要再分散化合物。

4. 发明授权

US5166293A Silicone rubber compositions and cured products thereof 失效
标题翻译：硅橡胶组合物及其固化产品
公开(公告)号：US5166293A
公开(公告)日：1992-11-24
申请号：US704384
申请日：1991-05-23
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi
IPC分类号： C08L83/04 , C08L83/05 , C08L83/06 , C08L83/07 , C09J183/04
CPC分类号： C08L83/04 , C09J183/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20
摘要： A silicone rubber composition comprising (A) a vinyl-containing diorganopolysiloxane, (B) an organohydrogenpolysiloxane, and (C) a platinum catalyst is improved in adhesion to metallic, ceramic and plastic substrates by blending therein (D) an alkoxyhydrogensiloxane and (E) a polysiloxane having at least one epoxy group attached to a silicon atom through a carbon atom.
摘要翻译：包含（A）含乙烯基的二有机基聚硅氧烷，（B）有机氢聚硅氧烷和（C）铂催化剂的硅橡胶组合物通过在其中掺入（D）烷氧基氢硅氧烷和（E）金属，具有通过碳原子连接到硅原子的至少一个环氧基的聚硅氧烷。

5. 发明授权

US4650849A Photosensitive curable resin composition 失效
标题翻译：感光性固化性树脂组合物
公开(公告)号：US4650849A
公开(公告)日：1987-03-17
申请号：US727359
申请日：1985-04-25
申请人： Yoshiaki Nishimura , Hiroshige Okinoshima , Seiya Yamada , Tsutomu Kashiwagi
发明人： Yoshiaki Nishimura , Hiroshige Okinoshima , Seiya Yamada , Tsutomu Kashiwagi
IPC分类号： G03F7/038 , C08G73/10 , C08G75/00 , C08G75/02 , C08G75/12 , C08G77/455 , G03F7/004 , G03F7/031 , G03F7/032 , G03F7/075 , H01L21/027 , C08G77/04
CPC分类号： C08G73/106 , C08G77/455
摘要： The organosilicon-containing polyamic acid of the invention is a reaction product of the reactants including (1) an organosilicon compound having ethylenic unsaturation and amino-substituted hydrocarbon group, (2) a tetracarboxylic acid dianhydride and (3) a polyamino compound in an organic solvent. The polyamic acid as such and a composition comprising the same in combination with a mercapto-containing compound and/or a photosensitizer are useful as a photosensitive precursor of a polyimide resin usable in photolithographic pattern reproduction.
摘要翻译：本发明的含有机硅的聚酰胺酸是包括（1）具有烯属不饱和键的有机硅化合物和氨基取代的烃基的反应物的反应产物，（2）四羧酸二酐和（3）有机基团中的聚氨基化合物溶剂。聚酰胺酸本身以及含有巯基化合物和/或光敏剂的组合物可用作可用于光刻图案再现的聚酰亚胺树脂的光敏前体。

6. 发明授权

US06312553B1 Adhesive silicone elastomer film, and covering method and bonding method making use of the same 有权
标题翻译：粘合硅胶弹性体膜，以及使用它的覆盖方法和粘合方法
公开(公告)号：US06312553B1
公开(公告)日：2001-11-06
申请号：US09466887
申请日：1999-12-20
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi
IPC分类号： C08F3008
CPC分类号： C08L83/14 , C08F30/08 , C08G77/14 , C08G77/18 , C08G77/24 , C08G77/26 , C08G77/70 , C08L83/04 , C09J4/00 , C08L2666/28 , C08F230/08
摘要： An adhesive silicone elastomer film obtained by forming a radiation-curable silicone rubber composition into a film and curing the resulting film by radiation; the composition including (A) an oily organopolysiloxane, (B) a radiation sensitizer and (C) an alkoxysilane and/or a partial hydrolysis-condensation product thereof. The oily organopolysiloxane includes, e.g., a compound represented by the formula: This film can be produced in a short time as clean films easy to handle and having a uniform shape, can rationalize work steps when used, and also has a low elasticity and sufficient heat resistance, adhesiveness and workability. This film is useful in the covering or bonding of articles.
摘要翻译：通过将可辐射固化硅橡胶组合物形成膜并通过辐射固化所得膜而获得的粘性硅氧烷弹性体膜; 所述组合物包含（A）油性有机聚硅氧烷，（B）辐射敏化剂和（C）烷氧基硅烷和/或其部分水解缩合产物。油性有机聚硅氧烷包括例如由下式表示的化合物：该膜可以在短时间内由于易于处理和具有均匀形状的清洁膜而制备，可以在使用时使工作步骤合理化，并且还具有低弹性和足够的耐热性，粘合性和可加工性。该薄膜可用于制品的覆盖或粘合。

7. 发明授权

US6069186A Radiation-curable silicone rubber composition 有权
标题翻译：可辐射固化的硅橡胶组合物
公开(公告)号：US6069186A
公开(公告)日：2000-05-30
申请号：US212862
申请日：1998-12-17
申请人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
发明人： Hiroshige Okinoshima , Tsutomu Kashiwagi , Shinsuke Yamaguchi
IPC分类号： C08F30/08 , C08F299/08 , C08L83/06 , C08L83/14 , C09D183/06 , C09D183/14 , C08G77/20
CPC分类号： C08L83/14 , C08F299/08 , C08F30/08 , C08L83/06 , C09D183/06 , C09D183/14
摘要： A radiation-curable silicone rubber composition is provided which includes:(A) a specific organopolysiloxane having radiation-sensitive (meth)acryloyl groups at the both terminals of the molecular chain,(B) a photosensitizer;(C) a tetraalkoxysilane or a partial hydrolysis-condensation product thereof; and(D) optionally together with a specific organic titanium compound. This composition is curable upon irradiation by ultraviolet rays for a short time and exhibits adhesion quickly. Hence, it is useful for the bonding, coating and potting of various substrates. This composition also has a relatively weak adhesion immediately after curing, and can be peeled from the substrate with ease for a while. Hence, it is also suited for uses where repair is required. Because of a high curing rate, it can be effective for, e.g., making a process short, improving productivity and saving energy in the manufacture of electric and electronic parts.
摘要翻译：提供了一种可辐射固化的硅橡胶组合物，其包括：（A）在分子链两端具有辐射敏感性（甲基）丙烯酰基的特定有机聚硅氧烷，（B）光敏剂; （C）四烷氧基硅烷或其部分水解缩合产物; 和（D）任选地与特定的有机钛化合物一起。该组合物在短时间内通过紫外线照射可以固化，并且快速显示粘附性。因此，对于各种基材的粘合，涂布和封装是有用的。该组合物在固化后立即具有相对弱的粘附性，并且可以容易地从基材上剥离一段时间。因此，它也适用于需要修理的用途。由于固化速度高，所以在制造电气和电子零件方面可以有效地使工艺缩短，提高生产率和节约能源。

8. 发明授权

US5326589A Method of protecting electronic or electric part 失效
标题翻译：保护电子或电气部件的方法
公开(公告)号：US5326589A
公开(公告)日：1994-07-05
申请号：US13409
申请日：1993-02-04
申请人： Hiroshige Okinoshima , Toshio Shiobara , Tsutomu Kashiwagi
发明人： Hiroshige Okinoshima , Toshio Shiobara , Tsutomu Kashiwagi
IPC分类号： C08K3/22 , C08K3/36 , B05D5/12
CPC分类号： C08K3/22 , C08K3/36
摘要： The invention provides a method of protecting an electronic or electric part by coating the part with a silicone rubber composition comprising an organopolysiloxane, an organohydrogenpolysiloxane, an addition reaction catalyst, and a filler. When metal oxide fine particles obtained by deflagration of metal powder dust in an oxygen-containing atmosphere are blended as the filler, the composition has sufficient purity to cover electronic and electric parts and cured products of the composition are improved in electrical properties and heat resistance, thereby protecting the electronic or electric part.
摘要翻译：本发明提供了一种通过用包含有机聚硅氧烷，有机氢聚硅氧烷，加成反应催化剂和填料的硅橡胶组合物涂覆部件来保护电子部件或电气部件的方法。当通过在含氧气氛中的金属粉尘的燃烧而获得的金属氧化物细颗粒作为填料混合时，该组合物具有足够的纯度以覆盖电子部件和电气部件，并且组合物的固化产物的电性能和耐热性得到改善，从而保护电子部件或电气部件。

9. 发明授权

US08710158B2 Epoxy composition for encapsulating an optical semiconductor element 有权
标题翻译：用于封装光学半导体元件的环氧组合物
公开(公告)号：US08710158B2
公开(公告)日：2014-04-29
申请号：US13080730
申请日：2011-04-06
申请人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
发明人： Manabu Ueno , Miyuki Wakao , Tsutomu Kashiwagi
IPC分类号： C08G59/20 , C08G59/42 , C08G59/62 , C08L63/00 , C08L83/08 , C08L83/10 , H01L21/56
CPC分类号： H01L33/56 , C08G59/306 , C08G59/3254 , C08G59/42
摘要： The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
摘要翻译：本发明的目的是提供一种用于封装光学半导体元件的环氧组合物，该组合物提供具有低透气性的固化产物和薄膜形式的优异的固化性以及良好的透光性和抗裂纹性。本发明提供一种组合物，其包含（A）由式（1）表示的硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇。本发明还提供一种组合物，其包含通过（A）硅氧烷改性的环氧化合物，（B）固化剂和（C）多元醇和（D）固化催化剂及其固化产物反应制备的组合物。

10. 发明授权

US08373196B2 Composition encapsulating optical semiconductor and optical semiconductor device using same 有权
标题翻译：用于封装光学半导体的组合物和使用其的光学半导体器件
公开(公告)号：US08373196B2
公开(公告)日：2013-02-12
申请号：US12716823
申请日：2010-03-03
申请人： Tsutomu Kashiwagi , Masanobu Sato
发明人： Tsutomu Kashiwagi , Masanobu Sato
IPC分类号： H01L33/56 , C08L83/06
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , H01L24/45 , H01L24/48 , H01L33/486 , H01L33/56 , H01L2224/451 , H01L2224/48465 , H01L2224/48997 , H01L2224/83439 , H01L2224/85951 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/19107 , C08L83/00 , C08L2666/54 , H01L2924/00 , H01L2224/48455 , H01L2224/45099 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A composition for encapsulating optical semiconductors. The composition comprises (A) a mixture of a linear alkenyl group-containing organopolysiloxane and an alkenyl group-containing organopolysiloxane resin containing at least one SiO2 unit, (B) a mixture of a linear organohydrogenpolysiloxane containing two or more SiH groups and a branched organohydrogenpolysiloxane that is liquid at 25° C., (C) a platinum group metal catalyst, and (D) a linear or cyclic organopolysiloxane having at least two functional groups selected from the group consisting of alkenyl groups, alkoxysilyl groups and epoxy groups bonded to silicon atoms. A cured product of the composition exhibits dramatically reduced surface tack, and therefore using the composition for encapsulating optical semiconductor elements improves the optical semiconductor device yield.
摘要翻译：一种用于封装光学半导体的组合物。该组合物包含（A）含有直链烯基的有机聚硅氧烷和含有至少一个SiO 2单元的含烯基的有机聚硅氧烷树脂的混合物，（B）含有两个或多个SiH基的直链有机氢聚硅氧烷和支链有机氢聚硅氧烷在25℃下为液体，（C）铂族金属催化剂，和（D）具有至少两个选自烯基，烷氧基甲硅烷基和与硅结合的环氧基的官能团的直链或环状有机聚硅氧烷原子组合物的固化产物表现出显着降低的表面粘着性，因此使用用于封装光学半导体元件的组合物可提高光学半导体器件的产率。

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