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    • 7. 发明授权
    • Method of making a piezoelectric device
    • 制造压电元件的方法
    • US07636994B2
    • 2009-12-29
    • US11360394
    • 2006-02-24
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • H01L41/22H01L41/00H03H9/00
    • H01L41/332Y10T29/42Y10T29/43Y10T29/435Y10T29/49126Y10T29/49155
    • The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A. It significantly suppresses a situation of dissolution of the piezoelectric film 52A and realizes improvement in characteristics of the piezoelectric device 74 made.
    • 本发明提供了具有改进特性的电子设备和制造该电子设备的方法。 在制造根据本发明的电子设备(压电器件)74的方法中,形成在层压体60的电极膜46A上的压电膜52A的外边缘R1位于电极膜46A的外边缘R2的内侧 。 因此,从蚀刻液在聚酰亚胺72和层叠体60之间渗透的多层基板61去除单晶Si基板14时,蚀刻液在其到达压电膜52A之前就绕过电极膜46A。 也就是说,通过电极膜46A显着地延长到压电膜52A的蚀刻溶液的路线A. 因此,在制造电子设备74的方法中,蚀刻溶液不太可能到达压电膜52A。 这显着地抑制了压电膜52A的溶解情况,并且实现了所制作的压电装置74的特性的改善。
    • 8. 发明授权
    • Electronic device and method of making same
    • 电子设备及其制作方法
    • US08183749B2
    • 2012-05-22
    • US12458274
    • 2009-07-07
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • H01L41/22
    • H01L41/332Y10T29/42Y10T29/43Y10T29/435Y10T29/49126Y10T29/49155
    • The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A. It significantly suppresses a situation of dissolution of the piezoelectric film 52A and realizes improvement in characteristics of the piezoelectric device 74 made.
    • 本发明提供了具有改进特性的电子设备和制造该电子设备的方法。 在制造根据本发明的电子设备(压电器件)74的方法中,形成在层压体60的电极膜46A上的压电膜52A的外边缘R1位于电极膜46A的外边缘R2的内侧 。 因此,从蚀刻液在聚酰亚胺72和层叠体60之间渗透的多层基板61去除单晶Si基板14时,蚀刻液在其到达压电膜52A之前就绕过电极膜46A。 也就是说,通过电极膜46A显着地延长到压电膜52A的蚀刻溶液的路线A. 因此,在制造电子设备74的方法中,蚀刻溶液不太可能到达压电膜52A。 这显着地抑制了压电膜52A的溶解情况,并且实现了所制作的压电装置74的特性的改善。
    • 9. 发明申请
    • Electronic device and method of making same
    • 电子设备及其制作方法
    • US20090271962A1
    • 2009-11-05
    • US12458274
    • 2009-07-07
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • H01L41/22H01L21/302H01L21/461
    • H01L41/332Y10T29/42Y10T29/43Y10T29/435Y10T29/49126Y10T29/49155
    • The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A. It significantly suppresses a situation of dissolution of the piezoelectric film 52A and realizes improvement in characteristics of the piezoelectric device 74 made.
    • 本发明提供了具有改进特性的电子设备和制造该电子设备的方法。 在制造根据本发明的电子设备(压电器件)74的方法中,形成在层压体60的电极膜46A上的压电膜52A的外边缘R1位于电极膜46A的外边缘R2的内侧 。 因此,从蚀刻液在聚酰亚胺72和层叠体60之间渗透的多层基板61去除单晶Si基板14时,蚀刻液在其到达压电膜52A之前就绕过电极膜46A。 也就是说,通过电极膜46A显着地延长到压电膜52A的蚀刻溶液的路线A. 因此,在制造电子设备74的方法中,蚀刻溶液不太可能到达压电膜52A。 这显着地抑制了压电膜52A的溶解情况,并且实现了所制作的压电装置74的特性的改善。
    • 10. 发明申请
    • Electronic device and method of making same
    • 电子设备及其制作方法
    • US20060205225A1
    • 2006-09-14
    • US11360394
    • 2006-02-24
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • Kenichi TochiMasahiro MiyazakiTakao NoguchiHiroshi YamazakiKen UnnoHirofumi Sasaki
    • H01L21/302H01L21/461
    • H01L41/332Y10T29/42Y10T29/43Y10T29/435Y10T29/49126Y10T29/49155
    • The present invention provides an electronic device with improved characteristics and a method of making the electronic device. In a method of making an electronic device (piezoelectric device) 74 according to the present invention, an outer edge R1 of a piezoelectric film 52A formed on an electrode film 46A of a laminate 60 is located inside an outer edge R2 of the electrode film 46A. For this reason, in removal of a monocrystalline Si substrate 14 from a multilayer board 61, where an etching solution permeates between polyimide 72 and laminate 60, the etching solution circumvents the electrode film 46A before it reaches the piezoelectric film 52A. Namely, a route A of the etching solution to the piezoelectric film 52A is significantly extended by the electrode film 46A. In the method of making the electronic device 74, therefore, the etching solution is less likely to reach the piezoelectric film 52A. It significantly suppresses a situation of dissolution of the piezoelectric film 52A and realizes improvement in characteristics of the piezoelectric device 74 made.
    • 本发明提供了具有改进特性的电子设备和制造该电子设备的方法。 在制造根据本发明的电子设备(压电器件)74的方法中,形成在层压体60的电极膜46A上的压电膜52A的外边缘R 1位于 电极膜46A。为此,为了从多层基板61去除单晶硅基板14,其中蚀刻溶液渗透在聚酰亚胺72和层压体60之间,蚀刻溶液在其到达压电体之前绕过电极膜46A 也就是说,通过电极膜46A,使压电膜52A的蚀刻溶液的路线A显着延长。因此,在制造电子器件74的方法中,蚀刻溶液不太可能达到 压电膜52A。显着抑制压电膜52A的溶解的情况,实现了制造的压电元件74的特性的提高。