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1. 发明授权

US06774470B2 Non-contact data carrier and method of fabricating the same 失效
标题翻译：非接触式数据载体及其制造方法
公开(公告)号：US06774470B2
公开(公告)日：2004-08-10
申请号：US10327657
申请日：2002-12-24
申请人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
发明人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
IPC分类号： H01L2302
CPC分类号： G06K19/0775 , G06K19/07749 , H01F5/003 , H01F5/06 , H01F41/042 , H01L21/568 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , Y10T436/17 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
摘要翻译：非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

2. 发明授权

US07018844B2 Non-contact data carrier and method of fabricating the same 失效
标题翻译：非接触式数据载体及其制造方法
公开(公告)号：US07018844B2
公开(公告)日：2006-03-28
申请号：US10856991
申请日：2004-06-01
申请人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
发明人： Hiroshi Yagi , Masanao Watanabe , Takeshi Sekiguchi , Chikao Ikenaga , Makoto Nakamura
IPC分类号： H01L21/44 , H01L21/46
CPC分类号： G06K19/0775 , G06K19/07749 , H01F5/003 , H01F5/06 , H01F41/042 , H01L21/568 , H01L23/49855 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48265 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , Y10T436/17 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.
摘要翻译：非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

3. 发明授权

US06359221B1 Resin sealed semiconductor device, circuit member for use therein 失效
标题翻译：树脂密封半导体器件，其中使用的电路部件
公开(公告)号：US06359221B1
公开(公告)日：2002-03-19
申请号：US09123558
申请日：1998-07-29
申请人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
发明人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
IPC分类号： H01L2300
CPC分类号： H01L21/6835 , H01L21/4828 , H01L23/3114 , H01L23/4951 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2221/68377 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85399 , H01L2224/85444 , H01L2224/85464 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1433 , H01L2924/15311 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49172 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.
摘要翻译：公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子，电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是用树脂密封，外部端子是偏心的 y暴露在外面。半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

4. 发明授权

US06465734B2 Resin sealed semiconductor device, circuit member for use therein and method of manufacturing circuit member 有权
标题翻译：树脂密封半导体器件，其中使用的电路部件及其制造方法
公开(公告)号：US06465734B2
公开(公告)日：2002-10-15
申请号：US09804149
申请日：2001-03-13
申请人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
发明人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
IPC分类号： H01L2348
CPC分类号： H01L21/6835 , H01L21/4828 , H01L23/3114 , H01L23/4951 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2221/68377 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85399 , H01L2224/85444 , H01L2224/85464 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1433 , H01L2924/15311 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49172 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.
摘要翻译：公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子，电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是用树脂密封，外部端子是偏心的 y暴露在外面。半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

5. 发明授权

US06658734B2 Method of manufacturing a circuit member for a resin-sealed semiconductor device 有权
标题翻译：制造用于树脂密封半导体器件的电路部件的方法
公开(公告)号：US06658734B2
公开(公告)日：2003-12-09
申请号：US09987855
申请日：2001-11-16
申请人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
发明人： Syuichi Yamada , Makoto Nakamura , Takayuki Takeshita , Hiroshi Yagi
IPC分类号： H01R4300
CPC分类号： H01L21/6835 , H01L21/4828 , H01L23/3114 , H01L23/4951 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/83 , H01L2221/68377 , H01L2224/05599 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L2224/85399 , H01L2224/85444 , H01L2224/85464 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/1433 , H01L2924/15311 , Y10T29/49155 , Y10T29/49158 , Y10T29/49169 , Y10T29/49172 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside.
摘要翻译：公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子，电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是用树脂密封，外部端子是偏心的 y暴露在外面。

6. 发明授权

US06201292B1 Resin-sealed semiconductor device, circuit member used therefor 失效
标题翻译：树脂密封半导体器件，用于其的电路元件
公开(公告)号：US06201292B1
公开(公告)日：2001-03-13
申请号：US09052984
申请日：1998-04-01
申请人： Hiroshi Yagi , Yoichi Hitomi , Makoto Nakamura , Masato Sasaki
发明人： Hiroshi Yagi , Yoichi Hitomi , Makoto Nakamura , Masato Sasaki
IPC分类号： H01L23495
CPC分类号： H01L23/49548 , H01L21/4828 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/05554 , H01L2224/32057 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/48475 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/83385 , H01L2224/85051 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is disclosed a resin-sealed semiconductor device in which plural terminal portions each integrally having an inner terminal on a surface and an outer terminal on a rear face are arranged two-dimensionally substantially in a plane electrically independent of one another. A die pad is electrically independently disposed in a substantially middle portion in the plane where the terminal portions are arranged two-dimensionally. A semiconductor element is mounted on the die pad. The inner terminals of the terminal portions are electrically connected via wires to terminals of the semiconductor element, and the entirety is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. Therefore, an occupancy ratio of the semiconductor element in the semiconductor device is increased. The semiconductor device can be miniaturized. The mounting density onto a circuit substrate can be enhanced. Also, by forming outer electrodes on the outer terminals, different from the conventional TSOP or another small-sized semiconductor device, multiple pins can be easily provided.
摘要翻译：公开了一种树脂密封半导体器件，其中，在表面上一体地具有内部端子和后表面上的外部端子的多个端子部分基本上彼此平行地布置在彼此电独立的平面中。芯片焊盘电气地独立地设置在端子部分被二维布置的平面中的大致中间部分中。半导体元件安装在管芯焊盘上。端子部分的内部端子经由导线电连接到半导体元件的端子，并且整体用树脂密封，使得端子部分的外部端部部分地暴露于外部。因此，半导体器件中的半导体元件的占有率增加。可以使半导体器件小型化。可以提高电路基板上的安装密度。此外，通过在外部端子上形成外部电极，与常规TSOP或另一小型半导体器件不同，可以容易地提供多个引脚。

7. 发明授权

US09737881B2 Method of producing regenerated hydrotreating catalyst and method of producing petroleum products 有权
公开(公告)号：US09737881B2
公开(公告)日：2017-08-22
申请号：US13880477
申请日：2011-09-14
申请人： Yoshimu Iwanami , Takashi Sano , Tomohiro Konishi , Makoto Nakamura , Souichirou Konno
发明人： Yoshimu Iwanami , Takashi Sano , Tomohiro Konishi , Makoto Nakamura , Souichirou Konno
IPC分类号： C10G45/72 , B01J38/02 , B01J23/94 , B01J23/882 , B01J35/00 , B01J38/12 , C10G45/08 , C10G45/38 , C10G45/50 , C10G45/12 , C10G45/54
CPC分类号： B01J23/94 , B01J23/882 , B01J35/002 , B01J38/02 , B01J38/12 , C10G45/08 , C10G45/12 , C10G45/38 , C10G45/50 , C10G45/54
摘要： A method of producing a regenerated hydrotreating catalyst, including a first step of preparing a hydrotreating catalyst that has been used for hydrotreatment of a petroleum fraction and has a metal element selected from Group 6 elements of the periodic table; a second step of performing regeneration treatment for part of the catalyst prepared in the first step, then performing X-ray absorption fine structure analysis for the catalyst after the regeneration treatment, and obtaining regeneration treatment conditions in which a ratio IS/IO of a peak intensity IS of a peak attributed to a bond between the metal element and a sulfur atom to a peak intensity IO of a peak attributed to a bond between the metal element and an oxygen atom is in the range of 0.1 to 0.3 in a radial distribution curve obtained from an extended X-ray absorption fine structure spectrum.

8. 发明授权

US09077269B2 Control system for AC electric motor 有权
标题翻译：交流电动机控制系统
公开(公告)号：US09077269B2
公开(公告)日：2015-07-07
申请号：US14073146
申请日：2013-11-06
申请人： Makoto Nakamura , Mikio Yamazaki
发明人： Makoto Nakamura , Mikio Yamazaki
IPC分类号： H02P27/04 , H02P6/10
CPC分类号： H02P6/10 , H02M3/1582 , H02P21/0089 , H02P27/085
摘要： Fluctuations in output of an AC electric motor are restrained without increasing electromagnetic noise of a boost converter. When subjecting the AC electric motor to rectangular wave voltage control, output torque T is controlled by varying a voltage phase φv. In a region where a voltage phase is large (φv=θ2), fluctuations in torque T relative to changes in a DC voltage VH corresponding to the amplitude of a rectangular wave voltage are larger than in a region where the voltage phase is small (φv=θ1). The AC electric motor is controlled such that the rectangular wave voltage control in a region where voltage phase φv is larger than a limit-phase line PLN indicated by a set of limit phases set for each DC voltage VH is avoided.
摘要翻译：在不增加升压转换器的电磁噪声的情况下，可以抑制交流电动机输出的波动。当对交流电动机进行矩形波电压控制时，通过改变电压相位来控制输出转矩T。在电压相位大的区域（＆phgr; v =＆eta; 2）中，与矩形波电压的振幅对应的直流电压VH相对于变化的转矩T的波动大于电压相位是小（＆phgr; v =＆thetas; 1）。控制交流电动机，使得在电压相位v大于由针对每个直流电压VH设定的一组极限相指示的极限相线PLN的区域中的矩形波电压控制被避免。

9. 发明授权

US08965612B2 Failure detection device for vehicle 有权
标题翻译：车辆故障检测装置
公开(公告)号：US08965612B2
公开(公告)日：2015-02-24
申请号：US13530512
申请日：2012-06-22
申请人： Makoto Nakamura , Takaya Soma , Tomoko Shimana
发明人： Makoto Nakamura , Takaya Soma , Tomoko Shimana
IPC分类号： G06F7/00 , B60L3/00
CPC分类号： B60L3/0038 , B60L3/0061
摘要： A failure detection device for a vehicle that detects a failure of a motor system includes a controller that changes a sensitivity for detection of a failure in the motor system in accordance with at least one of an operational condition of the motor system and a situation in which the motor system is operating.
摘要翻译：用于检测电动机系统故障的车辆故障检测装置包括控制器，该控制器根据电动机系统的运行状况和电动机系统的运行状况中的至少一个改变用于检测电动机系统的故障的灵敏度，电机系统正在运行。

10. 发明申请

US20140225430A1 POWER SUPPLY SYSTEM AND METHOD FOR CONTROLLING THE SAME 有权
标题翻译：电源系统及其控制方法
公开(公告)号：US20140225430A1
公开(公告)日：2014-08-14
申请号：US14347102
申请日：2011-09-27
申请人： Hichirosai Oyobe , Makoto Nakamura , Munehiro Kamiya
发明人： Hichirosai Oyobe , Makoto Nakamura , Munehiro Kamiya
IPC分类号： H02J1/10 , B60L11/18
CPC分类号： H02J1/10 , B60L7/14 , B60L11/123 , B60L11/14 , B60L11/18 , B60L11/1861 , B60L15/2009 , B60L2210/12 , B60L2210/14 , B60L2210/30 , B60L2210/40 , B60L2220/14 , B60L2240/421 , B60L2240/423 , B60L2240/429 , B60L2240/547 , B60L2240/549 , B60L2270/20 , H02J1/08 , H02J2001/008 , H02M3/1582 , Y02T10/6217 , Y02T10/642 , Y02T10/645 , Y02T10/7005 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7225 , Y02T10/7233 , Y02T10/7241 , Y02T10/7275 , Y10T307/549
摘要： A power supply system that supplies electric power to a load includes a first power storage device, a second power storage device, a power line for transmitting electric power input and output to and from the load, a converter for executing bidirectional DC voltage conversion between the first power storage device and the power line, and a switch connected between the second power storage device and the power line. When the switch is OFF, the control device performs voltage control of the converter so that a voltage value of the power line becomes a voltage command value, and when the switch is ON, the control device performs current control of the converter so that a current value of the first power storage device becomes a current command value.
摘要翻译：向负载供电的供电系统包括第一蓄电装置，第二蓄电装置，用于向负载输入和输出电力的电力线，用于在所述负载之间执行双向DC电压转换的转换器第一蓄电装置和电力线，以及连接在第二蓄电装置与电力线之间的开关。当开关关闭时，控制装置对转换器进行电压控制，使得电力线的电压值成为电压指令值，当开关接通时，控制装置对转换器进行电流控制，第一蓄电装置的值变为电流指令值。

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