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    • 1. 发明申请
    • Cooling Water Circulation Apparatus and Method of Removing Scale from Cooling Water Circulation Apparatus
    • 冷却水循环装置及其从冷却水循环装置中去除垢的方法
    • US20080115925A1
    • 2008-05-22
    • US11661678
    • 2004-09-06
    • Hiroshi TanakaTatsuya Hibino
    • Hiroshi TanakaTatsuya Hibino
    • F28F19/00F28G13/00
    • C02F1/4602C02F2001/46119C02F2103/023C02F2201/4613C02F2209/05
    • A cooling water circulation apparatus capable of limiting attachment of microorganisms and scale in an environmentally friendly manner and a method of removing scale in the cooling water circulation apparatus. An electrolytic device 10 is provided on a cooling water circulation route R1. In the arrangement, mineral contents such as calcium ions and magnesium ions contained in cooling water W are deposited as scale S on an electrode 12A or 12B in an electrolytic step, thereby enabling the mineral contents to be removed from the cooling water W. Even if the hardness of the cooling water W is increased by evaporation of the water with elapse of time, the hardness can be reduced by the electrolytic processing. Thus, the deposition of the scale S in the circulation route R1 can be reduced. Further, the scale S deposited on the electrode 12A or 12B can be easily separated by operating while reversing the polarities of the electrodes 12A and 12B at predetermined time intervals.
    • 一种能够以环境友好的方式限制微生物附着和鳞屑的冷却水循环装置,以及除去冷却水循环装置中的垢的方法。 电解装置10设置在冷却水循环路径R 1上。 在这种布置中,在电解步骤中,将冷却水W中所含的矿物质如钙离子和镁离子作为刻度S沉积在电极12A或12B上,从而使矿物质含量从冷却水W中除去。 即使随着时间的流逝水的蒸发使冷却水W的硬度升高,也可以通过电解处理来降低硬度。 因此,可以减小水垢S在循环路径R 1中的沉积。 此外,沉积在电极12A或12B上的刻度S可以通过操作容易地分离,同时以预定的时间间隔反转电极12A和11B的极性。
    • 2. 发明授权
    • Cooling water circulation apparatus and method of removing scale from cooling water circulation apparatus
    • 冷却水循环装置及从冷却水循环装置中除垢的方法
    • US08475645B2
    • 2013-07-02
    • US11661678
    • 2004-09-06
    • Hiroshi TanakaTatsuya Hibino
    • Hiroshi TanakaTatsuya Hibino
    • B01D59/40
    • C02F1/4602C02F2001/46119C02F2103/023C02F2201/4613C02F2209/05
    • A cooling water circulation apparatus is capable of limiting attachment of microorganisms and scale in an environmentally friendly manner. An electrolytic device 10 is provided on a cooling water circulation route R1. In the arrangement, mineral contents such as calcium ions and magnesium ions contained in cooling water W are deposited as scale S on an electrode 12A or 12B in an electrolytic step, thereby enabling the mineral contents to be removed from the cooling water W. Even if the hardness of the cooling water W is increased by evaporation of the water with elapse of time, the hardness can be reduced by the electrolytic processing. Thus, the deposition of the scale S in the circulation route R1 can be reduced. Further, the scale S deposited on the electrode 12A or 12B can be easily separated by operating while reversing the polarities of the electrodes 12A and 12B at predetermined time intervals.
    • 冷却水循环装置能够以环保的方式限制微生物的附着和垢。 电解装置10设置在冷却水循环路径R1上。 在这种布置中,在电解步骤中,将冷却水W中所含的矿物质如钙离子和镁离子作为标尺S沉积在电极12A或12B上,从而使矿物质含量从冷却水W中除去。即使 冷却水W的硬度随时间的蒸发而增加,可以通过电解处理来降低硬度。 因此,能够减小氧化皮S在循环路径R1中的沉积。 此外,沉积在电极12A或12B上的刻度S可以通过操作容易地分离,同时以预定的时间间隔反转电极12A和12B的极性。
    • 7. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US09070549B2
    • 2015-06-30
    • US12680799
    • 2008-09-22
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • B08B5/02H01L21/02H01L21/67
    • H01L21/02052H01L21/67028
    • A drying gas is supplied into a drying chamber in a substantially horizontal direction, an obliquely downward direction descendent from the substantially horizontal direction, or a vertically downward direction under a state where a wafer is immersed in a cleaning liquid in a cleaning tank. The wafer is moved from the cleaning tank into the drying chamber, with the drying gas being supplied into the drying chamber. At this time, the supply of the drying gas into the drying chamber is stopped, under a condition where a part of the wafer is immersed in the cleaning liquid stored in the cleaning tank. After the movement of the wafer into the drying chamber has been finished, a drying gas is supplied into the drying chamber in an obliquely upward direction ascendant from the substantially horizontal direction or a vertically upward direction.
    • 在将晶片浸入清洗槽中的清洗液体的状态下,将干燥气体从大致水平方向或垂直向下方向向大致水平方向,倾斜向下方向供给到干燥室。 将晶片从清洁槽移动到干燥室中,其中干燥气体被供应到干燥室中。 此时,在将晶片的一部分浸渍在存储在清洗槽中的清洗液中的状态下,将干燥气体供给到干燥室内停止。 在将晶片移动到干燥室中之后,干燥气体从大致水平方向或垂直向上方向上升的斜上方向供给干燥室。
    • 10. 发明授权
    • Substrate processing apparatus, substrate processing method and storage medium
    • 基板处理装置,基板处理方法和存储介质
    • US08778092B2
    • 2014-07-15
    • US13042645
    • 2011-03-08
    • Hiroshi TanakaHironobu HyakutakeTakashi Uno
    • Hiroshi TanakaHironobu HyakutakeTakashi Uno
    • B08B3/04B08B5/02F26B5/00
    • H01L21/67057H01L21/67028
    • There is provided a substrate processing method including cleaning a substrate by immersing the substrate in a cleaning solution in a longitudinal direction while the cleaning solution is supplied to a cleaning tank; transferring the substrate picked up from the cleaning tank to a drying chamber while holding the substrate in a longitudinal direction; and drying the substrate in the drying chamber communicating with an upper area of the cleaning tank by alternately supplying a first drying gas containing vapor of a solvent for removing a liquid and a second drying gas without containing the vapor of the solvent for removing the liquid to an area where the substrate is exposed between the upper area of the cleaning tank and the drying chamber after an upper end of the cleaned substrate is picked up from a liquid surface of the cleaning solution.
    • 提供了一种基板处理方法,包括通过在将清洁溶液供应到清洗槽的同时将基板浸入清洁溶液中而沿纵向清洗基板; 将从所述清洗槽拾取的所述基板沿长度方向保持所述基板; 以及通过交替地供给包含用于除去液体的溶剂的蒸气的第一干燥气体和第二干燥气体来干燥所述干燥室中与所述清洗槽的上部区域连通的基板,而不将所述溶剂的蒸气除去以除去所述液体 从清洗液的液面取出基板在清洗槽的上部区域与清洗后的基板的上端之间的干燥室之间露出的区域。