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    • 1. 发明授权
    • Laminated coil component and method of producing the same
    • 层叠线圈部件及其制造方法
    • US07167070B2
    • 2007-01-23
    • US10527036
    • 2004-06-22
    • Hiroshi TanakaTakahiro YamamotoHajime Arakawa
    • Hiroshi TanakaTakahiro YamamotoHajime Arakawa
    • H01F5/00
    • H01F17/0033H01F2017/002Y10T29/4902
    • A laminated coil is constructed such that an inner space of each via hole can be increased while the spacing between adjacent via holes in the axial direction of a coil is prevented from being narrowed. In the via holes of the laminated coil, through-holes formed in ceramic layers and filled with a conductor are arranged in a row in the lamination direction X, and, in each of the through-holes, the difference between the diameter in the axial direction of the coil on the opening surface of one opening of a ceramic layer and the diameter in the axial direction of the coil on the opening surface of the other opening is smaller than the difference between the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of one opening of the ceramic layer and the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of the other opening.
    • 层叠线圈被构造成使得可以增加每个通孔的内部空间,同时防止相邻的通孔在线圈的轴向方向上的间隔变窄。 在层叠线圈的通孔中,形成在陶瓷层中并填充有导体的通孔在层叠方向X上排列成一列,并且在每个通孔中,轴向的直径之间的差异 线圈在陶瓷层的一个开口的开口表面上的方向和另一个开口的开口表面上的线圈的轴向方向上的直径小于基本垂直于 陶瓷层的一个开口的开口面上的线圈的轴向Y和Z方向上的直径大致垂直于另一个开口的开口面上的线圈的轴线方向Y。
    • 2. 发明申请
    • Laminated coil component and method of producing the same
    • 层叠线圈部件及其制造方法
    • US20060152319A1
    • 2006-07-13
    • US10527036
    • 2004-06-22
    • Hiroshi TanakaTakahiro YamamotoHajime Arakawa
    • Hiroshi TanakaTakahiro YamamotoHajime Arakawa
    • H01F5/00
    • H01F17/0033H01F2017/002Y10T29/4902
    • A laminated coil is constructed such that an inner space of each via hole can be increased while the spacing between adjacent via holes in the axial direction of a coil is prevented from being narrowed. In the via holes of the laminated coil, through-holes formed in ceramic layers and filled with a conductor are arranged in a row in the lamination direction X, and, in each of the through-holes, the difference between the diameter in the axial direction of the coil on the opening surface of one opening of a ceramic layer and the diameter in the axial direction of the coil on the opening surface of the other opening is smaller than the difference between the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of one opening of the ceramic layer and the diameter in the direction Z that is substantially perpendicular to the axial direction Y of the coil on the opening surface of the other opening.
    • 层叠线圈被构造成使得可以增加每个通孔的内部空间,同时防止相邻的通孔在线圈的轴向方向上的间隔变窄。 在层叠线圈的通孔中,形成在陶瓷层中并填充有导体的通孔在层叠方向X上排列成一列,并且在每个通孔中,轴向的直径之间的差异 线圈在陶瓷层的一个开口的开口表面上的方向和另一个开口的开口表面上的线圈的轴向方向上的直径小于基本垂直于 陶瓷层的一个开口的开口面上的线圈的轴向Y和Z方向上的直径大致垂直于另一个开口的开口面上的线圈的轴线方向Y。
    • 9. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US09070549B2
    • 2015-06-30
    • US12680799
    • 2008-09-22
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • Hiroshi TanakaToshiyuki ShiokawaTakao Inada
    • B08B5/02H01L21/02H01L21/67
    • H01L21/02052H01L21/67028
    • A drying gas is supplied into a drying chamber in a substantially horizontal direction, an obliquely downward direction descendent from the substantially horizontal direction, or a vertically downward direction under a state where a wafer is immersed in a cleaning liquid in a cleaning tank. The wafer is moved from the cleaning tank into the drying chamber, with the drying gas being supplied into the drying chamber. At this time, the supply of the drying gas into the drying chamber is stopped, under a condition where a part of the wafer is immersed in the cleaning liquid stored in the cleaning tank. After the movement of the wafer into the drying chamber has been finished, a drying gas is supplied into the drying chamber in an obliquely upward direction ascendant from the substantially horizontal direction or a vertically upward direction.
    • 在将晶片浸入清洗槽中的清洗液体的状态下,将干燥气体从大致水平方向或垂直向下方向向大致水平方向,倾斜向下方向供给到干燥室。 将晶片从清洁槽移动到干燥室中,其中干燥气体被供应到干燥室中。 此时,在将晶片的一部分浸渍在存储在清洗槽中的清洗液中的状态下,将干燥气体供给到干燥室内停止。 在将晶片移动到干燥室中之后,干燥气体从大致水平方向或垂直向上方向上升的斜上方向供给干燥室。