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1. 发明申请

US20090115577A1 RFID TAG 失效
标题翻译： RFID标签
公开(公告)号：US20090115577A1
公开(公告)日：2009-05-07
申请号：US12193364
申请日：2008-08-18
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
IPC分类号： H04Q5/22
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191
摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

2. 发明授权

US08081081B2 Electronic apparatus and method of manufacturing the same 失效
标题翻译：电子设备及其制造方法
公开(公告)号：US08081081B2
公开(公告)日：2011-12-20
申请号：US12191539
申请日：2008-08-14
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota
IPC分类号： G08B13/14 , G08B23/00 , H01L23/02
CPC分类号： G06K19/07749 , G06K19/02 , G06K19/027 , G06K19/07728 , G06K19/07758 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1815 , Y10T428/2462 , H01L2924/00
摘要： The electronic apparatus includes a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and plural protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern. The plural protrusions protrude in a direction away from the base sheet.
摘要翻译：电子设备包括基片; 形成在基片上的导电图案; 电路芯片，安装在基片上并连接到导电图案; 以及布置在所述基片的前侧和后侧中的至少一个上的多个突起，以与所述导电图案的至少一部分重叠。多个突起在远离基片的方向上突出。

3. 发明申请

US20090053852A1 MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS 审中-公开
标题翻译：电子设备的制造装置和方法
公开(公告)号：US20090053852A1
公开(公告)日：2009-02-26
申请号：US12192225
申请日：2008-08-15
申请人： Shuichi Takeuchi , Kenji Kobae , Takashi Kubota , Hiroshi Kobayashi
发明人： Shuichi Takeuchi , Kenji Kobae , Takashi Kubota , Hiroshi Kobayashi
IPC分类号： H05K3/30 , H05K13/04
CPC分类号： H01L21/563 , H01L24/28 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , Y10T29/4913 , Y10T29/5313 , H01L2924/00
摘要： A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component.
摘要翻译：提供了一种用于电子设备和制造设备的制造方法。制造方法包括向片材的表面施加要填充到安装板和安装在安装板上的电子部件之间的空间中的粘合剂，使片材的一个表面与电子部件的背面接触安装在安装板上，并通过使粘合剂在低压下与电子部件的周边部分接触来将粘合剂装入空间，并将加热头压在片材的另一个表面上并加热片材在片材与电子部件接触的状态下，经由片材头部，以在大气压下设置粘合剂。

4. 发明授权

US07902983B2 RFID tag 失效
标题翻译： RFID标签
公开(公告)号：US07902983B2
公开(公告)日：2011-03-08
申请号：US12193364
申请日：2008-08-18
申请人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
发明人： Hiroshi Kobayashi , Kenji Kobae , Takashi Kubota , Hidehiko Kira
IPC分类号： G08B13/00
CPC分类号： G06K19/07749 , G06K19/07728 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191
摘要： An RFID tag includes: a sheet-like base; an antenna provided on the base and extending along the base; a circuit chip mounted on the base and connected to the antenna for performing radio communication through the antenna; a protection body wider than the circuit chip and narrower than the antenna, which is located at least either above the circuit chip or on a backside of the circuit chip with the base interposed therebetween for protecting the circuit chip; and a connection section provided as a portion of the antenna at a location where an edge of the protection body and the antenna intersect with each other as viewed from a direction intersecting with a surface of the base, which includes one or more conductor patterns narrower than other portion of the antenna, and which connects inner and outer antenna portions of the edge with each other.
摘要翻译： RFID标签包括：片状基底; 设置在基座上并沿基座延伸的天线; 安装在基座上并连接到天线的电路芯片，用于通过天线进行无线电通信; 比电路芯片更宽的保护体，并且比天线窄，其位于电路芯片的上方或电路芯片的背面上，其中插入基板，用于保护电路芯片; 以及连接部，其在从与所述基部的表面相交的方向观察时，在所述保护体和所述天线的边缘彼此相交的位置处设置为所述天线的一部分，所述方向包括一个或多个导体图案，所述导体图案比天线的其他部分，并且将边缘的内天线部分和外天线部分彼此连接。

5. 发明申请

US20070184582A1 Method of flip-chip mounting 有权
标题翻译：倒装芯片安装方法
公开(公告)号：US20070184582A1
公开(公告)日：2007-08-09
申请号：US11435851
申请日：2006-05-18
申请人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
发明人： Kimio Nakamura , Kenji Kobae , Takashi Kubota
IPC分类号： H01L21/00
CPC分类号： H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75304 , H01L2224/75744 , H01L2224/83139 , H01L2224/8314 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/3511 , H01L2924/00
摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.
摘要翻译：一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合，基板向凹部弯曲。

6. 发明申请

US20070137025A1 Method of bonding flying leads 审中-公开
标题翻译：拼接飞线的方法
公开(公告)号：US20070137025A1
公开(公告)日：2007-06-21
申请号：US11359427
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K1/06
CPC分类号： H05K3/361 , G11B5/4846 , H05K3/328 , H05K2201/0397 , H05K2201/10765 , H05K2203/0285 , Y10T29/49027 , Y10T29/4903
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：将飞行引线对准于平行布置的焊盘; 以及将超音速振动施加到接合工具，以将所述飞行引线分别连接到所述焊盘。并且飞行引线的宽度比焊盘的宽度宽，并且超音速振动被施加到将飞行引线压在焊盘上的焊接工具，使得飞行引线分别超音速粘合到焊盘。

7. 发明申请

US20060012921A1 Carriage assembly of a hard disk drive 失效
标题翻译：一个硬盘驱动器的支架装配
公开(公告)号：US20060012921A1
公开(公告)日：2006-01-19
申请号：US10990139
申请日：2004-11-16
申请人： Takashi Kubota , Kenji Kobae
发明人： Takashi Kubota , Kenji Kobae
IPC分类号： G11B5/48 , G11B21/16 , G11B5/55 , G11B21/08
CPC分类号： H05K3/361 , G11B5/4833 , G11B5/484 , G11B5/4846 , G11B5/486 , H05K1/056 , H05K3/0058 , H05K3/328 , H05K3/386 , H05K2201/0969 , H05K2201/2009 , H05K2201/2036 , H05K2203/0285
摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.
摘要翻译：构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题飞行引线被拔出不会发生接合端子。柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行引线被压在接合端子上。另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动接合端子。

8. 发明授权

US07582553B2 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US07582553B2
公开(公告)日：2009-09-01
申请号：US11359426
申请日：2006-02-23
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L21/4853
摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: mechanically processing the board so as to form projections, which act as margins for deformation, in boding faces of the pads, on each of which the flying lead will be bonded, positioning the flying leads to correspond to the pads; and applying supersonic vibrations to a bonding tool so as to deform and crush the projections, whereby the flying leads are respectively bonded to the pads.
摘要翻译：接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。该方法包括以下步骤：机械地处理板，以便形成凸起，其作为变形的边缘，在焊盘的焊接面中，每个引导面将被接合，将飞行引线定位成对应于垫子以及对接合工具施加超音速振动以使突起变形和压碎，由此将飞行引线分别接合到焊盘。

9. 发明申请

US20070137026A1 Method of bonding flying leads 失效
标题翻译：拼接飞线的方法
公开(公告)号：US20070137026A1
公开(公告)日：2007-06-21
申请号：US11391362
申请日：2006-03-29
申请人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
发明人： Takashi Kubota , Kenji Kobae , Kimio Nakamura
IPC分类号： B23K20/10
CPC分类号： B23K20/10 , B23K2101/32 , H05K3/26 , H05K3/328 , Y10T29/49027 , Y10T29/4903
摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.
摘要翻译：结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。使用接合工具进行接合，其中至少一个接触飞行引线并且对其施加超声波振动的接触构件被可旋转地支撑。接合工具沿与所述至少一个接触构件平行布置的与所述飞行导线接触的方向交叉的方向移动，并且所述超声波振动从所述至少一个接触构件施加到所述飞行导致将相应的飞行引线超声波地结合到衬底焊盘。

10. 发明申请

US20060065697A1 Bonding tool for ultrasonic bonding and method of ultrasonic bonding 失效
标题翻译：超声波接合用接合工具及超声波接合方法
公开(公告)号：US20060065697A1
公开(公告)日：2006-03-30
申请号：US11019623
申请日：2004-12-23
申请人： Kenji Kobae , Takashi Kubota
发明人： Kenji Kobae , Takashi Kubota
IPC分类号： B23K1/06
CPC分类号： H01L24/81 , B23K20/10 , B23K20/106 , B23K2101/42 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2224/0401
摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.
摘要翻译：防止了在焊接工具的使用过程中由于压焊部分的磨损引起的超声波接合用焊接工具的压接部件形状变化和电镀材料等异物堆积在压焊部上，使粘合工具能够稳定地进行超声波接合。具有弯曲外表面的多个突起形成在超声波接合期间与接合部接触的压焊部上。突起可以通过在接合工具的端面中的网格中形成凹槽，然后对结合工具的端面进行喷砂而形成球形外表面。

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