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    • 1. 发明授权
    • Electronic device and method for manufacturing the same
    • 电子设备及其制造方法
    • US08894836B2
    • 2014-11-25
    • US13443932
    • 2012-04-11
    • Hiroshi KatsubeJun Nishikawa
    • Hiroshi KatsubeJun Nishikawa
    • C25D5/50H01G4/30H01G4/232
    • H01G4/30H01G4/2325Y10T428/31678
    • A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.
    • 一种高度可靠的电子装置,其防止电镀溶液经由外部电极进入,并且在其内部进入外部环境的水分,并且不产生由外部表面上的玻璃成分的沉淀引起的焊接缺陷或焊料缺陷缺陷 电极。 电子器件的电极结构由主要由在Cu烧结电极层上形成的Cu,Cu镀层构成的Cu焙烧电极层形成,并通过重结晶处理进行处理,并且在Cu上形成的上侧镀层 电镀层。 在形成Cu镀层之后,在Cu镀层重结晶的温度范围内的温度到导电浆料中所含的玻璃不软化的温度下进行热处理,使得镀铜 层重结晶。
    • 2. 发明授权
    • Electronic device and method for manufacturing the same
    • 电子设备及其制造方法
    • US08179660B2
    • 2012-05-15
    • US11935854
    • 2007-11-06
    • Hiroshi KatsubeJun Nishikawa
    • Hiroshi KatsubeJun Nishikawa
    • H01G4/00
    • H01G4/30H01G4/2325Y10T428/31678
    • A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.
    • 一种高度可靠的电子装置,其防止电镀溶液经由外部电极进入,并且在其内部进入外部环境的水分,并且不产生由外部表面上的玻璃成分的沉淀引起的焊接缺陷或焊料缺陷缺陷 电极。 电子器件的电极结构由主要由在Cu烧结电极层上形成的Cu,Cu镀层构成的Cu焙烧电极层形成,并通过重结晶处理进行处理,并且在Cu上形成的上侧镀层 电镀层。 在形成Cu镀层之后,在Cu镀层重结晶的温度到导电浆料中所含的玻璃不软化的温度的温度下进行热处理,使得镀铜 层重结晶。
    • 3. 发明申请
    • Electronic Device and Method for Manufacturing the Same
    • 电子器件及其制造方法
    • US20120196032A1
    • 2012-08-02
    • US13443932
    • 2012-04-11
    • Hiroshi KatsubeJun Nishikawa
    • Hiroshi KatsubeJun Nishikawa
    • B05D5/12C23C28/00C23C28/02B05D3/02
    • H01G4/30H01G4/2325Y10T428/31678
    • A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.
    • 一种高度可靠的电子装置,其防止电镀溶液经由外部电极进入,并且在其内部进入外部环境的水分,并且不产生由外部表面上的玻璃成分的沉淀引起的焊接缺陷或焊料缺陷缺陷 电极。 电子器件的电极结构由主要由在Cu烧结电极层上形成的Cu,Cu镀层构成的Cu焙烧电极层形成,并通过重结晶处理进行处理,并且在Cu上形成的上侧镀层 电镀层。 在形成Cu镀层之后,在Cu镀层重结晶的温度到导电浆料中所含的玻璃不软化的温度的温度下进行热处理,使得镀铜 层重结晶。
    • 4. 发明申请
    • Electronic Device and Method for Manufacturing the Same
    • 电子器件及其制造方法
    • US20080081200A1
    • 2008-04-03
    • US11935854
    • 2007-11-06
    • Hiroshi KatsubeJun Nishikawa
    • Hiroshi KatsubeJun Nishikawa
    • B32B15/04B05D7/00
    • H01G4/30H01G4/2325Y10T428/31678
    • A highly reliable electronic device and a method for manufacturing the same are provided, the electronic device preventing entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generating no soldering defects nor solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The structure is formed of Cu-baked electrode layers 6a and 6b primarily composed of Cu, Cu plating layers 7a and 7b which are formed on the Cu-baked electrode layers 6a and 6b and which are processed by a recrystallization treatment, and upper-side plating layers 9a and 9b formed on the Cu plating layers 7a and 7b. After the Cu plating layers 7a and 7b are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers 7a and 7b are recrystallized to a temperature at which glass contained in a conductive paste is not softened (both inclusive), so that the Cu plating layers 7a and 7b are recrystallized.
    • 提供了一种高度可靠的电子装置及其制造方法,电子装置防止电镀液经由外部电极进入,并且在其内部进入外部环境的湿气,并且不产生焊接缺陷或引起的焊料缺陷 通过在外部电极的表面上析出玻璃成分。 该结构由主要由形成在Cu烧结电极层6a和6b上的Cu,Cu镀层7a和7b组成的Cu烧结电极层6a和6b形成,并且通过重结晶 处理,以及形成在Cu镀层7a和7b上的上侧镀层9a和9b。 在形成Cu镀层7a和7b之后,在Cu镀层7a和7b重结晶的温度范围内的温度下进行热处理至包含导电性的玻璃的温度 糊料不软化(包括),使得Cu镀层7a和7b重结晶。
    • 6. 发明授权
    • Hemming process and hemming apparatus
    • 起皱过程和折边机
    • US06378348B1
    • 2002-04-30
    • US09633337
    • 2000-08-04
    • Hiroshi Katsube
    • Hiroshi Katsube
    • B21D3902
    • B21D39/021Y10T29/53791
    • A hemming apparatus for vertically moving an upper mold toward a lower mold to thereby compress the marriage panel whereby the marriage panel is hemmed is disclosed. The apparatus further comprises a mechanism for moving the lower mold in the horizontal direction to allow the lower mold to be movable from the position to be hemmed facing to the upper mold and a position for setting the panel where the marriage panel is set. Also disclosed in a hemming process comprising setting one panel on another panel to form a marriage panel, and unifying these panels with each other by claming the marriage panel between an upper mold and a lower mold. The process involves the following steps: a first step for setting the marriage panel onto the lower mold by a transporting unit; a second step for moving the lower mold on which the marriage panel has been set to the position to be hemmed, facing to upper mold by means of a mechanism for moving the lower mold; and a third step for vertically moving the upper mold to the position corresponding to the lower mold moved to the position to be hemmed to thereby compress the marriage panel.
    • 公开了一种用于将上模垂直移动到下模的折边装置,从而压缩结婚面板,从而结婚面板卷起。 该装置还包括用于沿水平方向移动下模的机构,以允许下模可从被卷边的位置移动到上模,以及用于设置镶板的位置。 还公开了一种卷边工艺,包括在另一个面板上设置一个面板以形成结婚面板,并且通过在上模具和下模具之间粘合婚姻面板来彼此统一。 该过程涉及以下步骤:通过传送单元将婚姻面板设置在下模上的第一步骤; 第二步骤,通过用于移动下模的机构将已经设置有结婚面板的下模移动到被卷绕的位置,面向上模; 以及第三步骤,用于将上模垂直移动到与移动到被卷绕的位置的下模具相对应的位置,从而压缩结婚面板。
    • 10. 发明申请
    • Green pigment for color filter, green pigment dispersion, photosensitive color composition, color filter, and liquid crystal panel
    • 绿色颜料用于滤色器,绿色颜料分散体,感光色组合物,滤色片和液晶面板
    • US20060098316A1
    • 2006-05-11
    • US10520321
    • 2003-07-23
    • Masahiro TatsuzawaShunsuke SegaArata KudouEiichi KiuchiHiroshi KatsubeAkitaka Nishio
    • Masahiro TatsuzawaShunsuke SegaArata KudouEiichi KiuchiHiroshi KatsubeAkitaka Nishio
    • G02B5/22
    • G02F1/133516Y10T428/2982
    • An object of the present invention is to provide a green pigment for a color filter, capable of displaying the chromaticity coordinates not to be displayed by the conventional green pigments, having the excellent color strength as a green color which is not excessively strong in a blue tinge, and a high transmittance, and moreover, to provide a photosensitive color composition, a pigment dispersion, a color filter and a liquid crystal panel, using the above-mentioned green pigment. In order to achieve the above-mentioned object, the present invention provides a green pigment for a color filter comprised of a phthalocyanine green pigment and capable of expressing a region of xy-chromaticity coordinate enclosed by predetermined equations 1, 2 and 3 defined by the XYZ color system of the CIE when the green pigment is solely subjected to colorimetry. Moreover, using the above-mentioned green pigment, it provides a photosensitive color composition capable of forming a color filter having a wide color reproduction range and a high transmittance. Furthermore, it provides a color filter having a wide color reproduction range and a high transmittance with a green pixel formed using the above-mentioned photosensitive color composition, and a liquid crystal panel using the color filter.
    • 本发明的目的是提供一种滤色器用绿色颜料,其能够显示具有优异色强度的常规绿色颜料不显示的色度坐标作为蓝色不过强的绿色 色泽和高透射率,此外,使用上述绿色颜料提供感光色组合物,颜料分散体,滤色器和液晶面板。 为了实现上述目的,本发明提供了一种用于由酞菁绿颜料组成的滤色器的绿色颜料,并且能够表现由由以上所定义的预定方程1,2和3包围的xy色度坐标区域 当绿色颜料仅进行比色法时,CIE的XYZ色系。 此外,使用上述绿色颜料,可提供能够形成色彩再现范围宽,透光率高的滤色片的感光性颜料。 此外,它提供了具有宽的色彩再现范围和使用上述感光颜色组合物形成的绿色像素的高透射率的滤色器,以及使用该滤色器的液晶面板。