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1. 发明授权

US08969851B2 Detection device, photodiode array, and method for manufacturing the same 有权
标题翻译：检测装置，光电二极管阵列及其制造方法
公开(公告)号：US08969851B2
公开(公告)日：2015-03-03
申请号：US12965660
申请日：2010-12-10
申请人： Hiroshi Inada , Yasuhiro Iguchi , Youichi Nagai , Hiroki Mori , Kouhei Miura
发明人： Hiroshi Inada , Yasuhiro Iguchi , Youichi Nagai , Hiroki Mori , Kouhei Miura
IPC分类号： H01L29/06 , H01L27/146
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： The present invention provides an image pickup device used to capture an image of an object by receiving light in a near infrared region reflected from the object. The image pickup device includes semiconductor light-receiving elements each having a light-receiving layer with a band gap wavelength of 1.65 to 3.0 μm.
摘要翻译：本发明提供了一种用于通过在从物体反射的近红外区域中接收光来捕获对象的图像的图像拾取装置。图像拾取装置包括各自具有带隙波长为1.65至3.0μm的光接收层的半导体光接收元件。

2. 发明申请

US20130048838A1 SEMICONDUCTOR WAFER, LIGHT-RECEIVING ELEMENT, LIGHT-RECEIVING ELEMENT ARRAY, HYBRID-TYPE DETECTION DEVICE, OPTICAL SENSOR DEVICE, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR WAFER 有权
标题翻译：半导体晶体管，光接收元件，光接收元件阵列，混合型检测器件，光学传感器器件以及半导体器件的制造工艺
公开(公告)号：US20130048838A1
公开(公告)日：2013-02-28
申请号：US13640922
申请日：2010-12-03
申请人： Hiroki Mori , Yasuhiro Iguchi , Hiroshi Inada , Youichi Nagai , Kouhei Miura , Hideaki Nakahata , Katsushi Akita , Takashi Ishizuka , Kei Fujii
发明人： Hiroki Mori , Yasuhiro Iguchi , Hiroshi Inada , Youichi Nagai , Kouhei Miura , Hideaki Nakahata , Katsushi Akita , Takashi Ishizuka , Kei Fujii
IPC分类号： H01L31/101 , H01L31/18 , H01L33/06
CPC分类号： H01L31/03046 , B82Y20/00 , H01L27/1446 , H01L27/1467 , H01L31/035236 , Y02E10/544 , Y02P70/521
摘要： A light-receiving element includes an InP substrate 1, a light-receiving layer 3 having an MQW and located on the InP substrate 1, a contact layer 5 located on the light-receiving layer 3, a p-type region 6 extending from a surface of the contact layer 5 to the light-receiving layer, and a p-side electrode 11 that forms an ohmic contact with the p-type region. The light-receiving element is characterized in that the MQW has a laminated structure including pairs of an InxGa1-xAs (0.38≦x≦0.68) layer and a GaAs1-ySby (0.25≦y≦0.73) layer, and in the GaAs1-ySby layer, the Sb content y in a portion on the InP substrate side is larger than the Sb content y in a portion on the opposite side.
摘要翻译：光接收元件包括InP衬底1，具有MQW且位于InP衬底1上的光接收层3，位于光接收层3上的接触层5，从接触层5的表面与光接收层和与p型区域形成欧姆接触的p侧电极11。光接收元件的特征在于MQW具有包括In x Ga 1-x As（0.38和nlE; x＆lt; lE; 0.68）层和GaAs1-ySby（0.25＆amp; nlE; y＆nlE; 0.73）层的层的叠层结构，并且在GaAs1 -ySby层，InP衬底侧的部分中的Sb含量y大于相对侧的部分中的Sb含量y。

3. 发明授权

US08642943B2 Semiconductor wafer, light-receiving element, light-receiving element array, hybrid-type detection device, optical sensor device, and process for production of semiconductor wafer 有权
标题翻译：半导体晶片，受光元件，受光元件阵列，混合型检测装置，光学传感器装置以及半导体晶片的制造方法
公开(公告)号：US08642943B2
公开(公告)日：2014-02-04
申请号：US13640922
申请日：2010-12-03
申请人： Hiroki Mori , Yasuhiro Iguchi , Hiroshi Inada , Youichi Nagai , Kouhei Miura , Hideaki Nakahata , Katsushi Akita , Takashi Ishizuka , Kei Fujii
发明人： Hiroki Mori , Yasuhiro Iguchi , Hiroshi Inada , Youichi Nagai , Kouhei Miura , Hideaki Nakahata , Katsushi Akita , Takashi Ishizuka , Kei Fujii
IPC分类号： H01L31/101 , H01L31/18 , H01L33/06
CPC分类号： H01L31/03046 , B82Y20/00 , H01L27/1446 , H01L27/1467 , H01L31/035236 , Y02E10/544 , Y02P70/521
摘要： A light-receiving element includes an InP substrate 1, a light-receiving layer 3 having an MQW and located on the InP substrate 1, a contact layer 5 located on the light-receiving layer 3, a p-type region 6 extending from a surface of the contact layer 5 to the light-receiving layer, and a p-side electrode 11 that forms an ohmic contact with the p-type region. The light-receiving element is characterized in that the MQW has a laminated structure including pairs of an InxGa1-xAs (0.38≦x≦0.68) layer and a GaAs1-ySby (0.25≦y≦0.73) layer, and in the GaAs1-ySby layer, the Sb content y in a portion on the InP substrate side is larger than the Sb content y in a portion on the opposite side.
摘要翻译：光接收元件包括InP衬底1，具有MQW且位于InP衬底1上的光接收层3，位于光接收层3上的接触层5，从接触层5的表面与光接收层和与p型区域形成欧姆接触的p侧电极11。光接收元件的特征在于MQW具有包括In x Ga 1-x As（0.38 @ x @ 0.68）层和GaAs 1-ySby（0.25 @ y @ 0.73）层的对的层叠结构，并且在GaAs1-ySby InP衬底侧的部分中的Sb含量y大于相对侧的部分中的Sb含量y。

4. 发明授权

US09240429B2 Image pickup device and method for producing the same 有权
标题翻译：摄像装置及其制造方法
公开(公告)号：US09240429B2
公开(公告)日：2016-01-19
申请号：US14363723
申请日：2012-07-06
申请人： Hiroki Mori , Masaki Migita , Youichi Nagai
发明人： Hiroki Mori , Masaki Migita , Youichi Nagai
IPC分类号： H01L27/146 , H01L23/00 , H01L25/00
CPC分类号： H01L27/14636 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L25/50 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/11826 , H01L2224/11903 , H01L2224/1308 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13166 , H01L2224/13169 , H01L2224/1403 , H01L2224/14505 , H01L2224/16225 , H01L2224/16227 , H01L2224/7525 , H01L2224/75753 , H01L2224/81121 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2924/01322 , H01L2924/014 , H01L2924/35121 , H01L2924/00014 , H01L2924/0103 , H01L2924/00012 , H01L2924/01047 , H01L2924/00
摘要： An image pickup device includes a light-receiving device unit, a processing portion, a first connection body, and a second connection body. The first connection body electrically connects a first electrode of the light-receiving device unit to a corresponding second electrode of the processing portion. The first connection body includes an indium-containing solder portion disposed between the first electrode and the second electrode, and a barrier layer for suppressing alloying of the solder portion with the first electrode and the second electrode. The second connection body includes an alloy portion formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body.
摘要翻译：图像拾取装置包括光接收装置单元，处理部分，第一连接体和第二连接体。第一连接体将光接收装置单元的第一电极与处理部的相应的第二电极电连接。第一连接体包括设置在第一电极和第二电极之间的含铟焊料部分和用于抑制焊料部分与第一电极和第二电极的合金化的阻挡层。第二连接体包括通过与含有熔点等于或高于第一连接体的熔点的材料并且硬度高于第一连接体的硬度的焊料合金形成的合金部分。

5. 发明申请

US20140327101A1 IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME 有权
标题翻译：图像拾取装置及其制造方法
公开(公告)号：US20140327101A1
公开(公告)日：2014-11-06
申请号：US14363723
申请日：2012-07-06
申请人： Hiroki Mori , Masaki Migita , Youichi Nagai
发明人： Hiroki Mori , Masaki Migita , Youichi Nagai
IPC分类号： H01L27/146
CPC分类号： H01L27/14636 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L25/50 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/11826 , H01L2224/11903 , H01L2224/1308 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13166 , H01L2224/13169 , H01L2224/1403 , H01L2224/14505 , H01L2224/16225 , H01L2224/16227 , H01L2224/7525 , H01L2224/75753 , H01L2224/81121 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2924/01322 , H01L2924/014 , H01L2924/35121 , H01L2924/00014 , H01L2924/0103 , H01L2924/00012 , H01L2924/01047 , H01L2924/00
摘要： An image pickup device includes a light-receiving device unit, a processing portion, a first connection body, and a second connection body. The first connection body electrically connects a first electrode of the light-receiving device unit to a corresponding second electrode of the processing portion. The first connection body includes an indium-containing solder portion disposed between the first electrode and the second electrode, and a barrier layer for suppressing alloying of the solder portion with the first electrode and the second electrode. The second connection body includes an alloy portion formed by alloying with a solder containing a material having a melting point equal to or higher than a melting point of the first connection body and a hardness higher than that of the first connection body.
摘要翻译：图像拾取装置包括光接收装置单元，处理部分，第一连接体和第二连接体。第一连接体将光接收装置单元的第一电极与处理部的相应的第二电极电连接。第一连接体包括设置在第一电极和第二电极之间的含铟焊料部分和用于抑制焊料部分与第一电极和第二电极的合金化的阻挡层。第二连接体包括通过与含有熔点等于或高于第一连接体的熔点的材料并且硬度高于第一连接体的硬度的焊料合金形成的合金部分。

6. 发明授权

US09042776B2 Process unit 有权
标题翻译：处理单元
公开(公告)号：US09042776B2
公开(公告)日：2015-05-26
申请号：US14094216
申请日：2013-12-02
申请人： Masatoshi Shiraki , Hiroki Mori
发明人： Masatoshi Shiraki , Hiroki Mori
IPC分类号： G03G21/18
CPC分类号： G03G21/1817 , G03G21/1821 , G03G21/1825 , G03G21/1857 , G03G21/1864 , G03G2221/1687
摘要： A process unit includes a drum frame supporting a photoconductor drum and a development frame supporting a development roller. The development cartridge is swingably supported by the drum frame at a coupling joint provided at a first side of the development frame and a support portion provided at a second side of the development frame. A center of rotation of the development roller is located in a position shifted from a line segment connecting a center of rotation of the coupling joint and a center of rotation of the photoconductor drum to an upstream side with respect to a direction of rotation of the coupling joint as viewed in an axial direction of the development roller, such that the development roller is pressed against the photoconductor drum by the action of the rotatory force received by the coupling joint.
摘要翻译：处理单元包括支撑感光鼓的鼓框架和支撑显影辊的显影框架。显影盒由设置在显影框架的第一侧处的联接接头处的鼓框架可摆动地支撑，以及设置在显影框架的第二侧的支撑部分。显影辊的旋转中心位于从耦合接头的旋转中心和感光鼓的旋转中心相对于联接器的旋转方向的上游侧的线段偏移的位置在显影辊的轴向观察时，通过由联接接头接受的转动力使显影辊压靠在感光鼓上。

7. 发明授权

US09028940B2 Sheet roll and sheet-like coupling member 有权
标题翻译：板卷和片状联接件
公开(公告)号：US09028940B2
公开(公告)日：2015-05-12
申请号：US13182613
申请日：2011-07-14
申请人： Yoshinori Hasegawa , Hiroshi Adachi , Hiroki Mori , Kaoru Mitsugi , Naohiro Ikai
发明人： Yoshinori Hasegawa , Hiroshi Adachi , Hiroki Mori , Kaoru Mitsugi , Naohiro Ikai
IPC分类号： B32B3/00 , B32B3/06 , B32B3/08 , F16B5/00 , B65H21/00
CPC分类号： B65H21/00 , B65H2301/46325 , Y10T403/76 , Y10T428/19 , Y10T428/192 , Y10T428/197
摘要： A sheet roll comprises two glass films and a coupling portion, wherein end portions of the glass films are coupled together via the coupling portion and the coupled glass films are rolled into a roll shape. The coupling portion is a sheet-like coupling member formed of a resin film and placed on the end portions of the two glass films in a rolling direction so as to span therebetween. The sheet-like coupling member includes wide joint portions joined respectively to the end portions of the two glass films, and a necked portion which is narrower than the wide joint portions and is formed at a middle portion of the sheet-like coupling member in the rolling direction.
摘要翻译：片卷包括两个玻璃膜和耦合部分，其中玻璃膜的端部通过联接部分耦合在一起，并且将耦合的玻璃膜卷成卷状。联接部是由树脂膜形成的片状的连结部件，在两个玻璃膜的滚动方向的端部配置，以便在两者之间跨过。片状连接部件包括分别连接到两个玻璃膜的端部的宽接合部分和比宽接合部分窄的颈部，并且形成在片状连接部件的中间部分滚动方向。

8. 发明申请

US20150110991A1 LAMINATE, METHOD FOR CUTTING LAMINATE, METHOD FOR PROCESSING LAMINATE, AND DEVICE AND METHOD FOR CUTTING BRITTLE PLATE-LIKE OBJECT 有权
标题翻译：层压体，切割层压体的方法，加工层压体的方法，以及用于切割薄板状物体的装置和方法
公开(公告)号：US20150110991A1
公开(公告)日：2015-04-23
申请号：US14117127
申请日：2012-05-14
申请人： Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
发明人： Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
IPC分类号： B32B17/10 , B23K26/08 , B32B7/12 , B32B3/02 , B32B3/30 , B23K26/40 , C03B21/02
CPC分类号： B32B17/10155 , B23K26/083 , B23K26/40 , B23K2103/16 , B23K2103/172 , B23K2103/50 , B28D1/221 , B29C67/0044 , B32B17/10036 , B32B17/10293 , B32B17/10706 , B32B17/10743 , B32B17/1099 , B32B37/14 , B32B2250/40 , B32B2315/08 , B32B2457/12 , B32B2457/20 , B32B2457/208 , C03B33/04 , C03B33/074 , C03B33/076 , C03B33/091 , G02F1/133351 , Y10T156/1052 , Y10T156/1082 , Y10T428/24322 , Y10T428/24488 , B32B17/10 , B32B2369/00
摘要： Provided is a laminate (1) obtained by integrally laminating glass sheets (4) on both surfaces of a resin sheet (2). The glass sheets (4) have a thickness of 300 μm or less and end surfaces (4a) of the glass sheets (4) are chamfered.
摘要翻译：提供了通过在树脂片（2）的两个表面上整合玻璃板（4）而获得的层压体（1）。玻璃板（4）的厚度为300μm以下，玻璃板（4）的端面（4a）被倒角。

9. 发明授权

US08843027B2 Photosensitive cartridge 有权
标题翻译：感光墨盒
公开(公告)号：US08843027B2
公开(公告)日：2014-09-23
申请号：US13361593
申请日：2012-01-30
申请人： Hiroki Mori , Yasumasa Fujii
发明人： Hiroki Mori , Yasumasa Fujii
IPC分类号： G03G21/18 , G03G15/02
CPC分类号： G03G21/1814 , G03G15/0258
摘要： A photosensitive cartridge includes: a photosensitive member mounted to the photosensitive cartridge such that a surface thereof is movable in a first direction; an electric discharge electrode that extends in a second direction at an interval with the surface of the photosensitive member, the second direction being orthogonal to the first direction and parallel with the surface of the photosensitive member; a frame holding the photosensitive member and the electric discharge electrode and including an opening at an opposite side of the photosensitive member across the electric discharge electrode, the opening extending in the second direction; a cleaner movable along the opening so as to clean the electric discharge electrode; and a reinforcement member, which is a separate member from the cleaner, and which is contactable with the frame to reinforce a surrounding part of the opening.
摘要翻译：感光盒包括：安装到感光盒的感光件，使得其表面可在第一方向上移动; 放电电极，其在与感光构件的表面间隔开的第二方向上延伸，第二方向与第一方向正交并与感光构件的表面平行; 保持感光构件和放电电极并且在感光构件的相对侧的开口，横跨放电电极的框架，该开口沿第二方向延伸; 可沿着开口移动的清洁剂，以清洁放电电极; 以及加强构件，其是与清洁器分离的构件，并且可与框架接触以加强开口的周围部分。

10. 发明授权

US08769989B2 Cleaving apparatus for a band-like glass film and cleaving method for a band-like glass film 有权
标题翻译：用于带状玻璃膜的切割装置和带状玻璃膜的切割方法
公开(公告)号：US08769989B2
公开(公告)日：2014-07-08
申请号：US13296583
申请日：2011-11-15
申请人： Kaoru Mitsugi , Naohiro Ikai , Hiroshi Adachi , Hiroki Mori
发明人： Kaoru Mitsugi , Naohiro Ikai , Hiroshi Adachi , Hiroki Mori
IPC分类号： C03B21/02
CPC分类号： C03B21/02 , B65H2301/4127 , C03B33/0235 , C03B33/033 , C03B33/091
摘要： A cleaving apparatus holds at least one surface (effective surface) of a band-like glass film in a non-contact state to suppress a situation that wavy portions reach a region in which the band-like glass film is to be cleaved. The cleaving apparatus cleaves the band-like glass film, which is being conveyed in a longitudinal direction thereof, along a conveyance direction thereof using a thermal stress generated through localized heating and cooling of a heated region. The localized heating and the cooling is performed on a preset cleaving line extending along the conveyance direction of the band-like glass film. The cleaving apparatus includes an air knife for supplying air to a front surface of the band-like glass film to retain the film on a conveyor at a position on an upstream side of a cleaving region in the conveyance direction.
摘要翻译：切断装置在非接触状态下保持带状玻璃膜的至少一个表面（有效面），以抑制波状部到达将被剥离的带状玻璃膜的区域的情况。裂开装置利用通过加热区域的局部加热和冷却产生的热应力沿着其沿其输送方向切割沿其纵向方向被输送的带状玻璃膜。在沿着带状玻璃膜的输送方向延伸的预定的分割线上进行局部加热和冷却。劈裂装置包括用于向带状玻璃膜的前表面供给空气的气刀，以将膜保持在传送方向上在劈开区域的上游侧的位置。

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