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1. 发明申请

US20140054255A1 DEVICE FOR INJECTION MOLDING PREFORM, INJECTION MOLDING PROCESS, AND SYNTHETIC RESIN BOTTLE 有权
标题翻译：注塑成型设备，注射成型工艺和合成树脂瓶
公开(公告)号：US20140054255A1
公开(公告)日：2014-02-27
申请号：US14114393
申请日：2012-04-09
申请人： Hiroshi Hosokoshiyama , Yosuke Watanabe , Yosuke Watanabe
发明人： Hiroshi Hosokoshiyama , Yosuke Watanabe , Yosuke Watanabe
IPC分类号： B29D22/00 , B29B11/14 , B29C45/28
CPC分类号： B29D22/003 , B29B11/14 , B29B2911/1402 , B29B2911/1404 , B29B2911/14066 , B29B2911/14073 , B29B2911/1408 , B29B2911/14086 , B29B2911/1412 , B29B2911/14326 , B29C45/1603 , B29C45/1646 , B29C45/2806 , B29C49/0073 , B29C49/06 , B29C49/10 , B29C49/221 , B29K2105/253 , B29K2995/0021 , B29K2995/0067 , B29K2995/0069 , B29L2031/7158 , B65D1/0207 , B65D1/0215
摘要： Disclosed is an injection molding device and process for a test tube shaped preform, that can laminate a colored layer at certain positions with a certain thickness accurately. Included is a nozzle section, in which a molten main resin and second resin are joined together to form a joined resin mass, the nozzle section including: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped flow channel where the second resin joins the main resin, a first confluence where the main resin flows into the joined flow channel, a second confluence where the second resin flows into the joined flow channel wherein the first confluence is downstream of the second confluence, and a cylindrical shutoff pin inserted in the joined flow channel to open or close one or both the first and second confluences.
摘要翻译：公开了一种用于试管状预成型件的注射成型装置和方法，其可以在某些位置以一定的厚度精确地层压着色层。包括一个喷嘴部分，其中熔化的主要树脂和第二树脂被接合在一起以形成接合的树脂块，该喷嘴部分包括：主流动的主流动的外部流动通道，第二树脂流动，其中第二树脂与主树脂接合的圆柱形柱状流动通道，主要树脂流入接合流动通道的第一汇合处，第二聚合流体，其中第二树脂流入接合流动通道，其中第一汇合为在第二汇合点的下游，以及插入连接的流动通道中以打开或关闭第一和第二汇合中的一个或两个的圆柱形截止销。

2. 发明授权

US10300670B2 Injection molding process for making a preform 有权
公开(公告)号：US10300670B2
公开(公告)日：2019-05-28
申请号：US15829384
申请日：2017-12-01
申请人： Hiroshi Hosokoshiyama , Junichi Chiba , Yosuke Watanabe
发明人： Hiroshi Hosokoshiyama , Junichi Chiba , Yosuke Watanabe
IPC分类号： B29C45/16 , B29D22/00 , B29C49/00 , B29C49/22 , B65D1/02 , B29B11/14 , B29K105/00 , B29C49/06 , B29L31/00 , B29C49/10 , B29C45/28
摘要： Technical problems of this invention is to create an injection molding device and an injection molding process for a test tube shaped preform, that can laminate a colored layer at certain positions of a wall of the reform with a certain thickness in a manner of a high degree of accuracy.A feature associated with the injection molding device to solve these problem comprising a nozzle section, in which a molten main resin and a molten second resin are join together to form a joined resin mass, the nozzle section comprising: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped joined flow channel where the second resin from the inner flow channel joins the main resin from the outer flow channel, a first confluence disposed at a point where the main resin from the outer flow channel flows into the joined flow channel, a second confluence disposed at a point where the second resin flows into the joined flow channel wherein the first confluence is located downstream of the second confluence with a predetermined space left in between, and a cylindrical shutoff pin inserted slidably in the joined flow channel, wherein this shutoff pin is capable of shutting off or opening either or both of the first confluence and/or the second confluence, depending on the sliding position.

3. 发明授权

US09862157B2 Injection molding process of a preform for use in biaxial stretching and blow molding 有权
公开(公告)号：US09862157B2
公开(公告)日：2018-01-09
申请号：US14114393
申请日：2012-04-09
申请人： Hiroshi Hosokoshiyama , Junichi Chiba , Yosuke Watanabe
发明人： Hiroshi Hosokoshiyama , Junichi Chiba , Yosuke Watanabe
IPC分类号： B29C45/16 , B29D22/00 , B29C49/00 , B29C49/22 , B65D1/02 , B29B11/14 , B29K105/00 , B29C49/06 , B29L31/00 , B29C49/10 , B29C45/28
CPC分类号： B29D22/003 , B29B11/14 , B29B2911/1402 , B29B2911/1404 , B29B2911/14066 , B29B2911/14073 , B29B2911/1408 , B29B2911/14086 , B29B2911/1412 , B29B2911/14326 , B29C45/1603 , B29C45/1646 , B29C45/2806 , B29C49/0073 , B29C49/06 , B29C49/10 , B29C49/221 , B29K2105/253 , B29K2995/0021 , B29K2995/0067 , B29K2995/0069 , B29L2031/7158 , B65D1/0207 , B65D1/0215
摘要： Disclosed is an injection molding device and process for a test tube shaped preform, that can laminate a colored layer at certain positions with a certain thickness accurately. Included is a nozzle section, in which a molten main resin and second resin are joined together to form a joined resin mass, the nozzle section including: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped flow channel where the second resin joins the main resin, a first confluence where the main resin flows into the joined flow channel, a second confluence where the second resin flows into the joined flow channel wherein the first confluence is downstream of the second confluence, and a cylindrical shutoff pin inserted in the joined flow channel to open or close one or both the first and second confluences.

4. 发明授权

US08786992B2 Electrical apparatus with higher durability against surges 失效
标题翻译：具有较高耐久性的电气设备
公开(公告)号：US08786992B2
公开(公告)日：2014-07-22
申请号：US12727559
申请日：2010-03-19
申请人： Yoko Sumiyoshi , Junichi Fujiwara , Yosuke Watanabe
发明人： Yoko Sumiyoshi , Junichi Fujiwara , Yosuke Watanabe
IPC分类号： H01T4/08 , H01T4/06 , H01T4/10 , H01T4/16 , H01H9/06
CPC分类号： H02H9/06 , H01T4/08
摘要： An electrical apparatus, which is immovable in a facility, comprises plural electric circuits. Each electric circuit has one or more resistance elements and is connected to each input terminal connected a power source. The electric circuits are arranged positionally closely with each other. In each electric circuit, a desired functional circuit is connected in series to the resistance element, and a protection circuit is connected in series to the resistance element and connected in parallel with the functional circuit. A discharge member is provided in each electric circuit and arranged between each input terminal and the functional circuit. The discharge member includes a discharge gap which allows the discharge member to face with the discharge member of an adjacently arranged electric circuit.The discharge gap discharge deliberately to the adjacently positioned discharge member when a voltage applied to a selected electric circuit exceeds a predetermined voltage value.
摘要翻译：在设施中不可移动的电气设备包括多个电路。每个电路具有一个或多个电阻元件，并且连接到连接到电源的每个输入端子。电路彼此位置紧密地排列。在每个电路中，期望的功能电路与电阻元件串联连接，并且保护电路与电阻元件串联连接并与功能电路并联。在每个电路中设置放电构件，并且布置在每个输入端子和功能电路之间。放电构件包括放电间隙，其允许放电构件面对相邻布置的电路的放电构件。当施加到所选择的电路上的电压超过预定电压值时，放电间隙放电到相邻定位的放电构件。

5. 发明授权

US07345170B2 Crystal and solvate of 2-amino-6-benzyloxypurine and production methods thereof 有权
标题翻译： 2-氨基-6-苄氧基嘌呤的结晶和溶剂合物及其制备方法
公开(公告)号：US07345170B2
公开(公告)日：2008-03-18
申请号：US10500451
申请日：2003-04-03
申请人： Taketo Hayashi , Takehiko Kawakami , Yoshihiko Iwanaga , Yosuke Watanabe
发明人： Taketo Hayashi , Takehiko Kawakami , Yoshihiko Iwanaga , Yosuke Watanabe
IPC分类号： C07D473/18
CPC分类号： C07D473/18
摘要： The present invention can provide a solvate, a cubic crystal and a columnar crystal of 2-amino-6-benzyloxypurine by crystallization from (1) a solvent containing at least one kind of solvent selected from the group consisting of alcohol and water, (2) alcohol or (3) a water-containing solvent.
摘要翻译：本发明可以通过从（1）含有选自醇和水中的至少一种溶剂的溶剂（2）得到2-氨基-6-苄氧基嘌呤的溶剂合物，立方晶体和柱状晶体，（2））醇或（3）含水溶剂。

6. 发明申请

US20060079155A1 Wafer grinding method 审中-公开
标题翻译：晶圆磨削法
公开(公告)号：US20060079155A1
公开(公告)日：2006-04-13
申请号：US11244172
申请日：2005-10-06
申请人： Masaru Nakamura , Yosuke Watanabe , Satoshi Kobayashi , Noboru Takeda , Masanori Yoshida , Takashi Sanpei , Masahiro Murata
发明人： Masaru Nakamura , Yosuke Watanabe , Satoshi Kobayashi , Noboru Takeda , Masanori Yoshida , Takashi Sanpei , Masahiro Murata
IPC分类号： B24B1/00
CPC分类号： H01L21/302 , B23K26/40 , B23K2101/40 , B23K2103/50 , B24B7/228 , H01L21/02021
摘要： A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along the outer periphery at a location on the inside of the outer periphery by a predetermined distance; and a grinding step for grinding the surface to be ground of the wafer whose outer peripheral portion has been removed, to a predetermined finish thickness.
摘要翻译：一种用于研磨具有圆弧倒角外周面的晶片被研磨表面的晶片研磨方法，包括外周部分去除步骤，用于通过从晶片的一个表面侧施加激光来去除晶片的外周部分沿着所述外周的内侧的位置沿所述外周延伸预定距离; 以及研磨步骤，用于将已经除去外周部分的晶片的被研磨表面研磨至预定的精加工厚度。

7. 发明申请

US20060079069A1 Silicon wafer laser processing method and laser beam processing machine 有权
公开(公告)号：US20060079069A1
公开(公告)日：2006-04-13
申请号：US11242019
申请日：2005-10-04
申请人： Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
发明人： Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
IPC分类号： H01L21/324 , H01L21/42 , H01L21/477 , H01L21/26 , H01L21/30 , H01L21/46
CPC分类号： H01L21/268 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A silicon wafer laser processing method for forming a deteriorated layer along dividing lines formed on a silicon wafer in the inside of the silicon wafer by applying a laser beam along the dividing lines, wherein the wavelength of the laser beam is set to 1,100 to 2,000 nm.

8. 发明授权

US07897488B2 Dividing method for wafer having film on the front side thereof 有权
标题翻译：在其前侧具有膜的晶片的分割方法
公开(公告)号：US07897488B2
公开(公告)日：2011-03-01
申请号：US12468556
申请日：2009-05-19
申请人： Yosuke Watanabe , Ryugo Oba , Masaru Nakamura
发明人： Yosuke Watanabe , Ryugo Oba , Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2103/172 , B23K2103/50
摘要： A wafer dividing method for dividing a wafer having a film on the front side thereof. The wafer dividing method includes a modified layer forming step of applying a laser beam having a transmission wavelength to the substrate of the wafer from the front side thereof along the streets so that a focal point of the laser beam is set inside the substrate, thereby forming a modified layer in the substrate along each street, a film dividing step of applying a laser beam having an absorption wavelength to the film from the front side of the wafer along each street to thereby form a laser processed groove for dividing the film along each street, a back grinding step of grinding the back side of the substrate of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a wafer supporting step of attaching the wafer to a dicing tape supported to an annular frame, and a wafer breaking step of applying an external force to the wafer by expanding the dicing tape to thereby break the wafer along each street.
摘要翻译：一种用于在其前侧分割具有膜的晶片的晶片分割方法。晶片分割方法包括：修改层形成步骤，其沿着街道从其前侧向晶片的基板施加具有透射波长的激光束，使得激光束的焦点设置在基板内部，从而形成沿着每个街道的基板中的改性层，膜分离步骤，沿着每条街道从晶片的前侧向膜施加具有吸收波长的激光束，从而形成用于沿着每条街道分割膜的激光加工槽，后磨削步骤，研磨晶片的基板的背面，从而将晶片的厚度减小到预定厚度;晶片支撑步骤，将晶片附着到支撑在环形框架上的切割带;以及晶片通过扩大切割胶带将外力施加到晶片从而沿着每个街道破裂晶片的断裂步骤。

9. 发明授权

US07553777B2 Silicon wafer laser processing method and laser beam processing machine 有权
标题翻译：硅晶片激光加工方法和激光束加工机
公开(公告)号：US07553777B2
公开(公告)日：2009-06-30
申请号：US11242019
申请日：2005-10-04
申请人： Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
发明人： Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
IPC分类号： H01L21/00
CPC分类号： H01L21/268 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/78
摘要： A silicon wafer laser processing method for forming a deteriorated layer along dividing lines formed on a silicon wafer in the inside of the silicon wafer by applying a laser beam along the dividing lines, wherein the wavelength of the laser beam is set to 1,100 to 2,000 nm.
摘要翻译：一种硅晶片激光加工方法，其特征在于，通过沿着分割线施加激光，在形成于硅晶片内部的硅晶片上的分割线上形成劣化层，其中激光束的波长设定为1,100〜2000nm 。

10. 发明授权

US07538048B2 Laser beam processing machine 有权
标题翻译：激光束加工机
公开(公告)号：US07538048B2
公开(公告)日：2009-05-26
申请号：US11808384
申请日：2007-06-08
申请人： Satoshi Kobayashi , Keiji Nomaru , Yosuke Watanabe
发明人： Satoshi Kobayashi , Keiji Nomaru , Yosuke Watanabe
IPC分类号： H01L21/00
CPC分类号： B23K26/0613 , B23K26/0604 , B23K26/067 , B23K26/0838 , B23K26/40 , B23K2101/40 , B23K2103/52
摘要： A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.
摘要翻译：一种激光束处理机，包括：路径分布装置，用于将由脉冲激光束振荡装置振荡的脉冲激光束交替地分配到第一路径和第二路径;以及一个激光束，其穿过一条路径并被一个会聚透镜和通过另一路径并被聚光透镜会聚的另一激光束被施加在彼此沿着光轴方向相互偏移的不同聚焦点处，它们之间的时间间隔交替。

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