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    • 1. 发明授权
    • Process for isolation of isobutylene polymer
    • 异丁烯聚合物分离方法
    • US5739267A
    • 1998-04-14
    • US704607
    • 1996-09-16
    • Hiroshi FujisawaYoshikuni DeguchiKouji NodaMasakazu IsurugiMasanobu TamuraJunichi HazamaTsutomu IkedaShun Wachi
    • Hiroshi FujisawaYoshikuni DeguchiKouji NodaMasakazu IsurugiMasanobu TamuraJunichi HazamaTsutomu IkedaShun Wachi
    • C08F6/02C08F8/26C08F6/08C08F10/10
    • C08F6/02C08F8/26
    • Processes for the isolation of a telechelic isobutylene polymer in a non-aqueous system to prevent the generation of waste water having a solvent dissolved therein and processes for the preparation of a telechelic isobutylene polymer having more advantageous unsaturated groups. A process for the isolation of an isobutylene polymer includes a cationic polymerization reaction in a non-aqueous system in the presence of a catalyst MX.sub.n wherein M represents a metallic atom and X may be the same or different and represents a halogen atom or a monovalent hydrocarbon group. The process comprises conducting the cationic polymerization reaction, conducting a ligand exchange reaction of said catalyst, and then removing a component containing M. Another process for the isolation includes a cationic polymerization in a non-aqueous system in the presence of the catalyst, the process comprises producing a telechelic isobutylene polymer and at the same time removing the catalyst with an adsorption material capable of adsorbing an acid. Another process for the isolation comprises conducting a cationic polymerization reaction in a non-aqueous system in the presence of the catalyst; adding a compound represented by the general formula Q(OR).sub.m where Q is a metallic atom and R is hydrogen or a monovalent organic group to effect the dehydrochlorination reaction at the ends of the polymer and the ligand exchange reaction of the catalyst so as to produce a telechelic isobutylene polymer having an unsaturated group; and removing a component containing M.
    • PCT No.PCT / JP95 / 00486 Sec。 371日期1996年9月16日 102(e)1996年9月16日PCT PCT 1995年3月17日PCT公布。 WO95 / 25754 PCT出版物 日期1995年9月28日在非水系统中分离遥爪异丁烯聚合物的方法,以防止溶解有溶剂的废水的产生和制备具有更有利的不饱和基团的远电离子异丁烯聚合物的方法。 用于分离异丁烯聚合物的方法包括在非水系统中在催化剂MXn存在下的阳离子聚合反应,其中M表示金属原子,X可以相同或不同,表示卤素原子或一价烃 组。 该方法包括进行阳离子聚合反应,进行所述催化剂的配体交换反应,然后除去含有M的组分。另一种分离方法包括在催化剂存在下在非水系统中的阳离子聚合,该方法 包括制造遥爪异丁烯聚合物,同时用能够吸附酸的吸附材料除去催化剂。 另一种分离方法包括在催化剂存在下,在非水系统中进行阳离子聚合反应; 加入由通式Q(OR)m表示的化合物,其中Q是金属原子,R是氢或一价有机基团,以在聚合物的末端进行脱氯化氢反应和催化剂的配体交换反应,从而 产生具有不饱和基团的遥爪异丁烯聚合物; 并除去含有M的成分。
    • 2. 发明授权
    • Polyimide resin film and method of making said film
    • 聚酰亚胺树脂膜及其制造方法
    • US5300619A
    • 1994-04-05
    • US820864
    • 1992-03-18
    • Koji OkadaYoshihide OhnariToshinori MizuguchiJunichi Hazama
    • Koji OkadaYoshihide OhnariToshinori MizuguchiJunichi Hazama
    • B29C55/12B29K79/00B29L7/00B32B37/14C08G73/10C08J5/18H05K1/03C08G73/00B32B27/00
    • B32B37/144B29C55/12C08G73/1071C08J5/18H05K1/0346B29K2079/08B29L2031/3425C08J2379/08Y10S264/73Y10S428/91Y10T428/31721
    • A resin film useful mainly for fabricating flexible printed circuits, and a method of producing same. In the process of fabricating a flexible printed circuit board, a copper foil(2) is thermally bonded to a resin film(1), and the copper foil(2) is then etched to a predetermined pattern, in which case the board is generally subject to some dimensional change. In order to minimize such dimensional change it is arranged that the ratio(a/b) of the linear expansion coefficient(a) of the resin film(1) in the direction of mechanical feed(MD direction) to the linear expansion coefficient(b) of the resin film(1) in a direction perpendicular to the MD direction (TD direction) is more than 0.2 but less than 1.0 and that the linear expansion coefficient in MD direction is 0.4-2.0.times. 10.sup.-5 .degree..sup.-1. For such resin film is used a polyimide film containing more than 90% of a recurring unit expressed by a specified general formula. To produce such a resin film, film 1 is drawn by a factor of from 1.0 to 1.5 in MD direction and is also drawn by a factor of from 0.5 to 0.99 in TD direction.
    • PCT No.PCT / JP91 / 00673 Sec。 371日期:1992年3月18日 102(e)1992年3月18日PCT PCT 1991年5月20日PCT公布。 出版物WO91 / 17880 PCT 日本1991年11月28日。一种主要用于制造柔性印刷电路的树脂膜及其制造方法。 在制造柔性印刷电路板的过程中,将铜箔(2)热粘合到树脂膜(1)上,然后将铜箔(2)蚀刻成预定图案,在这种情况下,板通常 受到一些尺寸变化的影响。 为了使这种尺寸变化最小化,将树脂膜(1)的机械供给方向(MD方向)的线膨胀系数(a)与线膨胀系数(b)的比(a / b) )在与MD方向垂直的方向(TD方向)上大于0.2且小于1.0,MD方向的线膨胀系数为0.4-2.0×10-5度-1。 对于这种树脂膜,使用含有超过90%的由特定通式表示的重复单元的聚酰亚胺膜。 为了制造这样的树脂膜,将膜1在MD方向拉伸1.0〜1.5倍,在TD方向上拉伸0.5〜0.99倍。