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1. 发明申请

US20050280943A1 Slider and rotating disk type storage device 审中-公开
标题翻译：滑块和旋转盘式存储设备
公开(公告)号：US20050280943A1
公开(公告)日：2005-12-22
申请号：US11147799
申请日：2005-06-07
申请人： Hiroo Inoue , Taichi Nakamura , Kazutaka Okasaka , Akihiro Sera
发明人： Hiroo Inoue , Taichi Nakamura , Kazutaka Okasaka , Akihiro Sera
IPC分类号： G11B5/60
CPC分类号： G11B5/6082
摘要： A stable kinetic performance is to be exhibited even in the case of such a small-sized slider as Femto slider. In one embodiment, an air bearing surface (ABS) of a slider comprises a first pad constituting portion extending from a leading edge side to a trailing edge side, a second pad constituting portion and a third pad constituting portion formed on both sides of the first pad constituting portion and extending from the leading edge side to the trailing edge side, a connecting pad for connecting the first, second, and third pad constituting portions on the leading edge side, a first negative pressure portion formed by the first and second pad constituting portions and the connecting pad, a second negative pressure portion formed by the first and third pad constituting portions and the connecting pad, and an air trap portion formed on the leading edge side of the connecting pad.
摘要翻译：即使在如Femto滑块这样的小尺寸滑块的情况下也能够表现出稳定的动力学性能。在一个实施例中，滑块的空气轴承表面（ABS）包括从前缘侧到后缘侧延伸的第一衬垫构成部分，第二衬垫构成部分和形成在第一衬垫两侧的第三衬垫构成部分衬垫构成部分并且从前缘侧延伸到后缘侧，用于连接前缘侧上的第一，第二和第三衬垫构成部分的连接焊盘，由第一和第二焊盘构成的第一负压部分部分和连接焊盘，由第一和第三焊盘构成部分和连接焊盘形成的第二负压部分和形成在连接焊盘的前缘侧上的空气捕获部分。

2. 发明申请

US20050052784A1 Suspension assembly and magnetic disk drive 审中-公开
标题翻译：悬挂总成和磁盘驱动器
公开(公告)号：US20050052784A1
公开(公告)日：2005-03-10
申请号：US10897183
申请日：2004-07-21
申请人： Hiroo Inoue , Taichi Nakamura , Kohji Nakao , Akihiro Sera
发明人： Hiroo Inoue , Taichi Nakamura , Kohji Nakao , Akihiro Sera
IPC分类号： G11B21/21 , G11B5/48 , G11B5/60
CPC分类号： G11B5/6005 , G11B5/4833 , G11B5/486
摘要： A compact hard disk drive that operates silently at a low power consumption needs a suspension assembly that places a low load on the magnetic head. In one embodiment, a suspension assembly comprises a head arm mounted on a carriage shaft, a load beam capable of placing load on a magnetic head and serving as a beam, and a flexure assembly. The flexure assembly includes a flexure formed by processing a thin metal sheet, an insulating layer laminated to the flexure, a wiring pattern formed on the insulating layer, and a protective layer coating the wiring pattern. The flexure has a flexible part for placing load on the magnetic head, a gimbals to which the magnetic head is attached, and a base part attached to the head arm. The elastic part of the flexure generates a very load in the range of about 0.5 to about 1 g.
摘要翻译：以低功耗静音运行的小型硬盘驱动器需要一个将低负载放在磁头上的悬架组件。在一个实施例中，悬架组件包括安装在托架轴上的头臂，能够将负载放置在磁头上并用作梁的负载梁以及挠曲组件。弯曲组件包括通过处理薄金属片形成的挠曲，层压到挠曲件上的绝缘层，形成在绝缘层上的布线图案，以及涂覆布线图案的保护层。弯曲部具有用于将负载放置在磁头上的柔性部分，附接有磁头的万向节和附接到头臂的基部。挠曲件的弹性部分产生约0.5至约1g范围内的非常载荷。

3. 发明申请

US20050057848A1 Magnetic disk space 审中-公开
标题翻译：磁盘空间
公开(公告)号：US20050057848A1
公开(公告)日：2005-03-17
申请号：US10889827
申请日：2004-07-12
申请人： Kazutaka Okasaka , Hiroki Kitahori , Taichi Nakamura , Keishi Takahashi
发明人： Kazutaka Okasaka , Hiroki Kitahori , Taichi Nakamura , Keishi Takahashi
IPC分类号： G11B25/04 , G11B33/12 , G11B17/00
CPC分类号： G11B33/121 , G11B25/043
摘要： A portable, small magnetic disk drive to be mounted on a portable device operates silently at low power consumption. In one embodiment, a spindle motor is fixed to the bottom wall of a metal base plate formed in the shape of a box by press working. The spindle motor is provided with a fluid dynamic bearing (FDB). A spindle hub is supported on the FDB, and a small magnetic disk having a diameter of about 1.8 in. (45.7 mm) or below is mounted on the spindle hub and is fastened to the spindle hub with a top clamp. The rotating speed of the spindle motor is about 4200 rpm or below. Gram load for pressing a magnetic head toward the magnetic disk is about 0.5 gf or above and less than about 1.0 gf.
摘要翻译：要安装在便携式设备上的便携式小型磁盘驱动器以低功耗静音运行。在一个实施例中，主轴电动机通过冲压加工固定在形成为箱形的金属底板的底壁上。主轴电机设有流体动力轴承（FDB）。主轴毂支撑在FDB上，直径约为1.8英寸（45.7 mm）或以下的小型磁盘安装在主轴毂上，并用顶部夹具固定在主轴毂上。主轴电机的转速约为4200 rpm或更低。用于将磁头朝向磁盘按压的克负荷约为0.5gf或以上且小于约1.0gf。

4. 发明申请

US20070091506A1 Magnetic disk drive with air bearing surface design for data area expansion 审中-公开
标题翻译：磁盘驱动器带有空气轴承表面设计，用于数据区域扩展
公开(公告)号：US20070091506A1
公开(公告)日：2007-04-26
申请号：US11584380
申请日：2006-10-19
申请人： Taichi Nakamura , Akihiro Sera , Yasunori Kawamoto , Takaaki Deguchi
发明人： Taichi Nakamura , Akihiro Sera , Yasunori Kawamoto , Takaaki Deguchi
IPC分类号： G11B5/60
CPC分类号： G11B5/6005
摘要： Embodiment of the invention provides a magnetic disk drive that may suppress the decrease of a recording region by preventing a magnetic head slider from abutting a magnetic disk at the time of loading, and suppress the degradation of the flying characteristics. In one embodiment a magnetic disk drive of the present invention is provided with a magnetic head slider including a magnetic transducer, a ramp that unloads the magnetic head slider, and an actuator that moves the magnetic head slider. The magnetic head slider includes a rail surface that generates a positive pressure on an air-bearing surface, a step bearing surface, and a taper section that is formed to a slider corner section that is brought closest to the surface of a recording disk at the time of loading with a space from the rail surface and the step bearing surface.
摘要翻译：本发明的实施例提供一种磁盘驱动器，其可以通过防止磁头滑块在装载时抵靠磁盘来抑制记录区域的减小，并且抑制飞行特性的劣化。在一个实施例中，本发明的磁盘驱动器设置有磁头滑块，其包括磁换能器，卸载磁头滑块的斜面和移动磁头滑块的致动器。磁头滑动器包括在空气轴承表面上产生正压的轨道表面，台阶支承表面和形成在最靠近记录盘表面的滑块角部的锥形部分从轨道表面和台阶承载表面加载空间的时间。

5. 发明授权

US07245457B2 Magnetic disk drive using femto slider and having predetermined linear velocity and gram load configuration 失效
标题翻译：使用毫微微滑块的磁盘驱动器具有预定的线速度和克负载配置
公开(公告)号：US07245457B2
公开(公告)日：2007-07-17
申请号：US10902821
申请日：2004-07-30
申请人： Kenji Kuroki , Taichi Nakamura , Akira Tokizono , Akihiro Sera
发明人： Kenji Kuroki , Taichi Nakamura , Akira Tokizono , Akihiro Sera
IPC分类号： G11B5/48 , G11B17/02 , G11B5/60 , G11B5/54
CPC分类号： G11B5/4826 , G11B5/4833
摘要： A magnetic disk drive includes a magnetic disk and a femto slider. The magnetic disk has a minimum track linear velocity of 1 to 5 m/s. In one embodiment, the magnetic disk drive includes a negative pressure type femto slider and adopts a load/unload method. A gram load “GL” of a head suspension assembly HSA is set at a value exceeding about 3 mN and smaller than about 15 mN and a pitch static attitude “PSA” (deg) and pitch stiffness “Kp” (Nm/deg) satisfy the expression ((PSA×Kp)/GL)
摘要翻译：磁盘驱动器包括磁盘和毫微微滑块。磁盘具有1至5m / s的最小轨道线速度。在一个实施例中，磁盘驱动器包括负压型毫微微滑块，并采用加载/卸载方法。磁头悬挂组件HSA的克负载“GL”被设定为超过约3mN且小于约15mN的值，并且俯仰静态姿态“PSA”（deg）和俯仰刚度“Kp”（Nm / deg）满足表达式（（PSAxKp）/ GL）<0.25mm。结果，可以防止毫微微滑块假定称为双稳态高度的元稳定飞越高状态。此外，通过将俯仰静止姿态“PSA”设定为大于0度的值，可以防止滑块与称为半稳定阻力的磁盘表面发生元稳定接触的状态。

6. 发明申请

US20050275971A1 Femto slider for small form factor hard disk drive 失效
标题翻译： Femto滑块用于小尺寸硬盘驱动器
公开(公告)号：US20050275971A1
公开(公告)日：2005-12-15
申请号：US10902821
申请日：2004-07-30
申请人： Kenji Kuroki , Taichi Nakamura , Akira Tokizono , Akihiro Sera
发明人： Kenji Kuroki , Taichi Nakamura , Akira Tokizono , Akihiro Sera
IPC分类号： G11B21/21 , G11B5/48 , G11B5/60
CPC分类号： G11B5/4826 , G11B5/4833
摘要： A magnetic disk drive includes a magnetic disk and a femto slider. The magnetic disk has a minimum track linear velocity of 1 to 5 m/s. In one embodiment, the magnetic disk drive includes a negative pressure type femto slider and adopts a load/unload method. A gram load “GL” of a head suspension assembly HSA is set at a value exceeding about 3 mN and smaller than about 15 mN and a pitch static attitude “PSA” (deg) and pitch stiffness “Kp” (Nm/deg) satisfy the expression ((PSA×Kp)/GL)
摘要翻译：磁盘驱动器包括磁盘和毫微微滑块。磁盘具有1至5m / s的最小轨道线速度。在一个实施例中，磁盘驱动器包括负压型毫微微滑块，并采用加载/卸载方法。磁头悬挂组件HSA的克负载“GL”被设定为超过约3mN且小于约15mN的值，并且俯仰静态姿态“PSA”（deg）和俯仰刚度“Kp”（Nm / deg）满足表达式（（PSAxKp）/ GL）<0.25mm。结果，可以防止毫微微滑块假定称为双稳态高度的元稳定飞越高状态。此外，通过将俯仰静止姿态“PSA”设定为大于0度的值，可以防止滑块与称为半稳定阻力的磁盘表面发生元稳定接触的状态。

7. 发明申请

US20130241069A1 SEMICONDUCTOR BONDING STRUCTURE BODY AND MANUFACTURING METHOD OF SEMICONDUCTOR BONDING STRUCTURE BODY 有权
标题翻译：半导体结合体结构体的半导体结合体和半导体结合体的制造方法
公开(公告)号：US20130241069A1
公开(公告)日：2013-09-19
申请号：US13823463
申请日：2011-10-17
申请人： Taichi Nakamura , Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Yukihiro Ishimaru
发明人： Taichi Nakamura , Akio Furusawa , Shigeaki Sakatani , Hidetoshi Kitaura , Yukihiro Ishimaru
IPC分类号： H01L23/00
CPC分类号： H01L24/30 , B22F2999/00 , B23K1/0016 , B23K35/0238 , B23K35/26 , B23K35/262 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K2101/40 , B32B15/018 , C22C1/0483 , C22C5/02 , C22C5/06 , C22C9/00 , C22C9/02 , C22C13/00 , H01L21/563 , H01L23/4827 , H01L23/562 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/05147 , H01L2224/05639 , H01L2224/05647 , H01L2224/2733 , H01L2224/29 , H01L2224/29111 , H01L2224/29113 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/83065 , H01L2224/83439 , H01L2224/83444 , H01L2224/8381 , H01L2224/83815 , H01L2924/00015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/351 , H01L2924/3512 , H01L2924/00014 , B22F1/0003 , H01L2924/0105 , H01L2924/00 , H01L2924/00012 , H01L2924/01047 , H01L2924/01083 , H01L2924/01049 , H01L2924/01028 , H01L2224/45099
摘要： A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.
摘要翻译：一种接合结构体，其中半导体元件和电极通过焊料材料接合，其中允许接合的部分具有形成在电极侧的第一金属间化合物层，形成在第二金属间化合物层上的第二金属间化合物层半导体元件侧和由夹在第一金属间化合物层和第二金属间化合物层的两层之间的含有Sn和棒状金属间化合物部分的相位构成的第三层，类似金属间化合物部分被层间接合到第一金属间化合物层和第二金属间化合物层上。

8. 发明授权

US08421246B2 Joint structure and electronic component 有权
标题翻译：联合结构和电子元件
公开(公告)号：US08421246B2
公开(公告)日：2013-04-16
申请号：US12864826
申请日：2009-05-22
申请人： Akio Furusawa , Shigeaki Sakatani , Taichi Nakamura , Takahiro Matsuo
发明人： Akio Furusawa , Shigeaki Sakatani , Taichi Nakamura , Takahiro Matsuo
IPC分类号： H01L29/43
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译：接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及设置在镍层和焊料层之间的阻挡层。这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。

9. 发明授权

US08414704B2 Bonding structure and semiconductor device manufacturing apparatus 有权
标题翻译：接合结构和半导体器件制造装置
公开(公告)号：US08414704B2
公开(公告)日：2013-04-09
申请号：US12349682
申请日：2009-01-07
申请人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
发明人： Tomoyuki Fujii , Taichi Nakamura , Hiroshi Takebayashi
IPC分类号： B32B37/00 , C23C16/00 , H01L21/306 , B23B31/28
CPC分类号： H01L21/67103 , C23C16/4586 , H01L21/6833 , Y10T279/23
摘要： The present invention relates to a bonding structure, including: a ceramic member including a hole; a terminal embedded in the ceramic member, an exposed surface exposed to a bottom portion of the hole, and made of a refractory metal having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the ceramic member; a brazed bond layer including a first tantalum layer in contact with the exposed surface of the terminal, a gold layer formed on the first tantalum layer, and a second tantalum layer formed on the gold layer; and a connecting member inserted in the hole, bonded to the terminal via the brazed bond layer, and made of a refractory metal having a thermal expansion coefficient substantially equal to the thermal expansion coefficient of the ceramic member.
摘要翻译：本发明涉及一种接合结构，包括：陶瓷构件，其包括孔; 嵌入在所述陶瓷构件中的端子，暴露于所述孔的底部的暴露表面，并且由具有基本上等于所述陶瓷构件的热膨胀系数的热膨胀系数的耐热金属制成; 包括与端子的暴露表面接触的第一钽层，形成在第一钽层上的金层和形成在金层上的第二钽层的钎焊接合层; 以及插入孔中的连接构件，其通过钎焊接合层接合到端子，并且由具有基本上等于陶瓷构件的热膨胀系数的热膨胀系数的难熔金属制成。

10. 外观设计

USD647549S1 Shaft portion of an apparatus for holding and heating semiconductor wafers or the like 有权
公开(公告)号：USD647549S1
公开(公告)日：2011-10-25
申请号：US29323537
申请日：2008-08-27
申请人： Taichi Nakamura
设计人： Taichi Nakamura

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