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    • 7. 发明授权
    • Semiconductor device having Schottky junction electrode
    • 具有肖特基结电极的半导体器件
    • US07071526B2
    • 2006-07-04
    • US10518602
    • 2003-06-17
    • Yuji AndoHironobu MiyamotoYasuhiro OkamotoKensuke KasaharaTatsuo NakayamaMasaaki Kuzuhara
    • Yuji AndoHironobu MiyamotoYasuhiro OkamotoKensuke KasaharaTatsuo NakayamaMasaaki Kuzuhara
    • H01L27/095H01L29/47
    • H01L29/7787H01L29/2003H01L29/475H01L29/7781H01L29/812
    • A GaN semiconductor device with improved heat resistance of the Schottky junction electrode and excellent power performance and reliability is provided. In this semiconductor device having a Schottky gate electrode 17 which is in contact with an AlGaN electron supplying layer 14, a gate electrode 17 comprises a laminated structure wherein a first metal layer 171 formed of any of Ni, Pt and Pd, a second metal layer 172 formed of any of Mo, Pt, W, Ti, Ta, MoSi, PtSi, WSi, TiSi, TaSi, MoN, WN, TiN and TaN, and a third metal layer formed of any of Au, Cu, Al and Pt. Since the second metal layer comprises a metal material having a high melting point, it works as a barrier to the interdiffusion between the first metal layer and the third metal layer, and the deterioration of the gate characteristics caused by high temperature operation is suppressed. Since the first metal layer contacting the AlGaN electron supplying layer 14 has a high work function, the Schottky barrier is high, and superior Schottky contact is obtained.
    • 提供了具有肖特基接合电极的耐热性改善并且具有优异的功率性能和可靠性的GaN半导体器件。 在具有与AlGaN电子供给层14接触的肖特基栅电极17的该半导体器件中,栅电极17包括层叠结构,其中由Ni,Pt和Pd中的任一种形成的第一金属层171,第二金属层 由Mo,Pt,W,Ti,Ta,MoSi,PtSi,WSi,TiSi,TaSi,MoN,WN,TiN和TaN中的任一种形成的第一金属层,以及由Au,Cu,Al和Pt中的任一种形成的第三金属层。 由于第二金属层包括具有高熔点的金属材料,所以它作为第一金属层和第三金属层之间的相互扩散的障碍,并且抑制了由高温操作引起的栅极特性的劣化。 由于与AlGaN电子供给层14接触的第一金属层具有高功函数,所以肖特基势垒高,得到优异的肖特基接触。