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    • 4. 发明授权
    • Semiconductor device, field-effect transistor, and electronic device
    • 半导体器件,场效应晶体管和电子器件
    • US08659055B2
    • 2014-02-25
    • US13497557
    • 2010-06-16
    • Yasuhiro OkamotoKazuki OtaTakashi InoueHironobu MiyamotoTatsuo NakayamaYuji Ando
    • Yasuhiro OkamotoKazuki OtaTakashi InoueHironobu MiyamotoTatsuo NakayamaYuji Ando
    • H01L29/66H01L21/336
    • H01L29/7813H01L29/1054H01L29/2003H01L29/201H01L29/205H01L29/267H01L29/41741H01L29/41766H01L29/4236H01L29/66734
    • Provided is a semiconductor device capable of suppressing an occurrence of a punch-through phenomenon.A semiconductor device includes a substrate 1, a first n-type semiconductor layer 2, a p-type semiconductor layer 3, a second n-type semiconductor layer 4, a drain electrode 13, a source electrode 11, a gate electrode 12, and a gate insulation film 21, wherein the first n-type semiconductor layer 2, the p-type semiconductor layer 3, and the second n-type semiconductor layer 4 are laminated on the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 2. The source electrode 11 is in ohmic-contact with the second n-type semiconductor layer 4. An opening portion to be filled or a notched portion that extends from an upper surface of the second n-type semiconductor layer 4 to an upper part of the first n-type semiconductor layer 2 is formed at a part of the p-type semiconductor layer 3 and a part of the second n-type semiconductor layer 4. The gate electrode 12 is in contact with an upper surface of the first n-type semiconductor layer 2, side surfaces of the p-type semiconductor layer 3, and side surfaces of the second n-type semiconductor layer 4 at inner surfaces of the opening portion to be filled or a surface of the notched portion via the gate insulation film 21. The p-type semiconductor layer 3 has a positive polarization charge at a first n-type semiconductor layer 2 side in a state where a voltage is applied to none of the electrodes.
    • 提供能够抑制穿通现象发生的半导体装置。 半导体器件包括衬底1,第一n型半导体层2,p型半导体层3,第二n型半导体层4,漏极13,源电极11,栅电极12和 栅极绝缘膜21,其中第一n型半导体层2,p型半导体层3和第二n型半导体层4依次层压在基板1上。 漏电极13与第一n型半导体层2欧姆接触。源电极11与第二n型半导体层4欧姆接触。要填充的开口部分或延伸的缺口部分 从第二n型半导体层4的上表面到第一n型半导体层2的上部形成在p型半导体层3的一部分上,第二n型半导体层的一部分 栅电极12与第一n型半导体层2的上表面,p型半导体层3的侧表面和第二n型半导体层4的内表面的侧表面接触 待填充的开口部分或经由栅极绝缘膜21的切口部分的表面。在施加电压的状态下,p型半导体层3在第一n型半导体层2侧具有正极化电荷 没有电极。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    • 半导体器件和场效应晶体管
    • US20130113028A2
    • 2013-05-09
    • US13393002
    • 2010-06-23
    • Hironobu MIYAMOTOYasuhiro OKAMOTOYuji ANDOTatsuo NAKAYAMATakashi INOUEKazuki OTAKazuomi ENDO
    • Hironobu MIYAMOTOYasuhiro OKAMOTOYuji ANDOTatsuo NAKAYAMATakashi INOUEKazuki OTAKazuomi ENDO
    • H01L29/78
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。
    • 9. 发明申请
    • FIELD EFFECT TRANSISTOR
    • 场效应晶体管
    • US20110291160A1
    • 2011-12-01
    • US13147676
    • 2010-02-03
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • Kazuki OtaYasuhiro OkamotoHironobu Miyamoto
    • H01L29/778
    • H01L29/4236H01L29/1029H01L29/2003H01L29/42316H01L29/66462H01L29/66621H01L29/7783H01L29/7787
    • A field effect transistor includes a nitride-based semiconductor multi-layer structure, a source electrode (108), a drain electrode (109), a protective film (110), and a gate electrode (112) that is provided in a recess structure, which is formed by etching, directly or with a gate insulating film interposed therebetween. The nitride-based semiconductor multi-layer structure includes at least a base layer (103) made of AlXGa1-XN (0≦1), a channel layer (104) made of GaN or InGaN, a first electron supply layer (105), which is an undoped or n-type AlYGa1-YN layer, a threshold value control layer (106), which is an undoped AlZGa1-ZN layer, and a second electron supply layer (107), which is an undoped or n-type AlWGa1-WN layer, epitaxially grown in this order on a substrate (101) with a buffer layer (102) interposed therebetween. The Al composition of each layer in the nitride-based semiconductor multi-layer structure satisfies 0
    • 场效应晶体管包括氮化物基半导体多层结构,源电极(108),漏电极(109),保护膜(110)和设置在凹槽结构中的栅电极(112) ,其通过蚀刻直接形成,或者在其间插入栅极绝缘膜。 所述氮化物系半导体多层结构至少包括由Al x Ga 1-x N(0< n 1; 1)构成的基极层(103),由GaN或InGaN构成的沟道层(104),第1电子供给层(105) 其是未掺杂的或n型AlYGa1-YN层,作为未掺杂的AlZGa1-ZN层的阈值控制层(106)和作为未掺杂的或n型AlWGa1的第二电子供给层(107) -WN层,在衬底(101)上依次外延生长,缓冲层(102)插入其间。 氮化物系半导体多层结构中的各层的Al组成满足0