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    • 1. 发明授权
    • Semiconductor device and field effect transistor
    • 半导体器件和场效应晶体管
    • US08981434B2
    • 2015-03-17
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/76H01L29/812H01L29/201H01L29/78H01L29/06H01L29/20H01L29/205H01L29/417H01L29/423
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased. A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。
    • 3. 发明授权
    • Heterojunction field effect transistor, method for producing heterojunction field effect transistor, and electronic device
    • 异质结场效应晶体管,异质结场效应晶体管的制造方法和电子器件
    • US08674409B2
    • 2014-03-18
    • US13141449
    • 2009-12-25
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • Takashi InoueHironobu MiyamotoKazuki OtaTatsuo NakayamaYasuhiro OkamotoYuji Ando
    • H01L29/66
    • H01L29/7787H01L29/0843H01L29/2003H01L29/41766H01L29/42316H01L29/66462
    • A heterojunction filed effect transistor with a low access resistance, a low on resistance, and the like, a method for producing a heterojunction filed effect transistor and an electron device are provided. In the heterojunction field effect transistor, an electron transit layer 11 formed of a III-nitride semiconductor is formed on a substrate 10, an electron supply layer 12 formed of a III-nitride semiconductor forms a heterojunction with an upper surface of the electron transit layer 11, a gate electrode 14, a source electrode 15A, and a drain electrode 15B are arranged on the electron supply layer 12, n-type conductive layer regions 13A and 13B each extended from an upper part of the electron transit layer 11 to an upper surface of the electron supply layer 12 are provided in at least a part below the source electrode 15A and a part below the drain electrode 15B, and an n-type impurity concentration at a heterojunction interface of an electron transit layer 11 part of each of the n-type conductive layer regions 13A and 13B with the electron supply layer 12 is 1×1020 cm−3 or more.
    • 提供具有低访问阻抗,低导通电阻等的异质结场效应晶体管,提供了异质结场效应晶体管和电子器件的制造方法。 在异质结场效应晶体管中,在衬底10上形成由III族氮化物半导体形成的电子迁移层11,由III族氮化物半导体形成的电子供给层12与电子迁移层的上表面形成异质结 如图11所示,在电子供给层12上配置有栅电极14,源电极15A和漏电极15B,从电子渡越层11的上部延伸到上部的n型导电层区域13A,13B 电子供给层12的表面设置在源电极15A的下方以及漏电极15B的下方的至少一部分以及电子迁移层11的异质界面的n型杂质浓度 具有电子供给层12的n型导电层区域13A,13B为1×1020cm-3以上。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    • 半导体器件和场效应晶体管
    • US20120199889A1
    • 2012-08-09
    • US13393002
    • 2010-06-23
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • Hironobu MiyamotoYasuhiro OkamotoYuji AndoTatsuo NakayamaTakashi InoueKazuki OtaKazuomi Endo
    • H01L29/78
    • H01L29/8122H01L29/0657H01L29/2003H01L29/201H01L29/205H01L29/41741H01L29/41766H01L29/4236H01L29/7809H01L29/7812H01L29/7813H01L29/8128
    • Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased.A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.
    • 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。