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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110017991A1
    • 2011-01-27
    • US12934199
    • 2009-02-27
    • Satoshi TanimotoNorihiko KiritaniToshiharu MakinoMasahiko OguraNorio TokudaHiromitsu KatoHideyo OkushiSatoshi Yamasaki
    • Satoshi TanimotoNorihiko KiritaniToshiharu MakinoMasahiko OguraNorio TokudaHiromitsu KatoHideyo OkushiSatoshi Yamasaki
    • H01L29/12H01L29/06H01L29/22H01L29/16H01L29/24H01L29/20
    • H01L29/861H01L29/1602H01L29/1608H01L29/20H01L29/2003H01L29/22H01L29/45H01L29/452H01L29/456H01L29/47H01L29/475H01L29/872
    • In this junction element 1, when a forward voltage is applied, a depletion layer is formed in a semiconductor layer 2, prohibiting electrons present in an electrode layer 4 to move into the semiconductor layer 2. For this reason, a majority of holes in a semiconductor layer 3 do not disappear by recombination with conduction electrons in the semiconductor layer 2, but reach the electrode layer 4 while diffusing into the semiconductor layer 2. Accordingly, the junction element 1 can serve as a good conductor for holes, while avoiding the influence of a resistance value, and allows a current to flow therethrough at a level equal to or more than that achieved by a semiconductor element formed of a Si or SiC semiconductor. The present invention is applicable to any semiconductor material in which at least one of a donor level and an acceptor level is located at a sufficiently deep position beyond a thermal excitation energy at an operating temperature, such as diamond, zinc oxide (ZnO), aluminum nitride (AlN), or boron nitride (BN). The present invention is also applicable to even a material having a shallow impurity level at room temperature, such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or germanium (Ge), as long as operation is performed at such a low temperature that the thermal excitation energy can be sufficiently small.
    • 在该接合元件1中,当施加正向电压时,在半导体层2中形成耗尽层,禁止存在于电极层4中的电子移动到半导体层2中。因此,大部分孔 半导体层3不会通过与半导体层2中的导电电子的复合而消失,而是在扩散到半导体层2中的同时到达电极层4.因此,接合元件1可以用作孔的良导体,同时避免影响 的电阻值,并且允许电流以等于或大于由Si或SiC半导体形成的半导体元件实现的电平流过。 本发明可应用于任何半导体材料,其中施主电平和受主电平中的至少一个位于超过工作温度下的热激发能的足够深的位置,例如金刚石,氧化锌(ZnO),铝 氮化物(AlN)或氮化硼(BN)。 本发明甚至也可应用于诸如硅(Si),碳化硅(SiC),氮化镓(GaN),砷化镓(GaAs)或锗(Ge)等室温下具有浅杂质水平的材料, 只要在如此低的温度下进行操作即可使热激发能足够小。
    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09136400B2
    • 2015-09-15
    • US12934199
    • 2009-02-27
    • Satoshi TanimotoNorihiko KiritaniToshiharu MakinoMasahiko OguraNorio TokudaHiromitsu KatoHideyo OkushiSatoshi Yamasaki
    • Satoshi TanimotoNorihiko KiritaniToshiharu MakinoMasahiko OguraNorio TokudaHiromitsu KatoHideyo OkushiSatoshi Yamasaki
    • H01L21/00H01L29/861H01L29/16H01L29/20H01L29/22H01L29/45H01L29/47H01L29/872
    • H01L29/861H01L29/1602H01L29/1608H01L29/20H01L29/2003H01L29/22H01L29/45H01L29/452H01L29/456H01L29/47H01L29/475H01L29/872
    • In this junction element 1, when a forward voltage is applied, a depletion layer is formed in a semiconductor layer 2, prohibiting electrons present in an electrode layer 4 to move into the semiconductor layer 2. For this reason, a majority of holes in a semiconductor layer 3 do not disappear by recombination with conduction electrons in the semiconductor layer 2, but reach the electrode layer 4 while diffusing into the semiconductor layer 2. Accordingly, the junction element 1 can serve as a good conductor for holes, while avoiding the influence of a resistance value, and allows a current to flow therethrough at a level equal to or more than that achieved by a semiconductor element formed of a Si or SiC semiconductor. The present invention is applicable to any semiconductor material in which at least one of a donor level and an acceptor level is located at a sufficiently deep position beyond a thermal excitation energy at an operating temperature, such as diamond, zinc oxide (ZnO), aluminum nitride (AlN), or boron nitride (BN). The present invention is also applicable to even a material having a shallow impurity level at room temperature, such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), or germanium (Ge), as long as operation is performed at such a low temperature that the thermal excitation energy can be sufficiently small.
    • 在该接合元件1中,当施加正向电压时,在半导体层2中形成耗尽层,禁止存在于电极层4中的电子移动到半导体层2中。因此,大部分孔 半导体层3不会通过与半导体层2中的导电电子的复合而消失,而是在扩散到半导体层2中的同时到达电极层4.因此,接合元件1可以用作孔的良导体,同时避免影响 的电阻值,并且允许电流以等于或大于由Si或SiC半导体形成的半导体元件实现的电平流过。 本发明可应用于任何半导体材料,其中施主电平和受主电平中的至少一个位于超过工作温度下的热激发能的足够深的位置,例如金刚石,氧化锌(ZnO),铝 氮化物(AlN)或氮化硼(BN)。 本发明甚至也可应用于诸如硅(Si),碳化硅(SiC),氮化镓(GaN),砷化镓(GaAs)或锗(Ge)等室温下具有浅杂质水平的材料, 只要在如此低的温度下进行操作即可使热激发能足够小。
    • 9. 发明授权
    • Method and apparatus for fabricating quantum dot functional structure, quantum dot functional structure, and optically functioning device
    • 用于制造量子点功能结构,量子点功能结构和光学功能器件的方法和装置
    • US06648975B2
    • 2003-11-18
    • US09784300
    • 2001-02-16
    • Nobuyasu SuzukiToshiharu MakinoYuka YamadaTakehito YoshidaTakafumi SetoNobuhiro Aya
    • Nobuyasu SuzukiToshiharu MakinoYuka YamadaTakehito YoshidaTakafumi SetoNobuhiro Aya
    • C23C1400
    • B82Y30/00B22F9/12B22F2998/00B22F2999/00B82Y10/00C23C14/06C23C14/228C23C14/28H01L33/0054B22F1/0018B22F2202/11
    • The present invention is to fabricate a quantum dot functional structure having ultra-fine particles homogeneously distributed in a transparent medium by efficiently fabricating high-purity ultra-fine particles having a single particle diameter and uniform structure and depositing the ultra-fine particles onto a substrate in conjunction with the transparent medium. For these purposes, an apparatus for fabricating a quantum dot functional structure is provided. The apparatus comprises: an ultra-fine particle generating chamber for generating high-purity ultra-fine particles by exciting a semiconductor target with pulsed laser light in a low-pressure rare gas atmosphere, and then by allowing the semiconductor target to be detached or ejected by ablation reaction and condensed and grown in the gas; an ultra-fine particle classifying chamber for classifying the ultra-file particles; a depositing chamber for depositing the high-purity semiconductor ultra-fine particles and the transparent medium by exciting a transparent medium target with excimer laser light at the same time or alternately when the high-purity semiconductor ultra-fine particles are collected onto the substrate, and by collecting the substance generated through ablation reaction onto the substrate; and a carrier gas exhaust system.
    • 本发明通过有效地制造具有单一粒径和均匀结构的高纯度超细颗粒,并将超细颗粒沉积到基底上,制造均匀分布在透明介质中的超细颗粒的量子点功能结构 与透明介质一起使用。 为了这些目的,提供了一种用于制造量子点功能结构的装置。 该装置包括:超细颗粒发生室,用于通过在低压稀有气体气氛中用脉冲激光激发半导体靶,然后通过使半导体靶被分离或喷射而产生高纯度超细颗粒 通过消融反应并在气体中冷凝和生长; 用于对超微粒子进行分类的超细粒子分级室; 用于通过同时激发具有准分子激光的透明介质靶或者当高纯度半导体超细颗粒被收集到基板上时交替沉积高纯度半导体超细颗粒和透明介质的沉积室, 并通过将通过消融反应产生的物质收集到基底上; 和载气排气系统。