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    • 1. 发明授权
    • Method for purifying organometal compound
    • 有机金属化合物的纯化方法
    • US5783717A
    • 1998-07-21
    • US517093
    • 1995-08-21
    • Hiromi OhsakiToshinobu IshiharaKazuyuki AsakuraIsao KanekoKouhei Satou
    • Hiromi OhsakiToshinobu IshiharaKazuyuki AsakuraIsao KanekoKouhei Satou
    • C07F3/06C07F5/00C07F5/06C07F3/00
    • C07F5/063C07F3/06C07F5/00
    • A method for purifying an organometal compound by removing oxygen atom-containing compounds included in the organometal compound as impurities is herein disclosed. The method comprises the steps of mixing an organometal compound represented by the following formula: ##STR1## with a crude product including an oxygen atom-containing compound represented by the following formula: R.sub.3-n M.sup.1 (OR).sub.n or R.sub.2-m M.sup.2 (OR).sub.m and an alkylaluminum chloride represented by the formula: X.sub.6-q Al.sub.2 R and then distilling the resulting mixture. In the foregoing formulas, R's may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms; M.sup.1 represents a trivalent metal element; M.sup.2 represents a divalent metal element; n is an integer of 1, 2 or 3; m is an integer of 1 or 2; q is an integer ranging from 1 to 5; and X represents a chlorine atom.
    • 本文公开了通过除去作为杂质的有机金属化合物中包含的含氧原子的化合物来纯化有机金属化合物的方法。 该方法包括以下步骤:将由下式表示的有机金属化合物:< IMAGE>与由下式表示的含氧原子的化合物的粗产物:R3-n M1(OR)n或R2-m M2( OR)m和由式X6-qAl2R表示的烷基氯化铝,然后蒸馏所得混合物。 在上述式中,R可以相同或不同,表示碳原子数1〜3的烷基。 M1表示三价金属元素; M2表示二价金属元素; n为1,2或3的整数; m为1或2的整数; q为1〜5的整数; X表示氯原子。
    • 2. 发明授权
    • Vacuum processing apparatus
    • 真空加工设备
    • US07887669B2
    • 2011-02-15
    • US11683040
    • 2007-03-07
    • Kouhei SatouGo MiyaHiroshi Akiyama
    • Kouhei SatouGo MiyaHiroshi Akiyama
    • C23F1/00H01L21/306
    • H01J37/3244H01J37/32449
    • The invention provides a plasma processing apparatus for processing a wafer mounted on a sample stage placed in a vacuum processing chamber using a plasma generated in the vacuum chamber. The plasma processing apparatus comprises a plate placed in the vacuum processing vessel above and opposed to the wafer, the plate having a through hole through which a first processing gas is introduced; a first and second cylindrical member arranged vertically and adjacently; and means communicating with the gap between the first and second cylindrical member for supplying a second processing gas. The wafer is processed while the first processing gas and the second processing gas having different compositions are supplied.
    • 本发明提供一种等离子体处理装置,用于使用在真空室中产生的等离子体来处理安装在放置在真空处理室中的样品台上的晶片。 等离子体处理装置包括放置在真空处理容器中的与晶片相对的板,该板具有引入第一处理气体的通孔; 垂直和相邻布置的第一和第二圆柱形构件; 并且与第一和第二圆柱形构件之间的间隙连通以用于供应第二处理气体的装置。 在提供具有不同成分的第一处理气体和第二处理气体的同时处理晶片。
    • 3. 发明申请
    • VACUUM PROCESSING APPARATUS
    • 真空加工设备
    • US20080110400A1
    • 2008-05-15
    • US11683040
    • 2007-03-07
    • Kouhei SatouGo MiyaHiroshi Akiyama
    • Kouhei SatouGo MiyaHiroshi Akiyama
    • C23C16/00
    • H01J37/3244H01J37/32449
    • The invention provides a plasma processing apparatus for processing a wafer mounted on a sample stage placed in a vacuum processing chamber using a plasma generated in the vacuum chamber. The plasma processing apparatus comprises a plate placed in the vacuum processing vessel above and opposed to the wafer, the plate having a through hole through which a first processing gas is introduced; a first and second cylindrical member arranged vertically and adjacently; and means communicating with the gap between the first and second cylindrical member for supplying a second processing gas. The wafer is processed while the first processing gas and the second processing gas having different compositions are supplied.
    • 本发明提供一种等离子体处理装置,用于使用在真空室中产生的等离子体来处理安装在放置在真空处理室中的样品台上的晶片。 等离子体处理装置包括放置在真空处理容器中的与晶片相对的板,该板具有引入第一处理气体的通孔; 垂直和相邻布置的第一和第二圆柱形构件; 并且与第一和第二圆柱形构件之间的间隙连通以用于供应第二处理气体的装置。 在提供具有不同成分的第一处理气体和第二处理气体的同时处理晶片。
    • 8. 发明申请
    • PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
    • 等离子体蚀刻装置和等离子体蚀刻方法
    • US20100167426A1
    • 2010-07-01
    • US12723443
    • 2010-03-12
    • Naoyuki KofujiHiroshi AkiyamaKouhei Satou
    • Naoyuki KofujiHiroshi AkiyamaKouhei Satou
    • H01L21/66H01L21/3065
    • H01L21/32136H01L21/3065H01L21/31116H01L21/32137
    • The invention provides a method for overcoming the drawbacks of deteriorated throughput, deteriorated reproducibility and plasma discharge instability when continuous discharge is performed during multiple steps of plasma etching. The present invention provides a gas switching method for switching from gas supply source 101 to gas supply source 111, wherein the gas supply source 101 is switched to gas supply source 111 by opening a valve 114 in advance, setting a flow rate of MFC 112 to a flow rate used in the subsequent step, letting the gas supply source 111 to flow toward an exhaust means 5, and closing the valve 114 simultaneously when opening the valve 113, wherein a volume V1 of an area of a gas pipe 115 surrounded by the valve 113, the valve 114 and the MFC 112 is set sufficiently smaller than a volume Vo from the shower plate to the valve 113 including a gas reservoir 10 and a processing gas line 8. The present arrangement enables to prevent the occurrence of pressure undershoot and to solve the problem of discharge instability.
    • 本发明提供了一种在等离子体蚀刻的多个步骤中进行连续放电时,克服了劣化生产量,再现性劣化和等离子体放电不稳定性的缺陷的方法。 本发明提供一种从气体供给源101切换到气体供给源111的气体切换方法,其中,气体供给源101通过预先打开阀114而切换到气体供给源111,将MFC112的流量设定为 在后续步骤中使用的流量,使得气体供应源111朝向排气装置5流动,并且在打开阀113时同时关闭阀114,其中由管道115包围的气体管道115的区域的体积V1 阀113,阀114和MFC112被设定为足够小于从喷淋板到包括气体储存器10和处理气体管线8的阀113的体积Vo。本配置能够防止压力下冲的发生, 解决放电不稳定的问题。
    • 9. 发明申请
    • PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD
    • 等离子体蚀刻装置和等离子体蚀刻方法
    • US20080078505A1
    • 2008-04-03
    • US11670048
    • 2007-02-01
    • Naoyuki KofujiHiroshi AkiyamaKouhei Satou
    • Naoyuki KofujiHiroshi AkiyamaKouhei Satou
    • H01L21/306
    • H01L21/32136H01L21/3065H01L21/31116H01L21/32137
    • The invention provides a method for overcoming the drawbacks of deteriorated throughput, deteriorated reproducibility and plasma discharge instability when continuous discharge is performed during multiple steps of plasma etching. The present invention provides a gas switching method for switching from gas supply source 101 to gas supply source 111, wherein the gas supply source 101 is switched to gas supply source 111 by opening a valve 114 in advance, setting a flow rate of MFC 112 to a flow rate used in the subsequent step, letting the gas supply source 111 to flow toward an exhaust means 5, and closing the valve 114 simultaneously when opening the valve 113, wherein a volume V1 of an area of a gas pipe 115 surrounded by the valve 113, the valve 114 and the MFC 112 is set sufficiently smaller than a volume Vo from the shower plate to the valve 113 including a gas reservoir 10 and a processing gas line 8. The present arrangement enables to prevent the occurrence of pressure undershoot and to solve the problem of discharge instability.
    • 本发明提供了一种在等离子体蚀刻的多个步骤中进行连续放电时,克服了劣化生产量,再现性劣化和等离子体放电不稳定性的缺陷的方法。 本发明提供一种从气体供给源101切换到气体供给源111的气体切换方法,其中,气体供给源101通过预先打开阀114而切换到气体供给源111,将MFC112的流量设定为 在后续步骤中使用的流量,使得气体供应源111朝向排气装置5流动,并且在打开阀113时同时关闭阀门114,其中气体管道115的区域的体积V 1被 阀113,阀114和MFC112被设定为充分小于从喷淋板到包括气体储存器10和加工气体管线8的阀113的体积Vo。本发明能够防止压力下冲的发生 并解决放电不稳定的问题。