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    • 7. 发明申请
    • SPUTTERING TARGET MATERIAL, SILICON-CONTAINING FILM FORMING METHOD, AND PHOTOMASK BLANK
    • 溅射目标材料,含硅薄膜成型方法和光电隔离层
    • US20120100467A1
    • 2012-04-26
    • US13273656
    • 2011-10-14
    • Hideo KANEKOYokio INAZUKIHiroki YOSHIKAWA
    • Hideo KANEKOYokio INAZUKIHiroki YOSHIKAWA
    • C23C14/06G03F1/50C23C14/34
    • C23C14/3414C23C14/0036C23C14/0676C23C14/564G03F1/54
    • Provided is a silicon target material in which particles are not easily generated during a sputtering process and to form a low-defect (high quality) silicon-containing film. A silicon target material having a specific resistance of 20 Ω·cm or more at room temperature is used for forming a silicon-containing film. The silicon target material may be polycrystalline or noncrystalline. However, when the silicon target material is single-crystalline, a more stable discharge state can be obtained. Also, a single-crystal silicon in which crystals are grown by an FZ method is a preferable material as a highly-pure silicon target material because its content of oxygen is low. Further, a target material having n-type conductivity and containing donor impurities is preferable to obtain stable discharge characteristics. Only a single or a plurality of silicon target materials according to the present invention may be used for sputtering film formation of the silicon-containing film.
    • 提供了一种硅靶材料,其中在溅射工艺期间不容易产生颗粒并形成低缺陷(高质量)含硅膜。 使用在室温下电阻率为20Ω·cm·cm以上的硅靶材料形成含硅膜。 硅靶材料可以是多晶的或非晶的。 然而,当硅靶材料是单晶时,可以获得更稳定的放电状态。 此外,由于其含氧量低,因此通过FZ法生长晶体的单晶硅是优选的高纯度硅靶材料。 此外,优选具有n型导电性且含有供体杂质的靶材料,以获得稳定的放电特性。 根据本发明,只有一种或多种硅靶材料可用于溅射含硅膜的成膜。