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    • 2. 发明申请
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US20120043604A1
    • 2012-02-23
    • US13317781
    • 2011-10-28
    • Yoshimitsu MURASEKenya KOBAYASHIHideo YAMAMOTOAtsushi KANEKO
    • Yoshimitsu MURASEKenya KOBAYASHIHideo YAMAMOTOAtsushi KANEKO
    • H01L29/78
    • H01L29/7813H01L29/4236H01L29/66734
    • A semiconductor device includes a semiconductor layer, a first diffused region formed in the semiconductor layer, a second diffused region formed in the first diffused region, a trench formed in the semiconductor layer, a gate electrode disposed in the trench, a top surface of the gate electrode being lower than a top surface of the semiconductor layer and sagging downwards in a center thereof, a non-doped silicate glass film disposed in the trench and formed over the gate electrode, a top surface of the silicate glass film sagging downwards in a center thereof, an oxide film disposed in the trench and formed over the non-doped silicate glass film, a top surface of the oxide film sagging downwards in a center, and a source electrode formed over the semiconductor layer so that the source electrode contacts the first and second diffusion regions, and the oxide film at the top surface thereof.
    • 半导体器件包括半导体层,形成在半导体层中的第一扩散区域,形成在第一扩散区域中的第二扩散区域,形成在半导体层中的沟槽,设置在沟槽中的栅极电极, 栅电极低于半导体层的顶表面并且在其中心向下流动,设置在沟槽中并形成在栅电极上的未掺杂硅酸盐玻璃膜,硅酸盐玻璃膜的顶表面向下垂下 中心,设置在沟槽中并形成在非掺杂硅酸盐玻璃膜上的氧化物膜,氧化膜在中心向下垂的顶表面和形成在半导体层上的源电极,使得源电极接触 第一和第二扩散区,以及其顶表面处的氧化物膜。