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    • 8. 发明授权
    • Micro cross-section processing method
    • 微截面加工方法
    • US08304721B2
    • 2012-11-06
    • US12708896
    • 2010-02-19
    • Kouji IwasakiTatsuya Adachi
    • Kouji IwasakiTatsuya Adachi
    • H01L21/302H01L21/66H01J37/26H01J37/30
    • G21K5/04G01N23/2202G21K5/10H01J2237/31745H01J2237/31749
    • A micro cross-section processing method includes the steps of determining a linear cross-section estimated position including an observation object on a surface of the sample, irradiating the focused ion beam to the cross-section estimated position perpendicularly to or at a tilt angle to form a cross-section at a position in front of the cross-section estimated position, irradiating the focused ion beam to both ends of the cross-section to form side cuts extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam to a position on the surface of the cross-section and at a position deeper than the observation object to form a bottom cut extending to a position in rear of the cross-section estimated position, irradiating the focused ion beam along from the side cuts to the cross-section estimated position to form wedges connecting to the bottom cut, and applying impact to a region in front of the cross-section estimated position of the sample to cleave the vicinity of the cross-section estimated position between the wedges and form a plane of cleavage.
    • 微型横截面处理方法包括以下步骤:确定包括在样品表面上的观察对象的线性横截面估计位置,将聚焦离子束垂直于或以倾斜角照射到横截面估计位置, 在横截面估计位置前面的位置处形成横截面,将聚焦离子束照射到横截面的两端,以形成延伸到横截面估计位置后方的位置的侧切口 所述聚焦离子束到达所述横截面表面上的位置,并且位于比所述观察对象更深的位置,以形成延伸到所述横截面估计位置的后方的位置的底切口,从而沿着所述聚焦离子束照射 侧面切割到横截面估计位置以形成连接到底切口的楔形,并且对样品的横截面估计位置前面的区域施加冲击 以切割楔块之间的横截面估计位置附近并形成切割平面。