专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08700362B2 Wind turbine rotor designing method, wind turbine rotor design support device, wind turbine rotor design support program and wind turbine rotor 有权
标题翻译：风力发电机转子设计方法，风力发电机转子设计支撑装置，风力发电机转子设计支援计划和风力发电机转子
公开(公告)号：US08700362B2
公开(公告)日：2014-04-15
申请号：US12956746
申请日：2010-11-30
申请人： Hideyasu Fujioka , Akihiro Nakamura , Takao Kuroiwa , Yoshiyuki Hayashi , Yoshihiko Hayashi
发明人： Hideyasu Fujioka , Akihiro Nakamura , Takao Kuroiwa , Yoshiyuki Hayashi , Yoshihiko Hayashi
IPC分类号： G06F17/50 , G06F7/60 , G06G7/48
CPC分类号： F03D1/0633 , F05B2240/301 , F05B2270/20 , Y02E10/721
摘要： A designing method of a wind turbine rotor includes: providing operation environment data indicative of an operation environment of a wind turbine generator including the wind turbine rotor and design data of the wind turbine blade; calculating a position of a center of mass of the wind turbine blade in each position in a lengthwise direction of the wind turbine blade in the operation environment from the operation environment data and the design data; and calculating an evaluation value which is a value depending on an integral value obtained by integrating a product of the calculated position of the center of mass of the blade and a mass per unit length at each position in a lengthwise direction of the wind turbine blade from a blade root portion of the wind turbine blade to a blade tip end of the same.
摘要翻译：风力涡轮机转子的设计方法包括：提供指示包括风力涡轮机转子的风力涡轮发电机的运行环境的操作环境数据和风力涡轮机叶片的设计数据; 根据所述操作环境数据和所述设计数据，在所述运行环境中计算所述风力涡轮机叶片在所述风力涡轮机叶片的长度方向上的各个位置的质心位置; 以及计算评价值，该评估值是根据通过将计算出的叶片质心位置和每单位长度的质量的乘积的积分值在风力涡轮机叶片的长度方向上的每个位置处的积分值风力涡轮机叶片的叶片根部到其叶片尖端。

2. 发明授权

US09595377B2 Ceramic electronic component and method for producing ceramic electronic component 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US09595377B2
公开(公告)日：2017-03-14
申请号：US13602812
申请日：2012-09-04
申请人： Akihiro Nakamura , Atsushi Yamamoto , Yuko Nomiya
发明人： Akihiro Nakamura , Atsushi Yamamoto , Yuko Nomiya
IPC分类号： H01F5/00 , B32B37/14 , H01F17/00 , H01F1/34 , H01F17/04 , C04B35/26
CPC分类号： H01F41/041 , B32B15/20 , B32B18/00 , B32B37/06 , B32B2457/00 , C04B35/265 , C04B2235/3262 , C04B2235/3265 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/6025 , C04B2235/652 , C04B2235/6582 , C04B2235/6583 , C04B2235/6584 , C04B2237/68 , H01F1/344 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F27/323 , H01F41/122 , H01F2027/2809
摘要： A ceramic electronic component includes a ferrite material magnetic body part and a Cu conductive part, the ferrite containing 20 to 48% trivalent Fe in terms of Fe2O3 and divalent Ni. The ferrite can contain Mn so that it is less than 50% of the total of Fe and Mn in terms of Mn2O3 and Fe2O3. The magnetic and conductive parts are co-fired at a pressure not exceeding the equilibrium oxygen partial pressure of Cu—Cu2O thereby ensuring insulating performance and favorable electrical characteristics.
摘要翻译：陶瓷电子部件包括铁氧体材料磁性体部分和Cu导电部分，铁素体以Fe 2 O 3和二价Ni计为20〜48％的三价Fe。铁素体可以含有Mn，以Mn2O3和Fe2O3计少于Fe和Mn的总和的50％。在不超过Cu-Cu 2 O的平衡氧分压的压力下共同烧制磁性和导电部件，从而确保绝缘性能和良好的电特性。

3. 发明申请

US20140261880A1 LIQUID MEDICATION DISPENSING MACHINE 有权
标题翻译：液体药物分配机
公开(公告)号：US20140261880A1
公开(公告)日：2014-09-18
申请号：US14351993
申请日：2012-09-07
申请人： Akihiro Nakamura , Tetsuya Miyagi
发明人： Akihiro Nakamura , Tetsuya Miyagi
IPC分类号： B65B3/00
CPC分类号： B65B3/003 , B65B2210/08 , G07F13/00 , G07F17/0092
摘要： Provided is a liquid medication dispensing machine that can remove a liquid medication from one end of a supply pipe with higher reliability. The liquid medication dispensing machine includes a plurality of supply nozzles located at equal intervals through which liquid medications flow from a plurality of liquid medication bottles containing the liquid medications, respectively, to a prescription bottle. The plurality of supply nozzles are moved sequentially to a supply position where a supply nozzle faces an upper opening of the prescription bottle. The liquid medication dispensing machine further includes a cleaning unit that removes the liquid medication adhering to the supply nozzle. The supply nozzles are moved sequentially to a cleaning position where the cleaning unit removes the liquid medication from the supply nozzle. The cleaning position is provided at a position away from the supply position by a distance smaller than a spacing between the supply nozzles.
摘要翻译：提供了一种液体药物分配机，其可以以更高的可靠性从供给管的一端去除液体药物。液体药物分配机包括多个供应喷嘴，其间隔相等，液体药物分别从容纳液体药物的多个液体药物瓶流出到处方瓶中。多个供给喷嘴顺序地移动到供给喷嘴面向处方瓶的上部开口的供给位置。液体药物分配机还包括清除单元，该清洁单元除去附着在供应喷嘴上的液体药物。供应喷嘴依次移动到清洁单元，其中清洁单元从供应喷嘴去除液体药物。清洁位置设置在远离供给位置的距离小于供给喷嘴之间的距离的位置处。

4. 发明申请

US20140134310A1 PECTIC POLYSACCHARIDE AND METHOD FOR PRODUCING SAME 有权
标题翻译： PECTIC POLYACCHARIDE AND METHOD FOR PRODUCAME SAME
公开(公告)号：US20140134310A1
公开(公告)日：2014-05-15
申请号：US14128120
申请日：2012-06-21
申请人： Akihiro Nakamura , Junko Tobe , Norifumi Adachi
发明人： Akihiro Nakamura , Junko Tobe , Norifumi Adachi
IPC分类号： A23L2/66
CPC分类号： A23L2/66 , A23C9/137 , A23C11/106 , A23L2/52 , A23L2/68 , A23L29/238 , C08B37/0003 , C08B37/0045
摘要： The present invention provides a pectic polysaccharide, wherein a degree of methyl esterification of constituent galacturonic acid is 45% or less, a structure of a single molecule observed with an atomic force microscope comprises a star structure, and a diameter of the molecule is more than 100 nm and equal to or less than 200 nm.
摘要翻译：本发明提供一种果胶多糖，其中成分半乳糖醛酸的甲基酯化度为45％以下，用原子力显微镜观察到的单一分子的结构包含星形结构，分子的直径大于 100nm，等于或小于200nm。

5. 发明授权

US08629385B2 Solid-state imaging element and driving method of the solid-state imaging element 有权
标题翻译：固态成像元件和固态成像元件的驱动方法
公开(公告)号：US08629385B2
公开(公告)日：2014-01-14
申请号：US12705161
申请日：2010-02-12
申请人： Kaneyoshi Takeshita , Takashi Kubodera , Akihiro Nakamura
发明人： Kaneyoshi Takeshita , Takashi Kubodera , Akihiro Nakamura
IPC分类号： H01L27/00
CPC分类号： H01L27/14647 , H01L27/14609 , H01L27/1463 , H01L27/14641
摘要： Disclosed herein is a solid-state imaging element including: (A) a light reception/charge storage region formed in a semiconductor layer, the light reception/charge storage region including M light reception/charge storage layers stacked one on top of the other, where M≧2; (B) a charge output region formed in the semiconductor layer; (C) a conduction/non-conduction control region which includes a portion of the semiconductor layer located between the light reception/charge storage region and the charge output region; and (D) a conduction/non-conduction control electrode adapted to control the conduction or non-conduction state of the conduction/non-conduction control region, wherein mth potential control electrodes are provided between the mth and (m+1)th light reception/charge storage layers, where 1≦m≦(M−1), to control the potentials of the light reception/charge storage layers.
摘要翻译：本发明公开了一种固态成像元件，包括：（A）形成在半导体层中的光接收/电荷存储区域，所述光接收/电荷存储区域包括一个层叠在一起的M个光接收/电荷存储层，其中M> = 2; （B）形成在半导体层中的电荷输出区域; （C）导电/非导通控制区域，其包括位于光接收/电荷存储区域和电荷输出区域之间的半导体层的一部分; 和（D）适于控制导通/非导通控制区域的导通或非导通状态的导通/非导通控制电极，其中第m电位控制电极设置在第m和第（m + 1）个光接收/电荷存储层，其中1 @ m @（M-1），以控制光接收/电荷存储层的电位。

6. 发明授权

US08466990B2 Imaging apparatus and method, electronic device, and program 有权
标题翻译：成像设备和方法，电子设备和程序
公开(公告)号：US08466990B2
公开(公告)日：2013-06-18
申请号：US12805520
申请日：2010-08-04
申请人： Kazuki Nomoto , Akihiro Nakamura , Takashi Kubodera , Kaneyoshi Takeshita , Yukihiro Kiyota
发明人： Kazuki Nomoto , Akihiro Nakamura , Takashi Kubodera , Kaneyoshi Takeshita , Yukihiro Kiyota
IPC分类号： H04N5/217 , H04N5/228 , H04N9/64 , H04N3/14 , H04N5/335
CPC分类号： H04N5/3675
摘要： An imaging apparatus includes: an imaging unit configured to image an image using an imaging device; an image obtaining unit configured to obtain a plurality of images equivalent to the time of dark, imaged by the imaging unit; a registering unit configured to register, with an image obtained by the image obtaining unit, the address and change amount of a pixel where the output value of the pixel changes so as to exceed a predetermined threshold; and a correcting unit configured to correct, when taking a pixel corresponding to an address registered by the registering unit as a processing object pixel, the pixel value of the processing object pixel based on comparison between difference of the output values of the processing object pixel and a peripheral pixel of the processing object pixel, and the change amount of the processing object pixel.
摘要翻译：一种成像装置，包括：成像单元，被配置为使用成像装置对图像进行成像; 图像获取单元，被配置为获得由所述成像单元成像的等于黑暗时间的多个图像; 注册单元，被配置为用图像获取单元获得的图像登记像素的输出值改变以超过预定阈值的像素的地址和变化量; 以及校正单元，被配置为基于通过所述处理对象像素的输出值的差异与所述处理对象像素的输出值的差异来对所述处理对象像素的像素值进行比较，当对应于由所述登记单元登记的地址的像素作为处理对象像素时，处理对象像素的周边像素和处理对象像素的变化量。

7. 发明授权

US08362412B2 Solid-state image pickup element and driving method thereof 有权
标题翻译：固体摄像元件及其驱动方法
公开(公告)号：US08362412B2
公开(公告)日：2013-01-29
申请号：US12646512
申请日：2009-12-23
申请人： Takashi Kubodera , Akihiro Nakamura , Kaneyoshi Takeshita
发明人： Takashi Kubodera , Akihiro Nakamura , Kaneyoshi Takeshita
IPC分类号： H01L27/00 , H01L27/146
CPC分类号： H01L27/14647 , H01L27/14603 , H01L27/14609 , H01L27/1464 , H01L27/14641 , H01L27/14689
摘要： A solid-state image pickup element includes: (A) a light receiving/charge accumulating region formed in a semiconductor layer and formed by laminating M (where M≧2) light receiving/charge accumulating layers; (B) a charge outputting region formed in the semiconductor layer; (C) a depletion layer forming region formed of a part of the semiconductor layer, the part of the semiconductor layer being situated between the light receiving/charge accumulating region and the charge outputting region; and (D) a control electrode region for controlling a state of formation of a depletion layer in the depletion layer forming region, wherein the solid-state image pickup element further includes a light receiving/charge accumulating layer extending section extending from each light receiving/charge accumulating layer to the depletion layer forming region.
摘要翻译：固体摄像元件包括：（A）形成在半导体层中并通过层叠M（其中M≥2）光接收/电荷累积层形成的光接收/电荷累积区; （B）形成在半导体层中的电荷输出区域; （C）由半导体层的一部分形成的耗尽层形成区域，半导体层的一部分位于光接收/电荷累积区域和电荷输出区域之间; 以及（D）用于控制耗尽层形成区域中的耗尽层的形成状态的控制电极区域，其中所述固态摄像元件还包括从每个光接收/ 电荷累积层到耗尽层形成区域。

8. 发明授权

US08067313B2 Semiconductor device, method of manufacturing the same, and electronic apparatus 有权
标题翻译：半导体装置及其制造方法以及电子设备
公开(公告)号：US08067313B2
公开(公告)日：2011-11-29
申请号：US12657799
申请日：2010-01-28
申请人： Akihiro Nakamura
发明人： Akihiro Nakamura
IPC分类号： H01L21/302 , H01L21/461 , H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H01L27/14689 , H01L27/14609 , H01L27/14612 , H01L29/78
摘要： Disclosed is a method of manufacturing a semiconductor device including forming a transistor on a first surface of a device substrate, forming a hole in a second surface opposite to the first surface of the device substrate, and supplying hydrogen to a gate insulating film of the transistor from the second surface of the device substrate through the hole.
摘要翻译：公开了一种制造半导体器件的方法，包括在器件衬底的第一表面上形成晶体管，在与器件衬底的第一表面相对的第二表面中形成孔，并向晶体管的栅极绝缘膜提供氢从设备基板的第二表面通过孔。

9. 发明授权

US07795075B2 Flip chip mounting method by no-flow underfill having level control function 有权
标题翻译：倒装芯片安装方法采用无流量底部填充液位控制功能
公开(公告)号：US07795075B2
公开(公告)日：2010-09-14
申请号：US11901169
申请日：2007-09-14
申请人： Naruhiko Uemura , Akihiro Nakamura , Takashi Mori , Hirofumi Matsumoto
发明人： Naruhiko Uemura , Akihiro Nakamura , Takashi Mori , Hirofumi Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/81 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/757 , H01L2224/81208 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , Y10T29/53174 , H01L2224/0401
摘要： In a flip shop mounting method by no-flow underfill in which resin 54 is pre-coated on a substrate 52, and a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, the substrate 52 is placed on an upper surface of a base 11 of a reflow jig 10, the resin 54 highly filled with filler 55 is applied onto the substrate 52, the semiconductor 50 with bump is mounted at a predetermined position over the substrate 52, a press plate 21 is placed on an upper portion of the semiconductor 50, a spacer 13 is interposed between a lower surface of the press plate 21 and an upper surface of the base 11 to regulate an amount of press force of the press plate 21, and horizontal movement of the press plate 21 is regulated by positioning guide pins 15 on the upper surface of the base 11.
摘要翻译：在通过未流动的底部填充物的翻转车间安装方法中，树脂54预涂在基底52上，并且具有凸起的半导体50安装在基底52上，以将衬底52上的焊盘电极53接合到凸块51 ，将基板52放置在回流夹具10的基部11的上表面上，将高填充有填料55的树脂54施加到基板52上，将具有凸块的半导体50安装在基板52上的预定位置在半导体50的上部配置有压板21，在压板21的下表面与基座11的上表面之间插入间隔件13，以调节压板21的按压力通过在基座11的上表面上定位导销15来调节压板21的水平移动。

10. 发明申请

US20100193914A1 Semiconductor device, method of manufacturing the same, and electronic apparatus 有权
标题翻译：半导体装置及其制造方法以及电子设备
公开(公告)号：US20100193914A1
公开(公告)日：2010-08-05
申请号：US12657799
申请日：2010-01-28
申请人： Akihiro Nakamura
发明人： Akihiro Nakamura
IPC分类号： H01L23/00 , H01L21/50
CPC分类号： H01L27/14689 , H01L27/14609 , H01L27/14612 , H01L29/78
摘要： Disclosed is a method of manufacturing a semiconductor device including forming a transistor on a first surface of a device substrate, forming a hole in a second surface opposite to the first surface of the device substrate, and supplying hydrogen to a gate insulating film of the transistor from the second surface of the device substrate through the hole.
摘要翻译：公开了一种制造半导体器件的方法，包括在器件衬底的第一表面上形成晶体管，在与器件衬底的第一表面相对的第二表面中形成孔，并向晶体管的栅极绝缘膜提供氢从设备基板的第二表面通过孔。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式