专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5407871A Glass-ceramic composite 失效
标题翻译：玻璃陶瓷复合材料
公开(公告)号：US5407871A
公开(公告)日：1995-04-18
申请号：US230917
申请日：1994-04-21
申请人： Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
发明人： Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
IPC分类号： C04B35/195 , C03C10/00 , C03C10/08 , C03C14/00
CPC分类号： C03C10/0054 , C03C14/004 , C03C2214/20
摘要： The invention provides a glass-ceramic composite with sufficient strength and other excellent properties suitable for IC packages or multilayer substrates. The glass-ceramic composite of the invention includes crystallized glass and at least either of alumina and mullite at the ratio by weight of eighty through fifty-five to twenty through forty-five. The crystallized glass includes cordierite as primary crystals and contains 40 to 52 percent by weight of silicon dioxide or SiO.sub.2, 27 to 37 percent by weight of aluminum oxide or Al.sub.2 O.sub.3, 11 to 13 percent by weight of magnesium oxide or MgO, 2 to 8 percent by weight of diboron trioxides or B.sub.2 O.sub.3, 2 to 8 percent by weight of calcium oxide or CaO, and 0.1 to 3 percent by weight of zirconium oxide or ZrO.sub.2.
摘要翻译：本发明提供一种玻璃 - 陶瓷复合材料，其具有足够的强度和其它优异性能，适用于IC封装或多层基板。本发明的玻璃 - 陶瓷复合材料包括结晶玻璃和氧化铝和莫来石中的至少一种，其重量百分比为八十五至二十至四十五。结晶化玻璃包含堇青石作为主晶体，含有40〜52重量％的二氧化硅或SiO 2，27〜37重量％的氧化铝或Al 2 O 3，11〜13重量％的氧化镁或MgO，2〜8重量％的二氧化硼三氧化物或B 2 O 3，2〜8重量％的氧化钙或CaO，0.1〜3重量％的氧化锆或ZrO 2。

2. 发明授权

US5356841A Glass-ceramic composite 失效
标题翻译：玻璃陶瓷复合材料
公开(公告)号：US5356841A
公开(公告)日：1994-10-18
申请号：US841030
申请日：1992-02-25
申请人： Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
发明人： Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
IPC分类号： C04B35/195 , C03C10/00 , C03C10/08 , C03C14/00
CPC分类号： C03C10/0054 , C03C14/004 , C03C2214/20
摘要： The invention provides a glass-ceramic composite with sufficient strength and other excellent properties suitable for IC packages or multilayer substrates. The glass-ceramic composite of the invention includes crystallized glass and at least either of alumina and mullite at the ratio by weight of eighty through fifty-five to twenty through forty-five. The crystallized glass includes cordierite as primary crystals and contains 40 to 52 percent by weight of silicon dioxide or SiO.sub.2, 27 to 37 percent by weight of aluminum oxide or Al.sub.2 O.sub.3, 11 to 13 percent by weight of magnesium oxide or MgO, 2 to 8 percent by weight of diboron trioxides or B.sub.2 O.sub.3, 2 to 8 percent by weight of calcium oxide or CaO, and 0.1 to 3 percent by weight of zirconium oxide or ZrO.sub.2.
摘要翻译：本发明提供一种玻璃 - 陶瓷复合材料，其具有足够的强度和其它优异性能，适用于IC封装或多层基板。本发明的玻璃 - 陶瓷复合材料包括结晶玻璃和氧化铝和莫来石中的至少一种，其重量百分比为八十五至二十至四十五。结晶化玻璃包含堇青石作为主晶体，含有40〜52重量％的二氧化硅或SiO 2，27〜37重量％的氧化铝或Al 2 O 3，11〜13重量％的氧化镁或MgO，2〜8重量％的二氧化硼三氧化物或B 2 O 3，2〜8重量％的氧化钙或CaO，0.1〜3重量％的氧化锆或ZrO 2。

3. 发明授权

US5362551A Ceramic substrate 失效
标题翻译：陶瓷基板
公开(公告)号：US5362551A
公开(公告)日：1994-11-08
申请号：US189284
申请日：1994-01-31
申请人： Naoyuki Okamoto , Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
发明人： Naoyuki Okamoto , Hidetoshi Mizutani , Kazunori Miura , Kazuo Kondo
IPC分类号： C03C3/091 , C03C4/14 , C03C8/24 , C03C10/08 , C04B37/02 , C04B41/88 , H01L23/15 , H01L23/373 , H05K1/03 , H05K1/09 , H05K3/46 , B32B9/00
CPC分类号： C03C10/0054 , B32B18/00 , C04B37/021 , H01L23/15 , H01L23/3731 , C04B2235/6562 , C04B2237/341 , C04B2237/40 , C04B2237/401 , C04B2237/407 , C04B2237/62 , C04B2237/68 , C04B2237/704 , H01L2924/0002 , H01L2924/09701 , Y10T428/24926
摘要： A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening point of 1,000.degree. C. or less and a thermal expansion coefficient of from 1.5.times.10.sup.-6 /K to 4.0.times.10.sup.-6 /K as measured in a temperature range of from room temperature to 400.degree. C.
摘要翻译：一种陶瓷基片的描述主要由结晶玻璃组成，并具有填充有100重量份铜的导体材料的至少一个通孔，并形成1至30重量份的软化点为1000℃的玻璃在室温至400℃的温度范围内测定的热膨胀系数为1.5×10 -6 / K至4.0×10 -6 / K。

4. 发明授权

US5261950A Composition for metalizing ceramics 失效
标题翻译：金属化陶瓷的组成
公开(公告)号：US5261950A
公开(公告)日：1993-11-16
申请号：US903933
申请日：1992-06-26
申请人： Asao Morikawa , Kazunori Miura , Kazuo Kondo
发明人： Asao Morikawa , Kazunori Miura , Kazuo Kondo
IPC分类号： C04B41/51 , C04B41/88 , H05K1/09 , H01B1/02 , H01B1/08
CPC分类号： C04B41/88 , C04B41/009 , C04B41/5127 , C04B41/515 , H05K1/092 , C04B2111/00844
摘要： A composition for metalizing low temperature-fired ceramics according to the invention includes: a combination of two or three oxides selected from the group consisting of 1 to 8 percent by weight of bismuth(III) oxide (Bi.sub.2 O.sub.3), 0.1 to 5 percent by weight of MoO.sub.3, and 0.1 to 2 percent by weight of Cr.sub.2 O.sub.3 as well as a primary constituent, that is, mixture of copper (Cu) and copper(II) oxide (CuO) or mixture of copper(II) oxide (CuO) and copper(I) oxide (Cu.sub.2 O). The additives of the invention efficiently keep the resultant metalized layer out of cracks and prevent local sintering and burr of the metalized layer.
摘要翻译：根据本发明的用于金属化低温烧制陶瓷的组合物包括：选自1至8重量％的氧化铋（III）（Bi 2 O 3），0.1至5重量％的二氧化硅或三种氧化物的组合的MoO 3和0.1〜2重量％的Cr 2 O 3以及主要成分，即铜（Cu）和氧化铜（II）（CuO）或铜（II）的氧化物（CuO）和铜的混合物的混合物（I）氧化物（Cu 2 O）。本发明的添加剂有效地使得到的金属化层不发生裂纹，防止金属化层的局部烧结和毛刺。

5. 发明授权

US06170996B2 Optical module encapsulated with resin and manufacturing method therefor 失效
标题翻译：用树脂封装的光学模块及其制造方法
公开(公告)号：US06170996B2
公开(公告)日：2001-01-09
申请号：US09327679
申请日：1999-06-08
申请人： Kazunori Miura , Seimi Sasaki , Naoki Yamamoto
发明人： Kazunori Miura , Seimi Sasaki , Naoki Yamamoto
IPC分类号： G02B642
CPC分类号： G02B6/4212 , G02B6/3893 , G02B6/4204 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4253 , G02B6/4261 , G02B6/4292 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An optical module including a lead frame having a plurality of leads, a substrate mounted on the lead frame and having a plurality of conductive patterns, an optical element mounted on the substrate for making conversion between light and electricity, a sleeve placed on the substrate and having a front end adjacent to the optical element, and a first resin for encapsulating the optical element. The first resin has transparency to the light related to the optical element. The first resin is formed with a convex portion closing the front end of the sleeve. The conductive patterns of the substrate are connected through wires to the leads of the lead frame, respectively. The optical module further includes a molded second resin for enclosing all of the substrate, the optical element, the sleeve, the first resin, the wires, and the lead frame except a part of the sleeve and a part of each of the leads.
摘要翻译：一种光学模块，包括具有多个引线的引线框架，安装在引线框架上并具有多个导电图案的基板，安装在基板上用于使光和电转换的光学元件，放置在基板上的套筒和具有与光学元件相邻的前端，以及用于封装光学元件的第一树脂。第一树脂对于与光学元件相关的光具有透明度。第一树脂形成有封闭套筒前端的凸部。基板的导体图案分别通过引线连接到引线框架的引线。光学模块还包括模制的第二树脂，用于围绕所有基板，光学元件，套筒，第一树脂，导线和引线框架，除了套筒的一部分和每个引线的一部分之外。

6. 发明授权

US4511402A Sintered silicon nitride products and processes for fabrication thereof 失效
标题翻译：烧结氮化硅产品及其制造方法
公开(公告)号：US4511402A
公开(公告)日：1985-04-16
申请号：US640541
申请日：1984-08-14
申请人： Kazunori Miura , Yoshinori Hattori , Yasushi Matsuo
发明人： Kazunori Miura , Yoshinori Hattori , Yasushi Matsuo
IPC分类号： C04B35/584 , C04B35/591 , C04B35/593 , C22C29/00
CPC分类号： C04B35/584 , C04B35/593
摘要： A sintered silicon nitride products and processes for the fabrication thereof are described, wherein the product comprises from 60 to 98.9% by weight of silicon nitride, from 0.1 to 15% by weight of one or more chromium components selected from metal chromium, chromium oxide, and chromium nitride, and from 1 to 25% by weight of one or more oxides selected from oxides of rare earth elements, scandium oxide, yttrium oxide, aluminum oxide, zirconium oxide and silicon dioxide.
摘要翻译：描述了一种烧结氮化硅产品及其制造方法，其中该产品包含60至98.9重量％的氮化硅，0.1至15重量％的一种或多种选自金属铬，氧化铬，和氮化铬，以及1至25重量％的选自稀土元素氧化物，氧化钪，氧化钇，氧化铝，氧化锆和二氧化硅的一种或多种氧化物。

7. 发明申请

US20080317426A1 OPTICAL FIBER REEL 有权
标题翻译：光纤卷
公开(公告)号：US20080317426A1
公开(公告)日：2008-12-25
申请号：US12143341
申请日：2008-06-20
申请人： Norifumi SHUKUNAMI , Kazunori Miura , Hiroki Horiuchi
发明人： Norifumi SHUKUNAMI , Kazunori Miura , Hiroki Horiuchi
IPC分类号： G02B6/44
CPC分类号： G02B6/4457 , H01S3/06704 , H01S3/06754 , H01S3/1608
摘要： An optical fiber reel storing a plurality of optical fibers having an annular frame; a first reel portion provided around an radially outer peripheral surface of the annular frame and receiving at least one of the plurality of optical fibers wound up around the radially outer peripheral surface; and, a second reel portion provided radially inside the annular frame and housing at least one of the plurality of optical fiber therein.
摘要翻译：一种存储多个具有环形框架的光纤的光纤卷筒; 第一卷轴部分，设置在所述环形框架的径向外周表面周围并且容纳围绕所述径向外周表面缠绕的所述多根光纤中的至少一个; 以及第二卷轴部分，其设置在所述环形框架的径向内部并且容纳所述多根光纤中的至少一个光纤。

8. 发明授权

US06269209B1 Resin sealed optical module 失效
标题翻译：树脂密封光模块
公开(公告)号：US06269209B1
公开(公告)日：2001-07-31
申请号：US09127599
申请日：1998-07-31
申请人： Koji Terada , Taizo Nosaka , Goji Nakagawa , Kazuhiro Tanaka , Kazunori Miura , Yoshihiro Yoneda , Akira Fukushima
发明人： Koji Terada , Taizo Nosaka , Goji Nakagawa , Kazuhiro Tanaka , Kazunori Miura , Yoshihiro Yoneda , Akira Fukushima
IPC分类号： G02B626
CPC分类号： G02B6/42 , G02B6/4212 , G02B6/4239 , G02B6/424 , G02B6/4245 , G02B6/4246 , G02B6/4248 , G02B6/4253 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/00
摘要： An optical module including a substrate, an optical waveguide formed on the substrate, and an optical element mounted on the substrate so as to be optically coupled to an end of the optical waveguide, for performing conversion between light and electricity. The optical module further includes a transparent resin for covering at least an optical coupling portion between the optical waveguide and the optical element, and a thermoplastic resin for covering only the optical element and its periphery including the transparent resin to seal the optical element.
摘要翻译：一种光学模块，包括基板，形成在基板上的光波导和安装在基板上的光学元件，以光学耦合到光波导的端部，用于执行光和电之间的转换。光学模块还包括用于至少覆盖光波导和光学元件之间的光耦合部分的透明树脂，以及仅覆盖包括透明树脂的光学元件及其周边的热塑性树脂，以密封光学元件。

9. 发明授权

US5521438A Ceramic base and metallic member assembly 失效
标题翻译：陶瓷基座和金属构件组件
公开(公告)号：US5521438A
公开(公告)日：1996-05-28
申请号：US311053
申请日：1994-09-23
申请人： Naoyuki Okamoto , Kazunori Miura
发明人： Naoyuki Okamoto , Kazunori Miura
IPC分类号： H05K1/09 , H01L23/13 , H01L23/15 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/38 , H01L23/06 , H01L23/10 , H01L23/12
CPC分类号： H01L23/49811 , H05K1/111 , H01L2924/0002 , H01L2924/09701 , H05K1/0271 , H05K1/0306 , H05K2201/09736 , H05K3/3452 , Y02P70/611
摘要： In a ceramic base and metallic member assembly, a metallic member such as an input/output terminal is joined by solder to a ceramic base substrate by way of a stress relief layer. The ceramic base substrate has a metallized layer on which the stress relief layer is formed by plating. The stress relief layer is made of soft metal such as copper and has the thickness equal to or larger than 25 .mu.m. In one embodiment, a barrier made of glass or an organic insulating material for preventing outflow of solder is formed on a peripheral portion of a joining surface of the stress relief layer.
摘要翻译：在陶瓷基体和金属构件组件中，诸如输入/输出端子的金属构件通过焊料通过应力消除层与陶瓷基底基板接合。陶瓷基底具有通过电镀形成应力消除层的金属化层。应力消除层由诸如铜的软金属制成，并且具有等于或大于25μm的厚度。在一个实施例中，在应力消除层的接合表面的周边部分上形成用于防止焊料流出的由玻璃或有机绝缘材料制成的阻挡层。

10. 发明授权

US09508465B2 Reinforced wiring unit and sealing structure 有权
标题翻译：加强接线单元和密封结构
公开(公告)号：US09508465B2
公开(公告)日：2016-11-29
申请号：US13879726
申请日：2011-10-14
申请人： Kazunori Miura , Takatoshi Suzuki
发明人： Kazunori Miura , Takatoshi Suzuki
IPC分类号： H05K1/02 , H01B7/04 , H01R12/77 , H01R13/52
CPC分类号： H01B7/04 , H01R12/77 , H01R13/5205 , H05K1/02 , H05K2201/2009 , H05K2203/1147
摘要： Sealing performance between a sealing member and a reinforcing plate adhered to a wiring unit is prevent from being deteriorated. An FPC 1 is integrated with a sealing member 2, and a cover 3 is attached to a front end portion. On upper and lower surfaces of the FPC 1, reinforcing plates 12 each having a shape of a rectangular flat plate are arranged and adhered in an opposing manner interposing the FPC 1. The sealing member 2 is formed of elastic material such as rubber, and is fixedly attached to the FPC 1 such that the sealing member 2 covers the reinforcing plates 12 adhered to the upper and lower surfaces of the FPC 1 together with the FPC 1 located along front edges and rear edges of the reinforcing plates 12.
摘要翻译：防止密封构件与附着于布线单元的加强板之间的密封性能劣化。 FPC1与密封构件2一体化，盖3附接到前端部。在FPC1的上表面和下表面上，具有矩形平板形状的加强板12以相对的方式布置并粘附在FPC1上。密封件2由诸如橡胶的弹性材料形成，并且是固定地连接到FPC1，使得密封构件2与位于加强板12的前边缘和后边缘处的FPC1一起覆盖粘附到FPC1的上表面和下表面的加强板12。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式