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1. 发明授权

US5434426A Optical interconnection device 失效
标题翻译：光互连设备
公开(公告)号：US5434426A
公开(公告)日：1995-07-18
申请号：US118811
申请日：1993-09-10
申请人： Hideto Furuyama , Hiroshi Hamasaki , Mitsuhiro Kushibe , Katsuji Kaminishi , Tamon Kobayashi , Keiji Takaoka
发明人： Hideto Furuyama , Hiroshi Hamasaki , Mitsuhiro Kushibe , Katsuji Kaminishi , Tamon Kobayashi , Keiji Takaoka
IPC分类号： G02B6/43 , H01S3/00 , H01S5/00 , H01S5/183 , H01S5/50 , G02B27/00
CPC分类号： H01S5/5072 , G02B6/43 , H01S5/005 , H01S5/0264 , H01S5/0267 , H01S5/1032 , H01S5/1071 , H01S5/18308 , H01S5/18344 , H01S5/18358 , H01S5/2027
摘要： Disclosed herein is an optical interconnection device having a light source, a plurality of optical interconnecting elements, and a light-receiving element. The optical interconnecting elements are located on an output side of the light source. Each of the elements has first and second major surfaces and comprises an integral unit made of an optical semiconductor element and a grating lens having concentric annular grooves and concentric annular projections, and two electrodes formed on the first and second major surfaces, respectively. The optical semiconductor element and grating lens of each optical interconnecting element are formed on the first major surface, for emitting or receiving light. The light-receiving element is located on an output side of the optical interconnecting elements. The optical interconnecting elements are arranged at substantially regular intervals, each positioned such that the semiconductor element and the grating lens face to the same direction. The grating lens of each of the optical interconnecting elements has optical characteristic which compensates for light-transmitting characteristic corresponding to the interval between the optical connecting element and the next optical interconnecting element.
摘要翻译：这里公开了具有光源，多个光学互连元件和光接收元件的光学互连装置。光学互连元件位于光源的输出侧。每个元件具有第一和第二主表面，并且包括由光学半导体元件制成的整体单元和具有同心环形槽和同心环形突起的光栅透镜，以及分别形成在第一和第二主表面上的两个电极。每个光学互连元件的光学半导体元件和光栅透镜形成在第一主表面上，用于发射或接收光。光接收元件位于光互连元件的输出侧。光学互连元件以基本上规则的间隔布置，每个位置使得半导体元件和光栅透镜面向相同的方向。每个光学互连元件的光栅透镜具有光学特性，其补偿对应于光学连接元件和下一个光学互连元件之间的间隔的透光特性。

2. 发明授权

US5559918A Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer 失效
标题翻译：光电半导体模块，其中密封的光学半导体器件连接到电布线层
公开(公告)号：US5559918A
公开(公告)日：1996-09-24
申请号：US379282
申请日：1995-01-27
申请人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
发明人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译：一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体，用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。电配线层与光半导体装置电连接。

3. 发明授权

US5412748A Optical semiconductor module 失效
标题翻译：光半导体模块
公开(公告)号：US5412748A
公开(公告)日：1995-05-02
申请号：US160919
申请日：1993-12-03
申请人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
发明人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译：一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体，用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。电配线层与光半导体装置电连接。

4. 发明授权

US07589282B2 Wiring board and a semiconductor device using the same 失效
标题翻译：接线板和使用其的半导体器件
公开(公告)号：US07589282B2
公开(公告)日：2009-09-15
申请号：US10899154
申请日：2004-07-27
申请人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
发明人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
IPC分类号： H05K1/03
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/4232 , H01L2224/16225 , H01L2924/15311 , H05K1/0274 , H05K1/183 , H05K3/4602
摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
摘要翻译：布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

5. 发明授权

US07463491B2 Wiring board and a semiconductor device using the same 失效
标题翻译：接线板和使用其的半导体器件
公开(公告)号：US07463491B2
公开(公告)日：2008-12-09
申请号：US11707106
申请日：2007-02-16
申请人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
发明人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
IPC分类号： H05K7/00
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/4232 , H01L2224/16225 , H01L2924/15311 , H05K1/0274 , H05K1/183 , H05K3/4602
摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
摘要翻译：布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

6. 发明申请

US20070151752A1 Wiring board and a semiconductor device using the same 失效
标题翻译：接线板和使用其的半导体器件
公开(公告)号：US20070151752A1
公开(公告)日：2007-07-05
申请号：US11707106
申请日：2007-02-16
申请人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
发明人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
IPC分类号： H05K1/03
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/4232 , H01L2224/16225 , H01L2924/15311 , H05K1/0274 , H05K1/183 , H05K3/4602
摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
摘要翻译：布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

7. 发明申请

US20050063635A1 Wiring board and a semiconductor device using the same 失效
标题翻译：接线板和使用其的半导体器件
公开(公告)号：US20050063635A1
公开(公告)日：2005-03-24
申请号：US10899154
申请日：2004-07-27
申请人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
发明人： Hiroshi Yamada , Keiji Takaoka , Hideto Furuyama
IPC分类号： G02B6/12 , G02B6/42 , G02B6/43 , H01L23/12 , H05K1/02 , H05K1/18 , H05K3/46
CPC分类号： G02B6/43 , G02B6/4214 , G02B6/4232 , H01L2224/16225 , H01L2924/15311 , H05K1/0274 , H05K1/183 , H05K3/4602
摘要： A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
摘要翻译：布线板包括具有第一和第二芯板的芯复合层和光传输部分; 设置在所述芯复合层的一部分上的第一电极，适于将光学半导体模块安装在所述芯复合层上; 上下芯板布线布置在芯复合层的另一部分和下面; 以及堆叠在上下芯板布线上的上下叠层布线，适于安装半导体模块。

8. 发明授权

US07711237B2 Optical transmission line holding member, optical module and mounting method thereof 失效
标题翻译：光传输线保持部件，光模块及其安装方法
公开(公告)号：US07711237B2
公开(公告)日：2010-05-04
申请号：US12252702
申请日：2008-10-16
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/00
CPC分类号： G02B6/4239 , G02B6/4249
摘要： An optical transmission line holding member includes a main body that mechanically positions and holds an optical transmission line, and an electrical interconnection used to mount an optical element. The main body includes a holding hole which opens in one surface of the main body and is used to mechanically position and hold the optical transmission line, an guide hole which opens in another surface of the main body, has a diameter larger than that of the holding hole and is coaxially aligned with the holding hole, and a resin storage groove provided in the guide hole. The electrical interconnection is formed on the surface in which the holding hole opens.
摘要翻译：光传输线保持构件包括机械地定位和保持光传输线的主体以及用于安装光学元件的电互连。主体包括：保持孔，其在主体的一个表面上开口，用于机械地定位和保持光传输线，在主体的另一个表面上开口的引导孔的直径大于保持孔并与保持孔同轴对准，以及设置在引导孔中的树脂容纳槽。电互连形成在保持孔打开的表面上。

9. 发明授权

US07667311B2 LSI package provided with interface module, and transmission line header employed in the package 失效
标题翻译： LSI封装提供接口模块，并在封装中采用传输线头
公开(公告)号：US07667311B2
公开(公告)日：2010-02-23
申请号：US12098212
申请日：2008-04-04
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/02
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

10. 发明授权

US07401983B2 Method for manufacturing optical coupling part and optical coupling part 有权
标题翻译：制造光耦合部件和光耦合部件的方法
公开(公告)号：US07401983B2
公开(公告)日：2008-07-22
申请号：US11640861
申请日：2006-12-19
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/3696 , G02B6/4202
摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.
摘要翻译：在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

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