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    • 6. 发明授权
    • Prepreg for laminate and process for producing printed wiring-board
using the same
    • 用于制造印刷电路板的层压板用预浸料及其制造方法
    • US6124023A
    • 2000-09-26
    • US978599
    • 1997-11-26
    • Kiyonori FurutaTadahiko Yokota
    • Kiyonori FurutaTadahiko Yokota
    • B29C70/06B29K63/00B29K105/08B29L9/00B32B5/28B32B27/38C08G59/50C08J5/24C08K7/02C08L63/00H05K1/03H05K3/38H05K3/46B32B3/00
    • C08J5/24C08L63/00H05K3/381C08J2363/00Y10T428/24612Y10T428/2481Y10T428/24851
    • The problems are to provide a prepreg for laminate which can secure a heat resistance, electrical insulation properties and an adhesion strength of a conductor layer, a printed wiring-board which satisfies a high density and which is excellent in a heat resistance and electrical insulation properties upon utilizing the conventional production equipment and method of laminate pressing, and a process for producing the same.A prepreg for laminate characterized in that a paper-like or fabric-like substrate is impregnated with an epoxy resin composition capable of forming a roughened surface through roughening treatment, and a laminate obtained by using the same; a printed wiring-board obtained by using the printed wiring-board and a process for producing the same, which comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate; and a multi-layer printed wiring-board and a process for producing the same, which comprises (1) a step of laminating the prepreg for laminate with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.
    • 问题在于提供一种能够确保导体层的耐热性,电气绝缘性和粘合强度的层叠体的预浸料,满足高密度且耐热性和电绝缘性优异的印刷线路板 在利用传统的生产设备和层叠压制方法及其制造方法。 一种用于层压体的预浸料,其特征在于,通过粗糙化处理将能够形成粗糙化表面的环氧树脂组合物浸渍在纸状或织物状基材中,以及使用它们的层压体。 通过使用印刷线路板获得的印刷线路板及其制造方法,其包括(1)通过对层压体的表面进行粗糙化处理来形成粗糙化表面的步骤,以及(2) 在层压体的粗糙化表面上形成导体层的步骤; 和多层印刷线路板及其制造方法,其包括:(1)将层压材料的预浸料与内层材料层合以使得预浸料坯设置在表面上的步骤,并将其压制形成 层叠体,(2)使层叠体的表面进行粗糙化处理以形成粗糙面的工序,(3)在层叠体的粗糙化面上形成导体层的工序。