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1. 发明授权

US09457406B2 Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition 有权
标题翻译：铜金属膜，其制造方法，铜金属图案，使用铜金属图案的导电布线，铜金属凸块，导热路径，接合材料和液体组成
公开(公告)号：US09457406B2
公开(公告)日：2016-10-04
申请号：US13496550
申请日：2010-09-13
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
IPC分类号： B22F3/24 , B22F9/26 , B32B15/01 , C22C5/04 , C22C9/00 , H01B1/02 , H05K3/12 , B22F9/22 , B22F1/02 , H05K1/09 , H05K3/10
CPC分类号： B22F9/26 , B22F1/02 , B22F9/22 , B22F9/24 , B22F2201/01 , B22F2301/10 , B22F2302/25 , B22F2999/00 , B32B15/01 , C22C5/04 , C22C9/00 , H01B1/026 , H05K1/097 , H05K3/105 , H05K3/1283 , H05K2201/0224 , H05K2201/0272 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , Y10T156/10 , Y10T428/12903 , B22F2201/013 , B22F2202/13
摘要： Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
摘要翻译：公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。氧化铜优选为氧化铜（I）和/或氧化铜（II）。过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

2. 发明申请

US20120175147A1 COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDING MATERIAL, AND LIQUID COMPOSITION 有权
标题翻译：铜金属膜，其制造方法，铜金属图案，使用铜金属图案的导电布线，铜金属布，热导电路，粘合材料和液体组合物
公开(公告)号：US20120175147A1
公开(公告)日：2012-07-12
申请号：US13496550
申请日：2010-09-13
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Katsuyuki Masuda , Yoshinori Ejiri , Maki Inada , Kyoko Kuroda
IPC分类号： H01B5/00 , B05D3/10 , B05D1/12 , C09D11/02 , B32B37/00 , B32B15/01 , B32B15/00 , B05D3/00 , B05D3/06
CPC分类号： B22F9/26 , B22F1/02 , B22F9/22 , B22F9/24 , B22F2201/01 , B22F2301/10 , B22F2302/25 , B22F2999/00 , B32B15/01 , C22C5/04 , C22C9/00 , H01B1/026 , H05K1/097 , H05K3/105 , H05K3/1283 , H05K2201/0224 , H05K2201/0272 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , Y10T156/10 , Y10T428/12903 , B22F2201/013 , B22F2202/13
摘要： Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film obtained by treating a copper-based particle deposition layer containing both copper oxides and a metallic transition metal or alloy, or a transition metal complex containing a metal element, with gaseous formic acid and/or formaldehyde heated to 120° C. or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
摘要翻译：公开了一种对基板具有良好粘合性的铜金属膜，体积电阻率小，以及良好的深部金属性质; 以及铜金属膜的制造方法，其中可以通过将基板还原到其深部而不损坏基板来制造铜金属膜。具体公开了通过将含有氧化铜和金属过渡金属或合金的铜基颗粒沉积层或含有金属元素的过渡金属络合物与加热至120℃的气态甲酸和/或甲醛处理而获得的铜金属膜 ℃以上。氧化铜优选为氧化铜（I）和/或氧化铜（II）。过渡金属，合金或金属络合物优选为分别选自Cu，Pd，Pt，Ni，Ag，Au和Rh的金属，含金属的合金或含金属元素的复合物。

3. 发明申请

US20120170241A1 PRINTING INK, METAL NANOPARTICLES USED IN THE SAME, WIRING, CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：印刷墨水，其中使用的金属纳米颗粒，布线，电路板和半导体封装
公开(公告)号：US20120170241A1
公开(公告)日：2012-07-05
申请号：US13496528
申请日：2010-09-13
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Yoshinori Ejiri , Katsuyuki Masuda , Kyoko Kuroda , Maki Inada
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Shunya Yokosawa , Yoshinori Ejiri , Katsuyuki Masuda , Kyoko Kuroda , Maki Inada
IPC分类号： H05K7/02 , C09D11/02 , B82Y30/00
CPC分类号： C09D11/52 , C09D11/322 , H05K1/097
摘要： Disclosed is a printing ink comprising Cu- and/or CuO-containing metal nanoparticles, which obtains excellent dispersion properties and successive dispersion stability without using additives such as dispersing agents. Specifically disclosed is a printing ink that comprises Cu- and/or CuO-containing metal nanoparticles and has no more than 2,600 ppm of ionic impurities in the total solid content. The printing ink is obtained by dispersing the Cu- and/or CuO-containing metal nanoparticles, which have no more than 2,600 ppm of ionic impurities in the total solid content, in a dispersion medium.
摘要翻译：公开了一种包含含有Cu和/或CuO的金属纳米颗粒的印刷油墨，其不需使用分散剂等添加剂，可获得优异的分散性和连续的分散稳定性。具体公开了一种包含含Cu和/或CuO的金属纳米颗粒并且在总固体含量中不超过2600ppm的离子杂质的印刷油墨。印刷油墨是通过在分散介质中分散具有不超过2600ppm的总固体含量的离子杂质的含Cu和/或CuO的金属纳米颗粒而获得的。

4. 发明申请

US20100233011A1 METHOD FOR FORMING A COPPER WIRING PATTERN, AND COPPER OXIDE PARTICLE DISPERSED SLURRY USED THEREIN 审中-公开
标题翻译：形成铜线图案的方法和使用的铜氧化物颗粒分散浆料
公开(公告)号：US20100233011A1
公开(公告)日：2010-09-16
申请号：US12739228
申请日：2008-10-20
申请人： Hideo Nakako , Kazunori Yamamoto , Youichi Machii , Yasushi Kumashiro , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Youichi Machii , Yasushi Kumashiro , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： B22F7/04 , B22F1/02 , B32B15/02
CPC分类号： H05K3/102 , H01B1/026 , H01B1/22 , H01L21/4867 , H01L23/49866 , H01L2924/0002 , H01L2924/09701 , H05K3/105 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , Y10T428/12181 , H01L2924/00
摘要： There are provided are a method wherein a surface treating agent, which is essential for making copper particles antioxidative and dispersing the copper particles in the prior art, is hardly used but copper particles, which cause little electromigration and are small in the price rate of material itself, are used to form a low-resistance copper wiring pattern while the generation of cracks therein is restrained; and a copper oxide particle dispersed slurry used therein.The method is a method for forming a copper wiring pattern including the step of using a dispersion slurry wherein copper based particles having a copper oxide surface are dispersed to form any pattern over a substrate, and the step of reducing the copper oxide surface of the copper based particles in the pattern with atomic form hydrogen to return the oxide to copper, and sintering particles of the copper metal generated by the reduction and bonding the particles to each other.
摘要翻译：提供了一种方法，其中对现有技术中的铜颗粒进行抗氧化和分散是必需的表面处理剂几乎不被使用，但是导致电迁移少的材料和材料的价格率小的铜颗粒本身用于形成低电阻铜布线图案，同时抑制其中的裂纹的产生; 和其中使用的氧化铜颗粒分散浆料。该方法是一种形成铜布线图案的方法，包括使用其中分散有铜氧化物表面的铜基颗粒在基底上形成任何图案的分散浆料的步骤，以及还原铜的氧化铜表面的步骤以原子形式形成氢以将氧化物返回到铜，以及烧结通过还原并将颗粒彼此结合而产生的铜金属的颗粒。

5. 发明授权

US08801971B2 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution 有权
标题翻译：铜导体膜及其制造方法，导电性基板及其制造方法，铜导体布线及其制造方法以及处理液
公开(公告)号：US08801971B2
公开(公告)日：2014-08-12
申请号：US12808768
申请日：2008-12-17
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： H01B1/00 , H01B1/12 , C22C9/00 , C21B11/10 , B05D5/12 , B28B19/00 , B29B15/00 , C23C18/00 , C23C20/00 , C23C24/00 , C23C26/00 , C23C28/00 , C23C30/00 , H01C17/06 , H05K3/00 , B22F3/00 , B22F3/26 , B22F5/00 , B22F7/00 , C22C28/00 , C22C29/00 , B32B15/20
CPC分类号： H05K3/182 , C23C18/1601 , C23C18/1603 , C23C18/1633 , C23C18/1635 , C23C18/1637 , C23C18/1824 , C23C18/1872 , C23C18/30 , C23C18/40 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29294 , H01L2224/29347 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/203 , H05K3/105 , H05K3/1241 , H05K2203/0315 , H05K2203/0709 , H05K2203/1157 , H05K2203/125 , Y10T428/12014 , Y10T428/12903 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/0002
摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.
摘要翻译：提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

6. 发明申请

US20120125659A1 COPPER CONDUCTOR FILM AND MANUFACTURING METHOD THEREOF, CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF, COPPER CONDUCTOR WIRING AND MANUFACTURING METHOD THEREOF, AND TREATMENT SOLUTION 有权
标题翻译：铜导体膜及其制造方法，导电基板及其制造方法，铜导体布线及其制造方法及处理方案
公开(公告)号：US20120125659A1
公开(公告)日：2012-05-24
申请号：US12808768
申请日：2008-12-17
申请人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
发明人： Hideo Nakako , Kazunori Yamamoto , Yasushi Kumashiro , Youichi Machii , Shunya Yokozawa , Yoshinori Ejiri , Katsuyuki Masuda
IPC分类号： H01B5/00 , C22B15/00 , C09K3/00 , B05D3/00 , B32B15/20 , C22C9/00 , B05D5/12
CPC分类号： H05K3/182 , C23C18/1601 , C23C18/1603 , C23C18/1633 , C23C18/1635 , C23C18/1637 , C23C18/1824 , C23C18/1872 , C23C18/30 , C23C18/40 , H01L24/29 , H01L2224/29 , H01L2224/2919 , H01L2224/29294 , H01L2224/29347 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/09701 , H01L2924/12042 , H01L2924/19043 , H01L2924/203 , H05K3/105 , H05K3/1241 , H05K2203/0315 , H05K2203/0709 , H05K2203/1157 , H05K2203/125 , Y10T428/12014 , Y10T428/12903 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/0002
摘要： Provided are a copper conductor film and manufacturing method thereof, and patterned copper conductor wiring, which have superior conductivity and wiring pattern formation, and with which there is no decrease in insulation between circuits, even at narrow wiring widths and narrow inter-wiring spacing. Disclosed are a copper conductor film and manufacturing method thereof in which a copper-based particle-containing layer, which contains both a metal having catalytic activity toward a reducing agent and copper oxide, is treated using a treatment solution that contains a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complex to form metallic copper in a single solution, and patterned copper conductor wiring that is obtained by patterning a copper-based particle-containing layer using printing and by said patterned particle-containing layer being treated by a treatment method using a solution that contains both a reagent that ionizes or complexes copper oxide and a reducing agent that reduces copper ions or copper complexes to form metallic copper in a single solution.
摘要翻译：提供一种铜导体膜及其制造方法，并且具有优良的导电性和布线图案形成的图案化的铜导体布线，即使在窄的布线宽度和窄的布线间距下也不会降低电路之间的绝缘。公开了一种铜导体膜及其制造方法，其中含有对还原剂具有催化活性的金属和含有氧化铜的两者的铜基颗粒含有层使用含有电离的试剂的处理溶液或复合铜氧化物和还原剂，其在单一溶液中还原铜离子或铜络合物以形成金属铜，以及通过使用印刷图案化含铜基颗粒的层和通过所述图案化的含有颗粒的图案形成的图案化的铜导体布线层通过使用包含电离或复合氧化铜的试剂和还原剂的溶液进行处理，所述试剂在单一溶液中还原铜离子或铜络合物以形成金属铜。

7. 发明授权

US10322572B2 Adhesive agent, adhesive material using the same, and method of use thereof 有权
公开(公告)号：US10322572B2
公开(公告)日：2019-06-18
申请号：US13445420
申请日：2012-04-12
申请人： Katsuyuki Masuda , Takehiro Fukuyama , Eiichi Shinada , Masashi Okoshi , Kazunori Yamamoto , Masatoshi Yamaguchi , Yasushi Ooyama , Yuuki Yanagita , Mitsuo Katayose
发明人： Katsuyuki Masuda , Takehiro Fukuyama , Eiichi Shinada , Masashi Okoshi , Kazunori Yamamoto , Masatoshi Yamaguchi , Yasushi Ooyama , Yuuki Yanagita , Mitsuo Katayose
IPC分类号： C09J177/06 , C09J179/08 , B32B43/00 , C08G69/26 , C08G69/40 , C08G73/14
摘要： An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25° C.; and (2) the condensation resin has a polyoxyalkanediyl group.

8. 发明授权

US08592546B2 Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same 有权
标题翻译：含硅脂环族聚酰亚胺树脂，聚酰胺酸树脂及其制造方法
公开(公告)号：US08592546B2
公开(公告)日：2013-11-26
申请号：US13583727
申请日：2011-04-13
申请人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
发明人： Tooru Kikuchi , Toshihiko Takasaki , Katsuyuki Masuda
IPC分类号： C08G77/452
CPC分类号： C08G73/106 , C08G69/42 , C08G73/105 , C08G73/1075 , C08G73/1078 , C08G77/455
摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.
摘要翻译：包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数，与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 与降冰片烷环结合的酰胺基和羧基中的任何一个相对于降冰片烷环都处于外部构型。聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

9. 发明授权

US08501279B2 Flexible laminate board, process for manufacturing of the board, and flexible print wiring board 失效
标题翻译：柔性层压板，板的制造工艺和柔性印刷线路板
公开(公告)号：US08501279B2
公开(公告)日：2013-08-06
申请号：US12091519
申请日：2006-10-19
申请人： Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshitsugu Matsuura
发明人： Masahiko Suzuki , Kazuhito Obata , Katsuyuki Masuda , Kenichi Tomioka , Masaki Takeuchi , Sumio Yoshida , Hirokazu Suzuki , Yoshitsugu Matsuura
IPC分类号： B32B3/10 , B32B15/09 , B05D3/02 , B05D3/10
CPC分类号： H05K1/0346 , H05K3/022 , H05K2201/0154 , H05K2201/0358 , H05K2203/0759 , H05K2203/087 , H05K2203/1157 , H05K2203/163 , Y10T428/24917 , Y10T428/261 , Y10T428/27
摘要： A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.
摘要翻译：一种制造具有一个或多个层叠体的柔性层叠片的方法，每个层叠体均设置有形成在树脂膜的一侧上的金属箔，该方法包括涂布步骤，其中将包含聚酰胺酸和溶剂的清漆涂覆到金属箔以形成涂膜，保持在金属箔上形成的涂膜的保持步骤，其中除去清漆中的至少一部分溶剂以形成由树脂构成的层的干燥步骤组合物和树脂膜形成步骤，其中由树脂组合物组成的层被加热以形成含有聚酰亚胺树脂的树脂膜。基于树脂膜中的金属元素含量的目标，调整从涂布步骤到树脂成膜步骤的每个步骤的条件。

10. 发明授权

US07818877B2 Formation method of metal layer on resin layer 有权
标题翻译：树脂层上金属层的形成方法
公开(公告)号：US07818877B2
公开(公告)日：2010-10-26
申请号：US11836927
申请日：2007-08-10
申请人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Katsuyuki Masuda , Kiyoshi Hasegawa
发明人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Katsuyuki Masuda , Kiyoshi Hasegawa
IPC分类号： H05K3/36
CPC分类号： H05K3/386 , C23C18/1608 , C23C18/1653 , C23C18/2093 , C23C18/31 , C25D5/022 , H05K3/108 , H05K3/244 , H05K3/427 , H05K3/4644 , H05K3/4652 , H05K2201/0154 , H05K2201/0355 , H05K2203/072 , Y10S428/901 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , Y10T428/12472 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514 , Y10T428/12535 , Y10T428/24917
摘要： A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
摘要翻译：一种具有导体电路的印刷电路板，其特征在于，具有与绝缘层相邻的铜层和无电镀金，其特征在于，所述绝缘层的平均表面粗糙度（Rz）为20μm以下。根据本发明，没有在树脂上沉积镀金的缺陷，并且实现精确的精细布线形成。

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