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    • 6. 发明授权
    • Semiconductor light emitting element and semiconductor light emitting device using the same
    • 半导体发光元件和使用其的半导体发光器件
    • US08309975B2
    • 2012-11-13
    • US12739295
    • 2008-10-30
    • Atsuhiro HoriHidenori KameiSyuusaku Maeda
    • Atsuhiro HoriHidenori KameiSyuusaku Maeda
    • H01L33/00
    • H01L33/38H01L33/62H01L2924/0002H01L2924/00
    • In a semiconductor light emitting device, in which a light emitting layer is formed on one surface of a conductive substrate, and an n-type electrode and a p-type electrode are formed on the same side as the light emitting layer, there has been the problem that, if larger electric power is applied, heat is generated near the n-side electrode to reduce luminous efficiency. The n-side electrode has a predetermined length at a corner portion or along an edge of the substrate to disperse a current flowing from the n-side electrode into the substrate, thereby avoiding heat generation near the n-side electrode. In this type of semiconductor light emitting element, the existence of the n-side electrode reduces a light emitting area. Therefore, the length of the n-side electrode preferably ranges from 20% to 50% of the entire peripheral length of the substrate.
    • 在导电性基板的一个表面上形成有发光层的半导体发光元件和与发光层同一侧形成有n型电极和p型电极的情况下, 如果施加较大的电力,则在n侧电极附近产生热量以降低发光效率的问题。 n侧电极在基板的角部或沿着边缘具有预定的长度,以将从n侧电极流入的电流分散到基板中,从而避免n侧电极附近的发热。 在这种类型的半导体发光元件中,n侧电极的存在减少了发光面积。 因此,n侧电极的长度优选为基板的整个周长的20〜50%。