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1. 外观设计

USD316704S Housing for an electrical connector 失效
公开(公告)号：USD316704S
公开(公告)日：1991-05-07
申请号：US142407
申请日：1988-01-11
申请人： Hidenori Eto , Toshihiro Maki , Yukio Ohta , Toru Matsunaga
设计人： Hidenori Eto , Toshihiro Maki , Yukio Ohta , Toru Matsunaga

2. 外观设计

USD316703S Housing for an electrical connector 失效
公开(公告)号：USD316703S
公开(公告)日：1991-05-07
申请号：US142901
申请日：1988-01-11
申请人： Hidenori Eto , Toshihiro Maki , Yukio Ohta , Toru Matsunaga
设计人： Hidenori Eto , Toshihiro Maki , Yukio Ohta , Toru Matsunaga

3. 发明授权

US07415233B2 Plate-shaped peeling member and method and apparatus of manufacturing same 有权
标题翻译：板状剥离部件及其制造方法及装置
公开(公告)号：US07415233B2
公开(公告)日：2008-08-19
申请号：US10996794
申请日：2004-11-24
申请人： Yukio Ohta , Satoru Fukuzawa , Masaaki Ohashi , Kazuo Hirose
发明人： Yukio Ohta , Satoru Fukuzawa , Masaaki Ohashi , Kazuo Hirose
IPC分类号： G03G15/20
CPC分类号： G03G15/2028 , Y10T29/49826 , Y10T156/1034 , Y10T156/1046
摘要： A plate shaped peeling member, which can be used for a long term, is manufactured by a method which is superior in productivity and is capable of manufacturing plate-shaped peeling members of consistent quality. The plate-shaped peeling member peels paper from a roller or a belt of an electrophotographic apparatus, by means of a leading edge of a thin metal plate that is in contact with or is adjacent to the roller or the belt. In the plate-shaped peeling member, an adhesive agent-applied resin sheet is adhered to the thin metal plate in a longitudinal direction thereof without pulling both end portions of the adhesive agent-applied resin sheet in a longitudinal direction thereof, with metal exposed at both end surfaces of the thin metal plate in the longitudinal direction thereof.
摘要翻译：可以长期使用的板状剥离部件通过生产率优异且能够制造质量一致的板状剥离部件的方法制造。板状剥离构件通过与辊或带接触或邻近的薄金属板的前缘将纸从电影照相设备的辊或带子剥离。在板状剥离部件中，粘合剂涂布树脂片沿长度方向粘附在薄金属板上，而不沿着其长度方向拉伸粘合剂施加的树脂片的两端，金属暴露在薄金属板的纵向两端面。

4. 发明授权

US5786627A Integrated circuit device and fabricating thereof 失效
标题翻译：集成电路器件及其制造
公开(公告)号：US5786627A
公开(公告)日：1998-07-28
申请号：US956497
申请日：1997-10-22
申请人： Akira Inoue , Kei Goto , Yoshihiro Notani , Yasuharu Nakajima , Hiroto Matsubayashi , Yukio Ohta
发明人： Akira Inoue , Kei Goto , Yoshihiro Notani , Yasuharu Nakajima , Hiroto Matsubayashi , Yukio Ohta
IPC分类号： H01L23/538 , H01L23/66 , H01L23/02 , H01L23/52
CPC分类号： H01L24/49 , H01L23/66 , H01L2223/6644 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/19043 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111
摘要： An integrated circuit device includes a substrate, circuit elements on the substrate, and an electrically conductive thermoplastic resin substance electrically connecting the circuit elements on the substrate. Therefore, since variations in the configuration of the thermoplastic resin are quite small relative to those of interconnecting wires, variation in parasitic inductance due to variation in the configuration of the connections is reduced and the uniformity and the reproducibility of the high frequency characteristics of the integrated circuit device are enhanced. A method for fabricating an integrated circuit device includes forming circuit elements on a substrate and forming an electrically conducting thermoplastic resin substance electrically connecting the circuit elements.
摘要翻译：集成电路器件包括衬底，衬底上的电路元件和电连接衬底上的电路元件的导电热塑性树脂物质。因此，由于热塑性树脂的结构的变化相对于互连线的变化相当小，所以连接结构的变化引起的寄生电感的变化减小，集成的高频特性的均匀性和再现性电路设备得到增强。一种集成电路器件的制造方法，包括在基片上形成电路元件，形成电连接电路元件的导电性热塑性树脂物质。

5. 外观设计

USD323142S Electrical connector housing 失效
公开(公告)号：USD323142S
公开(公告)日：1992-01-14
申请号：US395395
申请日：1989-08-17
申请人： Yasuhiro Nagasaka , Yasuo Hirayama , Yoshitsugu Sawada , Yukio Ohta
设计人： Yasuhiro Nagasaka , Yasuo Hirayama , Yoshitsugu Sawada , Yukio Ohta

6. 发明授权

US5059142A Electric connector with a terminal conductor detaining mechanism 失效
标题翻译：带有端子导体锁定机构的电连接器
公开(公告)号：US5059142A
公开(公告)日：1991-10-22
申请号：US633921
申请日：1990-12-26
申请人： Yukio Ohta , Hiroshi Watanabe , Hideki Ohsumi , Naoto Taguchi
发明人： Yukio Ohta , Hiroshi Watanabe , Hideki Ohsumi , Naoto Taguchi
IPC分类号： H01R13/42 , H01R13/436 , H01R13/506
CPC分类号： H01R13/4368 , H01R13/4365 , H01R13/506
摘要： An electric connector with a terminal conductor detaining mechanism for restraining terminal conductors from slipping out of the electric connector. The electric connector comprises: a connector shell having a plurality of terminal chambers and provided with a pair of flexible, temporary locking strips and with a pair of main locking parts; and a terminal conductor detaining member provided with a plurality of terminal conductor detaining fingers and a pair of flexible locking arms. The terminal conductor detaining member is combined temporarily with the connector shell with the fexible locking arms thereof engaging the flexible locking strips of the connector shell, respectively, to keep the connector shell and the terminal conductor detaining member in a temporarily combined state. The terminal conductor detaining member is combined completely with the connector shell by pressing the terminal conductor detaining member into the connector shell so that the locking arms engage the main locking parts of the connector shell, respectively. In pressing the terminal conductor detaining member into the connector shell to combine the terminal conductor detaining member and the connector shell in a completely combined state, the flexible locking strips must be pressed forcibly to allow the terminal conductor detaining member to move further into the connector shell. Thus, the accidental complete combination of the terminal conductor detaining member and the connector shell is prevented.
摘要翻译：一种具有端子导体锁定机构的电连接器，用于限制端子导体从电连接器滑出。电连接器包括：具有多个端子室并具有一对柔性临时锁定带和一对主锁定部分的连接器壳体; 以及设置有多个端子导体扣留指状物和一对柔性锁定臂的端子导体定位构件。端子导体定位构件与连接器壳体暂时组合，其柔性锁定臂分别与连接器壳体的柔性锁定条接合，以保持连接器壳体和端子导体锁定构件处于暂时组合状态。通过将端子导体定位构件压入连接器壳体中，端子导体定位构件与连接器壳体完全组合，使得锁定臂分别接合连接器壳体的主要锁定部分。在将终端导体锁定构件压入连接器壳体中以将完全组合状态的端子导体定位构件和连接器壳体组合在一起时，必须强制地按压柔性锁定条，以使端子导体定位构件进一步移动到连接器壳体。因此，防止了端子导体定位构件和连接器壳体的意外完全组合。

7. 发明授权

US4874159A Paper feed device and paper cassette therefor 失效
标题翻译：供纸装置和纸盒
公开(公告)号：US4874159A
公开(公告)日：1989-10-17
申请号：US182230
申请日：1988-04-15
申请人： Mikihiko Maeno , Yukio Ohta , Yoshiharu Momiyama , Hisao Ono , Katsumasa Takahata , Kazuyuki Ozono , Makoto Shimizu , Mikio Yamamoto
发明人： Mikihiko Maeno , Yukio Ohta , Yoshiharu Momiyama , Hisao Ono , Katsumasa Takahata , Kazuyuki Ozono , Makoto Shimizu , Mikio Yamamoto
IPC分类号： B41J13/10 , B65H1/04 , B65H1/12
CPC分类号： B65H1/12 , B41J13/103 , B65H1/04 , B65H1/266 , B65H2511/10 , B65H2511/11 , B65H2511/22
摘要： An automatic paper feed device is formed to store multiple types of different sized media in a single paper cassette and performs paper-feeding. A media load plate is loaded with said multiple types of different sized media. A media back edge guide assembly is mounted to a media load plate on which is loaded multiple types of different-sized media, to position the media loaded on the media load plate.

8. 发明授权

US5810615A Waterproof connector with covering body 失效
标题翻译：防水连接器，带盖体
公开(公告)号：US5810615A
公开(公告)日：1998-09-22
申请号：US792455
申请日：1997-01-31
申请人： Yukio Ohta
发明人： Yukio Ohta
IPC分类号： H01R13/52 , H01R13/623 , H01R13/62
CPC分类号： H01R13/5219 , H01R13/5221 , H01R13/623
摘要： A waterproof connector includes a pair of mating connector housings having connecting terminal fittings therein. A covering body rotatably is attached to a cylindrical peripheral wall of one of the connector housings. The covering body has a stopper hook projecting from its inner wall and is mounted with a resilient member for exerting a reaction force to the other connector housing. A locking hook projects from an outer peripheral wall of the other connector housing and engages with the stopper hook of the covering body. An outer wall of the other housing is inserted into the covering body and the stopper hook engages with the locking hook so that the pair of connector housings completely engage and lock to each other.
摘要翻译：防水连接器包括其中具有连接端子接头的一对配合连接器壳体。覆盖体可旋转地附接到一个连接器壳体的圆柱形周壁。覆盖体具有从其内壁突出的止动钩，并且安装有用于向另一连接器壳体施加反作用力的弹性构件。锁定钩从另一连接器壳体的外周壁突出并与覆盖体的止动钩接合。另一个壳体的外壁插入到覆盖体中，止动钩与锁定钩接合，使得该对连接器壳体彼此完全接合并锁定。

9. 发明授权

US5769673A Female terminal 失效
标题翻译：女性终端
公开(公告)号：US5769673A
公开(公告)日：1998-06-23
申请号：US679490
申请日：1996-07-12
申请人： Yukio Ohta , Takeya Miwa
发明人： Yukio Ohta , Takeya Miwa
IPC分类号： H01R13/115 , H01R13/11 , H01R11/22
CPC分类号： H01R13/11 , H01R13/113
摘要： A female terminal in which excessive flexing of a resilient contact piece portion is prevented by simple working. The female terminal of the invention includes deformation prevention folded portions which are bent respectively at opposite side portions of a second folded piece portion toward a first folded piece portion. The deformation prevention folded portion supports the first folded piece portion in a maximumly-flexed position of the first folded piece portion. When a male terminal, having a proper thickness, is inserted into the female terminal, a predetermined gap is formed between the first folded piece portion and the deformation prevention folded portion. Even when the first folded piece portion is flexed upon insertion of a thick foreign object into a hollow contact portion or upon prizing of the first folded piece portion in the hollow contact portion, the deformation prevention folded portion supports the first folded piece portion in the maximumly-flexed position thereof, and therefore a resilient contact piece portion will not be permanently deformed. And besides, the deformation prevention folded portion can be formed by simple working.
摘要翻译：通过简单的工作来防止弹性接触片部分的过度弯曲的阴端子。本发明的母端子包括变形防止折叠部分，其分别在第二折叠片部分的相对侧部分朝向第一折叠片部分弯曲。变形防止折叠部将第一折叠片部分支撑在第一折叠片部分的最大弯曲位置。当具有适当厚度的阳端子插入阴端子时，在第一折叠部分和变形防止折叠部分之间形成预定的间隙。即使当第一折叠片部分在将厚的异物插入中空接触部分时弯曲或者在中空接触部分中的第一折叠片部分的折叠时，变形防止折叠部分最大限度地支撑第一折叠片部分弯曲位置，因此弹性接触片部分不会永久变形。此外，变形防止折叠部分可以通过简单的加工形成。

10. 发明授权

US5767569A Tab tape and semiconductor chip mounted on tab tape 失效
标题翻译：贴带和半导体芯片安装在拉链带上
公开(公告)号：US5767569A
公开(公告)日：1998-06-16
申请号：US584293
申请日：1996-01-11
申请人： Yukio Ohta , Kei Goto , Yoshihiro Notani , Yasuharu Nakajima , Akira Inoue , Hiroto Matubayashi
发明人： Yukio Ohta , Kei Goto , Yoshihiro Notani , Yasuharu Nakajima , Akira Inoue , Hiroto Matubayashi
IPC分类号： H01L21/60 , H01L21/603 , H01L23/485 , H01L23/495 , H01L23/50 , H01L23/34 , H01L23/48 , H01L23/52
CPC分类号： H01L23/49572 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/50 , H01L24/83 , H01L2224/11552 , H01L2224/13099 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/19042 , H01L2924/19043
摘要： The method for mounting a semiconductor chip comprises disposing conductive thermoplastic polyimide as a bonding material between an inner lead of the TAB tape and an external connecting electrode of the semiconductor chip, applying pressure to the conductive thermoplastic polyimide by a wedge with heating by a hot stage via the semiconductor chip. The semiconductor chip comprises the external connecting electrode adhered the conductive thermoplastic polyimide. The method for fabricating the semiconductor chip comprises forming a signal line and a protective film, forming an electrode pad on the signal line not provided the protective film, forming a conductive thermoplastic polyimide layer on the semiconductor wafer by spin coating, forming a resist on the conductive thermoplastic polyimide layer and performing an etching with using the resist as a mask. The inner lead of the TAB tape is made of conductive thermoplastic polyimide, not gilded. The flip-chip mounting substrate comprises a semiconductor chip connecting electrode comprising a signal line made of conductive thermoplastic polyimide, a protective film protecting the signal line, and adhering conductive thermoplastic polyimide on the signal line not providing the protective film. The microwave device comprises mounting the semiconductor chip in the inner lead of the TAB tape by adhering the external connecting electrode of the semiconductor chip to the inner lead of the TAB tape. Therefore, it is not required using high cost material for mounting the semiconductor chip, so that reducing in cost is accomplished.
摘要翻译：用于安装半导体芯片的方法包括将导电热塑性聚酰亚胺作为接合材料布置在TAB带的内引线和半导体芯片的外部连接电极之间，通过加热阶段通过楔形件向导电热塑性聚酰亚胺施加压力通过半导体芯片。半导体芯片包括附着有导电性热塑性聚酰亚胺的外部连接电极。制造半导体芯片的方法包括形成信号线和保护膜，在未设置保护膜的信号线上形成电极焊盘，通过旋涂在半导体晶片上形成导电性热塑性聚酰亚胺层，在其上形成抗蚀剂导电热塑性聚酰亚胺层，并使用抗蚀剂作为掩模进行蚀刻。 TAB带的内引线由导电热塑性聚酰亚胺制成，不镀金。倒装芯片安装基板包括半导体芯片连接电极，其包括由导电热塑性聚酰亚胺制成的信号线，保护信号线的保护膜，以及在不提供保护膜的信号线上粘附导电热塑性聚酰亚胺。微波装置包括通过将半导体芯片的外部连接电极粘附到TAB带的内引线上来将半导体芯片安装在TAB带的内引线中。因此，不需要使用高成本材料来安装半导体芯片，从而实现成本的降低。

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