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    • 1. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20090194154A1
    • 2009-08-06
    • US12358449
    • 2009-01-23
    • Hidekazu TAKAHASHIYohei MONMADaiki YAMADATakahiro IGUCHIKazuo NISHI
    • Hidekazu TAKAHASHIYohei MONMADaiki YAMADATakahiro IGUCHIKazuo NISHI
    • H01L31/105H01L31/02H01L21/66H01L21/98
    • H01L31/02162H01L25/0655H01L27/14621H01L27/14643H01L2924/0002H01L2924/00
    • An object is to reduce the breakage of appearance such as a crack, a split and a chip by external stress of a semiconductor device. Another object is that manufacturing yield of a thin semiconductor device increases. The semiconductor device includes a plurality of semiconductor integrated circuits mounted on the interposer. Each of the plurality of semiconductor integrated circuits includes a light transmitting substrate which have a step on the side surface and in which the width of one section of the light transmitting substrate is narrower than that of the other section of the light transmitting substrate when the light transmitting substrate is divided at a plane including the step, a semiconductor element layer including a photoelectric conversion element provided on one surface of the light transmitting substrate, and a chromatic color light transmitting resin layer which covers the other surface of the light transmitting substrate and a part of the side surface. The colors of the chromatic color light transmitting resin layers are different in each of the plurality of semiconductor integrated circuits.
    • 目的是通过半导体器件的外部应力来减少裂纹,裂纹和芯片的外观破损。 另一个目的是提高薄半导体器件的制造成品率。 半导体器件包括安装在插入器上的多个半导体集成电路。 所述多个半导体集成电路中的每一个都包括透光基板,所述透光基板在所述侧表面具有台阶,并且所述透光基板的一部分的宽度比所述透光基板的另一部分的宽度窄,当所述光 发送基板在包括该台阶的平面处被分割,包括设置在透光基板的一个表面上的光电转换元件的半导体元件层和覆盖透光基板的另一个表面的彩色透光树脂层和 侧面的一部分。 多色半导体集成电路中的彩色透光树脂层的颜色不同。
    • 8. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE
    • 光电转换器件
    • US20100307590A1
    • 2010-12-09
    • US12792175
    • 2010-06-02
    • Shunpei YAMAZAKIKazuo NISHI
    • Shunpei YAMAZAKIKazuo NISHI
    • H01L31/00
    • H01L31/1884C23C14/0676H01L31/022466H01L31/022483H01L31/046H01L31/0463H01L31/0465H01L31/076H01L31/077H01L31/202Y02E10/548Y02P70/521
    • The present invention provides a technique in which a cheap zinc oxide material can be used as a light-transmitting conductive film of a photoelectric conversion device. The present invention is a photoelectric conversion device including, between a first electrode and a second electrode, at least one unit cell in which a first impurity semiconductor layer having one conductivity type, a semiconductor layer, and a second impurity semiconductor layer having a conductivity type opposite to the first impurity semiconductor layer are sequentially stacked and a semiconductor junction is included. The first electrode or the second electrode includes conductive oxynitride containing zinc and aluminum. In the conductive oxynitride containing zinc and aluminum: the relative proportion of the zinc is less than or equal to 47 at. % and higher than that of the aluminum; and the relative proportion of the aluminum is higher than that of nitrogen.
    • 本发明提供了可以使用便宜的氧化锌材料作为光电转换装置的透光导电膜的技术。 本发明是一种光电转换装置,在第一电极和第二电极之间包括至少一个单元电池,其中具有一种导电类型的第一杂质半导体层,半导体层和具有导电类型的第二杂质半导体层 与第一杂质半导体层相对的顺序堆叠并且包括半导体结。 第一电极或第二电极包括含有锌和铝的导电氮氧化物。 在含有锌和铝的导电氮氧化物中:锌的相对比例小于或等于47at。 %以上; 铝的相对比例高于氮。