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    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING THE SAME
    • 半导体器件和使用该器件的电子器件
    • US20090084944A1
    • 2009-04-02
    • US12328978
    • 2008-12-05
    • Atsushi HIROSETatsuya ARAO
    • Atsushi HIROSETatsuya ARAO
    • G01J1/44
    • H01L27/1443G01J1/1626G01J1/4228G01J1/44
    • The semiconductor device includes a first photodiode, a second photodiode which is shielded from light, a first circuit group including a voltage follower circuit, a second circuit group, and a compensation circuit, in which an output from the first photodiode is inputted to the voltage follower circuit of the first circuit group, an output from the first circuit group is inputted to the compensation circuit, and an output from the second photodiode is inputted to the compensation circuit through the second circuit group. By adding or subtracting these inputs in the compensation circuit, an output fluctuation due to temperature of the first photodiode is removed. Note that a reference potential is supplied to the first photodiode so that an open circuit voltage is outputted, and a potential is supplied to the second photodiode so that a forward bias is applied to the second photodiode.
    • 半导体器件包括第一光电二极管,屏蔽光的第二光电二极管,包括电压跟随器电路,第二电路组和补偿电路的第一电路组,其中第一光电二极管的输出被输入到电压 第一电路组的跟随器电路,第一电路组的输出被输入到补偿电路,并且来自第二光电二极管的输出通过第二电路组输入到补偿电路。 通过在补偿电路中增加或减去这些输入,消除由于第一光电二极管的温度引起的输出波动。 注意,参考电位被提供给第一光电二极管,使得输出开路电压,并且向第二光电二极管提供电位,使得正向偏压被施加到第二光电二极管。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120187457A1
    • 2012-07-26
    • US13440157
    • 2012-04-05
    • Shunpei YAMAZAKITatsuya ARAO
    • Shunpei YAMAZAKITatsuya ARAO
    • H01L27/06
    • H01L27/1266G06K19/07749G06K19/07775G06K19/07779H01L27/12H01L27/1214H01L27/13H01Q1/2208H01Q1/2283H01Q1/38H01Q23/00
    • A semiconductor device such as an ID chip of the present invention includes an integrated circuit using a semiconductor element formed by using a thin semiconductor film, and an antenna connected to the integrated circuit. It is preferable that the antenna is formed integrally with the integrated circuit, since the mechanical strength of an ID chip can be enhanced. Note that the antenna used in the present invention also includes a conducting wire that is wound round circularly or spirally and fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are included is arranged between the conducting wires.
    • 本发明的ID芯片等半导体装置包括使用由半导体薄膜形成的半导体元件的集成电路和与集成电路连接的天线。 优选地,天线与集成电路一体形成,因为可以提高ID芯片的机械强度。 注意,本发明中使用的天线还包括绕圆形或螺旋状地缠绕的导线,并且在导线之间布置有软磁性材料的细小颗粒。 具体而言,在导线之间配置有软磁性材料的细微粒子的绝缘层。 具体而言,在导线之间配置有包含软磁性材料的微粒的绝缘层。
    • 10. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体器件及其制造方法
    • US20100006854A1
    • 2010-01-14
    • US12501801
    • 2009-07-13
    • Koji ONOHideomi SUZAWATatsuya ARAO
    • Koji ONOHideomi SUZAWATatsuya ARAO
    • H01L33/00
    • H01L27/1222G02F1/13624H01L27/12H01L27/1214H01L27/124H01L27/127H01L29/42384H01L29/4908H01L29/66757H01L29/78621H01L29/78627H01L33/08H01L33/62H01L2029/7863H01L2924/0002H01L2924/00
    • In a semiconductor device, typically an active matrix display device, the structure of TFTs arranged in the respective circuits are made suitable in accordance with the function of the circuit, and along with improving the operating characteristics and the reliability of the semiconductor device, the manufacturing cost is reduced and the yield is increased by reducing the number of process steps. A semiconductor device has a semiconductor layer, an insulating film formed contacting the semiconductor layer, and a gate electrode having a tapered portion on the insulating film, in the semiconductor device, the semiconductor layer has a channel forming region, a first impurity region for forming a source region or a drain region and containing a single conductivity type impurity element, and a second impurity region for forming an LDD region contacting the channel forming region, a portion of the second impurity region is formed overlapping a gate electrode, and the concentration of the single conductivity type impurity element contained in the second impurity region becomes larger with distance from the channel forming region.
    • 在半导体器件(通常为有源矩阵显示器件)中,根据电路的功能,布置在各个电路中的TFT的结构是合适的,并且随着半导体器件的工作特性和可靠性的提高,制造 降低成本,并通过减少工艺步骤的数量来提高产量。 半导体器件具有半导体层,与半导体层接触形成的绝缘膜和在绝缘膜上具有锥形部分的栅电极,在半导体器件中,半导体层具有沟道形成区,形成第一杂质区 源极区域或漏极区域,并且包含单一导电型杂质元素,以及用于形成与沟道形成区域接触的LDD区域的第二杂质区域,第二杂质区域的一部分与栅电极重叠,并且浓度 包含在第二杂质区域中的单一导电型杂质元素随着与沟道形成区域的距离而变大。