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1. 发明申请

US20080010819A1 CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：连接板和多层接线板，用于半导体封装的基板和使用连接板的半导体封装及其制造方法
公开(公告)号：US20080010819A1
公开(公告)日：2008-01-17
申请号：US11775294
申请日：2007-07-10
申请人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro NAKAMURA , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K3/30
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
摘要翻译：本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体，连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

2. 发明申请

US20080289868A1 CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING CONNECTION BOARD, AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20080289868A1
公开(公告)日：2008-11-27
申请号：US12182908
申请日：2008-07-30
申请人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K1/11 , H05K1/16
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

3. 发明授权

US08028402B2 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof 有权
标题翻译：连接板和多层布线板，半导体封装用基板和使用连接板的半导体封装及其制造方法
公开(公告)号：US08028402B2
公开(公告)日：2011-10-04
申请号：US11775294
申请日：2007-07-10
申请人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K3/36 , H01R9/00 , H01K3/10
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.
摘要翻译：公开了一种多层布线板的制造方法，该方法包括：准备连接板，连接板分别具有绝缘树脂组合物层，形成为穿过绝缘树脂组合物层的连接导体和导体电路形成在绝缘树脂组合物层上并连接到连接导体; 对准连接板; 并且通过加热和压制层叠对准的连接板，使得连接导体或连接导体和导体电路彼此导电连接，并且连接板通过绝缘树脂组合物层彼此机械连接。连接板通过特定的加工形成，包括使用三层复合金属层。

4. 发明申请

US20090008141A1 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof 审中-公开
标题翻译：连接板和多层布线板，半导体封装用基板和使用连接板的半导体封装及其制造方法
公开(公告)号：US20090008141A1
公开(公告)日：2009-01-08
申请号：US12230564
申请日：2008-09-02
申请人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
发明人： Hidehiro Nakamura , Akishi Nakaso , Shigeharu Arike , Fumio Inoue , Tetsuya Enomoto , Norio Moriike , Kousuke Hiroki
IPC分类号： H05K1/11 , H05K1/16
CPC分类号： H05K3/4617 , H01L21/4857 , H01L21/486 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K3/0097 , H05K3/06 , H05K3/244 , H05K3/4038 , H05K3/4623 , H05K3/4632 , H05K3/4647 , H05K2201/0141 , H05K2201/0195 , H05K2201/0355 , H05K2201/0361 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0384 , H05K2203/0733 , H05K2203/1536 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49165 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.
摘要翻译：本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体，连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

5. 发明授权

US07704799B2 Method of manufacturing wiring substrate 失效
标题翻译：制造布线基板的方法
公开(公告)号：US07704799B2
公开(公告)日：2010-04-27
申请号：US11683714
申请日：2007-03-08
申请人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
发明人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
IPC分类号： H01L21/50
CPC分类号： H01L21/568 , H01L21/4846 , H01L21/486 , H01L21/6835 , H01L23/3121 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L25/0657 , H01L2224/05599 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/4007 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).
摘要翻译：布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。不仅端子（14A）和配线（14B）以及埋地导体（12）都通过相同的制造工艺升高。半导体元件（2）附着到布线基板（1）的电极（14C）上。

6. 发明授权

US07205645B2 Wiring board, semiconductor device, and method of manufacturing wiring board 有权
标题翻译：接线板，半导体器件及制造布线板的方法
公开(公告)号：US07205645B2
公开(公告)日：2007-04-17
申请号：US10203652
申请日：2001-02-21
申请人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
发明人： Hidehiro Nakamura , Tetsuya Enomoto , Toshio Yamazaki , Hiroshi Kawazoe
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52
CPC分类号： H01L21/568 , H01L21/4846 , H01L21/486 , H01L21/6835 , H01L23/3121 , H01L23/498 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L25/0657 , H01L2224/05599 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K3/4007 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).
摘要翻译：布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。半导体元件（2）附着到布线基板（1）的电极（14C）上。

7. 发明授权

US06336210B1 Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation device 失效
标题翻译：面板呈现软件创建方法，记录面板呈现软件创建程序的计算机可读记录介质和面板呈现软件创建设备
公开(公告)号：US06336210B1
公开(公告)日：2002-01-01
申请号：US09258193
申请日：1999-02-26
申请人： Kenji Taima , Teruhiro Yamada , Tetsuya Enomoto , Satoshi Takemoto , Ryuhei Amano
发明人： Kenji Taima , Teruhiro Yamada , Tetsuya Enomoto , Satoshi Takemoto , Ryuhei Amano
IPC分类号： G06F945
CPC分类号： G06F8/34
摘要： A panel-presentation-software creation method for creating a software which provides presentation of plural edit panels by using a template with an image fitting region and an editor-designated fitting image to be fitted in the image fitting region, the method comprises the steps of creating a reference file containing the description of reference information including link information designating each image file containing the fitting image, and creating a panel presentation software at least including a panel presentation program, a template file containing the template, and the reference file.
摘要翻译：一种面板呈现软件创建方法，用于创建通过使用具有图像拟合区域的模板和拟合在图像拟合区域中的编辑器指定的拟合图像来提供多个编辑面板的呈现的软件，该方法包括以下步骤：创建包含参考信息的描述的参考文件，包括指定包含装配图像的每个图像文件的链接信息，以及创建至少包括面板呈现程序，包含模板的模板文件和参考文件的面板呈现软件。

8. 发明授权

US6133683A Color cathode ray tube having an internal voltage divider 失效
标题翻译：具有内部分压器的彩色阴极射线管
公开(公告)号：US6133683A
公开(公告)日：2000-10-17
申请号：US98740
申请日：1998-06-17
申请人： Tetsuya Enomoto , Hidemasa Komoro , Shoji Shirai
发明人： Tetsuya Enomoto , Hidemasa Komoro , Shoji Shirai
IPC分类号： H01J29/48 , H01J29/96 , H01J29/50
CPC分类号： H01J29/485 , H01J29/96 , H01J2229/966
摘要： A color cathode ray tube includes an evacuated envelope having a panel portion with a phosphor screen formed on an inner surface thereof, a neck portion, and a funnel portion connecting the panel portion and the neck portion, and an electron gun housed in the neck portion. The electron gun has a cathode and a plurality of focus grid electrodes including grid electrodes for forming a multistage focus lens for focusing an electron beam emitted from the cathode. The cathode and the focus grid electrodes are fixed in predetermined axially spaced relationship by a pair of bead glass. The electron gun is provided with a voltage divider for producing at least one voltage other than a voltage supplied from outside the evacuated envelope, the voltage divider is made of at least one resistor and is fabricated as a separate element from the bead glass, and at least one of bead glass is provided with a recess for receiving the voltage divider in a surface thereof on a side thereof facing away from the cathode and the focus grid electrodes.
摘要翻译：彩色阴极射线管包括：抽真空的外壳，具有在其内表面上形成有荧光屏的面板部分，颈部和连接面板部分和颈部的漏斗部分，以及容纳在颈部中的电子枪。电子枪具有阴极和多个聚焦栅格电极，包括用于形成用于聚焦从阴极发射的电子束的多层聚焦透镜的栅格电极。阴极和焦点栅极通过一对珠玻璃以预定的轴向间隔的关系固定。电子枪设置有分压器，用于产生除了从真空外壳外部提供的电压以外的至少一个电压，分压器由至少一个电阻器制成，并且被制造为与珠玻璃分开的元件，并且在珠玻璃中的至少一个设置有用于在其背离阴极和焦点栅极的一侧的表面中接收分压器的凹部。

9. 发明授权

US09431314B2 Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device 有权
标题翻译：半导体封装密封用热固性树脂组合物及半导体器件
公开(公告)号：US09431314B2
公开(公告)日：2016-08-30
申请号：US13040079
申请日：2011-03-03
申请人： Tetsuya Enomoto , Emi Miyazawa , Kazutaka Honda , Akira Nagai , Keisuke Ookubo
发明人： Tetsuya Enomoto , Emi Miyazawa , Kazutaka Honda , Akira Nagai , Keisuke Ookubo
IPC分类号： C08L63/00 , H01L21/56 , H01L23/29 , C08G59/42 , C08G59/62
CPC分类号： H01L23/295 , C08G59/42 , C08G59/621 , C08L63/00 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/00
摘要： A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.
摘要翻译：用于半导体底部填充的热固性树脂组合物，其包含作为必要成分的热固性树脂，固化剂，助熔剂和两种或更多种不同平均粒度的无机填料，其中无机填料包括具有平均值的无机填料粒径不大于100nm的平均粒度大于100nm的无机填料。

10. 发明申请

US20120105760A1 LIQUID CRYSTAL DISPLAY DEVICE 审中-公开
标题翻译：液晶显示装置
公开(公告)号：US20120105760A1
公开(公告)日：2012-05-03
申请号：US13282646
申请日：2011-10-27
申请人： Yoshio TORIYAMA , Tetsuya Enomoto
发明人： Yoshio TORIYAMA , Tetsuya Enomoto
IPC分类号： G02F1/13357
CPC分类号： G02F1/133308 , G02F2001/133311 , G02F2001/133612
摘要： A liquid crystal display device is provided, where dust can be prevented from entering into the display device and the quality of the display can be prevented from lowering even in the case where a fan in the main body of the equipment blows air against the rear surface of the display device. The display device having a liquid crystal panel and a backlight illuminating the liquid crystal panel that are integrated with an upper frame that covers a periphery of the front surface of the liquid crystal panel and sides of the backlight is characterized in that a cable for supplying power to a light source provided inside the backlight is led out between a side of the backlight (side mold) and the upper frame, and a portion through which the cable is led out is covered by a sheet.
摘要翻译：提供了一种液晶显示装置，其中可以防止灰尘进入显示装置，并且即使在设备主体中的风扇将空气吹向后表面的情况下也可以防止显示器的质量下降的显示装置。具有液晶面板和照亮液晶面板的背光源的显示装置，其特征在于，用于供电的电缆设置在背光源内部的光源从背光（侧模）的一侧和上框架之间引出，并且电缆被引出的部分被片材覆盖。

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