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    • 3. 发明授权
    • Radiation-curable resin composition
    • 辐射固化树脂组合物
    • US6130270A
    • 2000-10-10
    • US225683
    • 1999-01-06
    • Masakatsu UkonToshihiko TakahashiTakashi Ukachi
    • Masakatsu UkonToshihiko TakahashiTakashi Ukachi
    • C08F4/00C08F2/48C08F220/30C08F220/36C08F290/00C08F290/06G02B1/04G02B1/12
    • G02B1/04C08F220/30C08F220/36Y10T428/10
    • A radiation curable composition comprising,(A) at least one compound containing a (meth)acrylate group represented by the following formula (1), ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group, R.sup.2 is an alkylene group or a hydroxyalkylene group having 2 to 6 carbon atoms, R.sup.3 is a divalent organic group, n is a number of 1 to 10, m is an integer of 0 or 1, and Ar.sup.1 and Ar.sup.2 are independently a group comprising an aromatic ring(B) at least one compound derived from trishydroxyethyl isocyanurate, and containing at least one (meth)acrylate group, and(C) at least one radiation polymerization initiator.The radiation curable resin composition affords a high productivity, exhibits high transparency, and produces molded articles exhibiting minimal coloration upon exposure to light, superior dimensional precision, high heat resistance, only slight adhesion to substrates under high temperature conditions. The composition is very useful for manufacturing molding articles.
    • 一种可辐射固化组合物,其包含:(A)至少一种含有由下式(1)表示的(甲基)丙烯酸酯基团的化合物,其中R1是氢原子或甲基,R2是亚烷基或羟基亚烷基, 2至6个碳原子,R 3是二价有机基团,n是1至10的数,m是0或1的整数,Ar 1和Ar 2独立地是包含芳环(B)的基团,至少一种化合物 衍生自异氰脲酸三羟乙酯,并含有至少一种(甲基)丙烯酸酯基,和(C)至少一种辐射聚合引发剂。 可辐射固化树脂组合物提供高生产率,显示出高透明度,并且在暴露于光,显示尺寸精度高,耐热性高,在高温条件下仅对基材轻微粘合的情况下,产生显色最小的成型品。 该组合物对于制造模塑制品非常有用。
    • 5. 发明授权
    • Radiation curable resin composition for cast polymerization
    • 用于浇铸聚合的辐射固化树脂组合物
    • US06288136B1
    • 2001-09-11
    • US09502228
    • 2000-02-11
    • Masakatsu UkonToshihiko TakahashiTakashi Ukachi
    • Masakatsu UkonToshihiko TakahashiTakashi Ukachi
    • C08F248
    • C09D4/00C08F222/1006C08F290/06C08F290/14C08F290/142C09D4/06Y10T428/31511
    • A radiation curable resin composition capable of producing molded articles which have excellent transparency, small light-coloring resistance, high dimensional accuracy, high surface hardness, and high thermal resistance. The radiation curable resin composition for cast polymerization, comprises (A) a (meth)acryloyl group-containing compound represented by the following general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group or a hydroxyalkylene group having 2-6 carbon atoms, R3 represents a divalent organic group, n denotes an integer from 0 to 6, m denotes an integer from 1 to 10, and L denotes an integer from 0 or 1; (B) a (meth)acryloyl group-containing compound represented by the following general formula (2): wherein R4 represents a hydrogen atom or a methyl group, R5 represents an alkylene group having 2-6 carbon atoms, and p denotes an integer from 1 to 16; and (C) a radiation active initiator possessing a specific molar absorption coefficient, respectively in a specific amount.
    • 一种辐射固化树脂组合物,其能够生产具有优异透明性,耐光着色性,高尺寸精度,高表面硬度和高耐热性的模塑制品。 用于铸造聚合的可辐射固化树脂组合物包含(A)由以下通式(1)表示的含(甲基)丙烯酰基的化合物:其中R1表示氢原子或甲基,R2表示亚烷基或 具有2-6个碳原子的羟基亚烷基,R3表示二价有机基团,n表示0至6的整数,m表示1至10的整数,L表示0或1的整数; (B)由以下通式(2)表示的(甲基)丙烯酰基化合物:其中,R4表示氢原子或甲基,R5表示碳原子数为2-6的亚烷基,p表示整数 从1到16; 和(C)分别具有特定摩尔吸光系数的辐射活性引发剂。