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1. 发明授权

US07204018B2 Technique for reducing via capacitance 有权
标题翻译：降低通孔电容的技术
公开(公告)号：US07204018B2
公开(公告)日：2007-04-17
申请号：US11012127
申请日：2004-12-16
申请人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Ming Soh
发明人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Ming Soh
IPC分类号： H01L23/48 , H01K3/10 , H03H7/38
CPC分类号： H05K3/403 , H05K1/115 , H05K3/0032 , H05K3/0044 , H05K3/045 , H05K3/107 , H05K3/1258 , H05K3/4069 , H05K3/429 , H05K2201/09645 , H05K2201/09854 , H05K2203/1476 , Y10T29/49016 , Y10T29/49139 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.
摘要翻译：公开了一种降低通孔电容的技术。在一个特定的示例性实施例中，该技术可以被实现为用于减小通孔电容的方法。该方法可以包括在电路板中形成桥接第一迹线和第二迹线的通孔。该方法还可以包括在通孔的侧壁中形成通道。该方法还可以包括用导电材料填充通孔和通道。该方法可以另外包括从通孔去除导电材料而不耗尽通道，从而形成将第一迹线耦合到第二迹线的互连。

2. 发明授权

US07281326B1 Technique for routing conductive traces between a plurality of electronic components of a multilayer signal routing device 有权
标题翻译：用于在多层信号路由设备的多个电子部件之间布线导电迹线的技术
公开(公告)号：US07281326B1
公开(公告)日：2007-10-16
申请号：US10728881
申请日：2003-12-08
申请人： Herman Kwong , Aneta Wyrzykowska , Kah Ming Soh , Eileen Goulet , Luigi Difilippo , Larry Marcanti
发明人： Herman Kwong , Aneta Wyrzykowska , Kah Ming Soh , Eileen Goulet , Luigi Difilippo , Larry Marcanti
IPC分类号： H01K3/10
CPC分类号： H05K1/181 , H01L2224/16225 , H05K1/0298 , H05K1/112 , H05K2201/09227 , H05K2201/10734 , Y02P70/611 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. The technique may be realized as a method for routing one or more conductive traces between a plurality of electronic components of a multilayer signal routing device. The method comprises forming a first inter-component channel at a first routing layer of the multilayer signal routing device, the first inter-component channel extending between a first set of two or more electronic components of the plurality of electronic components and having a first orientation and forming a second inter-component channel at a second routing layer of the multilayer signal routing device, the second inter-component channel extending between a second set of two or more electronic components of the plurality of electronic components and having a second orientation different from the first orientation.
摘要翻译：公开了用于减少多层信号路由设备中的层数的技术。该技术可以被实现为用于在多层信号路由设备的多个电子部件之间路由一个或多个导电迹线的方法。该方法包括在多层信号路由设备的第一路由层处形成第一分组间信道，第一分组间信道在多个电子部件的第一组两个或多个电子部件之间延伸并具有第一取向以及在所述多层信号路由设备的第二路由层处形成第二组件间通道，所述第二组件间通道在所述多个电子部件的第二组两个或更多个电子部件之间延伸，并且具有不同于第一个方向。

3. 发明授权

US07385470B2 Technique for reducing via capacitance 有权
标题翻译：降低通孔电容的技术
公开(公告)号：US07385470B2
公开(公告)日：2008-06-10
申请号：US11723851
申请日：2007-03-22
申请人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Ming Soh
发明人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Ming Soh
IPC分类号： H03H7/38
CPC分类号： H05K3/403 , H05K1/115 , H05K3/0032 , H05K3/0044 , H05K3/045 , H05K3/107 , H05K3/1258 , H05K3/4069 , H05K3/429 , H05K2201/09645 , H05K2201/09854 , H05K2203/1476 , Y10T29/49016 , Y10T29/49139 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.
摘要翻译：公开了一种降低通孔电容的技术。在一个特定的示例性实施例中，该技术可以被实现为用于减小通孔电容的方法。该方法可以包括在电路板中形成桥接第一迹线和第二迹线的通孔。该方法还可以包括在通孔的侧壁中形成通道。该方法还可以包括用导电材料填充通孔和通道。该方法可以另外包括从通孔去除导电材料而不耗尽通道，从而形成将第一迹线耦合到第二迹线的互连。

4. 发明申请

US20060012452A1 Dielectric-filled transmission lines 失效
标题翻译：介质填充输电线路
公开(公告)号：US20060012452A1
公开(公告)日：2006-01-19
申请号：US10890054
申请日：2004-07-13
申请人： Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
发明人： Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
IPC分类号： H01P3/08 , H01P3/06
CPC分类号： H05K1/0221 , H01P3/06 , H01P5/183 , H05K1/024 , H05K2201/09672 , H05K2201/09809 , H05K2201/09981
摘要： A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.
摘要翻译：印刷电路板传输线具有围绕内部介质芯的外部导电壁。传输线可以设置在接地屏蔽内，以提供一种形式的同轴导体，其减轻了来自相邻传输线的串扰和EMI。此外，介质芯传输线组可以设置在单个接地屏蔽内。例如，边缘耦合差动对可以在由印刷电路板的层（即并排）限定的平面上彼此平行地设置。此外，介质芯传输线的宽侧耦合差分对可以彼此平行地布置在与由印刷电路板的层（即，一个在另一个上面）限定的平面正交的堆叠中。此外，可以包括单端线路和差分对线路中的全部或者多条的多个介质芯线传输线路设置在单个接地屏蔽层内。

5. 发明申请

US20060083186A1 Method and apparatus for improving quality of service over meshed bachaul facilities in a wireless network 失效
标题翻译：用于提高无线网络中网状设备的服务质量的方法和装置
公开(公告)号：US20060083186A1
公开(公告)日：2006-04-20
申请号：US10967575
申请日：2004-10-18
申请人： Martin Handforth , Guy Duxbury , Prasad Kodaypak , Herman Kwong , Larry Marcanti , Bryan Parlor , Kah-Ming Soh
发明人： Martin Handforth , Guy Duxbury , Prasad Kodaypak , Herman Kwong , Larry Marcanti , Bryan Parlor , Kah-Ming Soh
IPC分类号： H04B7/00
CPC分类号： H04W88/085
摘要： Redundant wireless links in a meshed backhaul network may be used to improve quality of service on the backhaul network by confining knowledge of the duality to the attached network elements. Globally, an aggregate bandwidth of the redundant wireless links may be advertised to allow network level routing to treat the redundant links as a single logical link. At the link level, however, the network elements may differentiate between different types of traffic to provide preferential service to particular types of traffic. By using different physical links within the logical link for particular types of traffic, the quality of service for that type of traffic may be improved by not causing different types of traffic to compete for the same bandwidth. The redundant links may be interfaced using a tower network including a radio accessed router optionally powered using solar power, to isolate the tower network from ground equipment
摘要翻译：可以使用网状回程网络中的冗余无线链路来通过将对偶性的知识限于所附网络元件来提高回程网络上的服务质量。在全球范围内，可以通告冗余无线链路的总带宽以允许网络级路由将冗余链路视为单个逻辑链路。然而，在链路级别，网络元件可以区分不同类型的流量，以向特定类型的流量提供优惠服务。通过在特定类型的业务的逻辑链路内使用不同的物理链路，可以通过不引起不同类型的流量来竞争相同的带宽来改善该类型业务的业务质量。可以使用包括使用太阳能供电的无线电接入路由器的塔式网络来连接冗余链路，以将塔架网络与地面设备隔离

6. 发明授权

US06975517B1 Embedded preemphasis and deemphasis circuits 有权
标题翻译：嵌入式预加重和去加重电路
公开(公告)号：US06975517B1
公开(公告)日：2005-12-13
申请号：US10448227
申请日：2003-05-30
申请人： Herman Kwong , Kah Ming Soh , Larry Marcanti
发明人： Herman Kwong , Kah Ming Soh , Larry Marcanti
IPC分类号： H05K1/00 , H05K1/02 , H05K1/16 , H05K1/18
CPC分类号： H05K1/16 , H05K1/0216 , H05K1/0298 , H05K1/162 , H05K1/167 , H05K2201/09672 , H05K2201/1006
摘要： Exemplary techniques for providing an embedded preemphasis circuit and/or a deemphasis circuit in a printed circuit board (PCB) or other circuit device are disclosed. In particular, a technique for preemphasizing and/or deemphasizing transmitted signals in a PCB-based circuit is provided. The technique may be realized as a preemphasis circuit for preemphasizing a signal being transmitted from a signal source to a signal destination. The preemphasis circuit comprises a printed circuit board (PCB), a resistor embedded in the PCB and having a first terminal electrically connected to the signal source and a second terminal electrically connected to the signal destination, and a capacitor embedded in the PCB and having a first terminal electrically connected to the signal source and a second terminal electrically connected to the signal destination.
摘要翻译：公开了用于在印刷电路板（PCB）或其它电路装置中提供嵌入式预加重电路和/或去加重电路的示例性技术。特别地，提供了一种用于在基于PCB的电路中预加重和/或去加重传输信号的技术。该技术可以被实现为用于预加重从信号源发送到信号目的地的信号的预加重电路。预加重电路包括印刷电路板（PCB），嵌入PCB中的电阻器，并且具有电连接到信号源的第一端子和电连接到信号目的地的第二端子以及嵌入在PCB中的电容器电连接到信号源的第一端子和电连接到信号端的第二端子。

7. 发明授权

US08248968B2 Method and apparatus for providing mobile inter-mesh communication points in a multi-level wireless mesh network 有权
标题翻译：一种用于在多级无线网状网络中提供移动网间通信点的方法和装置
公开(公告)号：US08248968B2
公开(公告)日：2012-08-21
申请号：US10678703
申请日：2003-10-03
申请人： Martin Ridgway Handforth , Herman Kwong , Guy Duxbury , Aneta Wyrzykowska , Larry Marcanti , Ryan M. Stark
发明人： Martin Ridgway Handforth , Herman Kwong , Guy Duxbury , Aneta Wyrzykowska , Larry Marcanti , Ryan M. Stark
IPC分类号： H04L12/28
CPC分类号： H04W16/18 , H04L12/44 , H04W84/005 , H04W84/18
摘要： A mobile backhaul inter-mesh communication point forms an interface between a wireless mesh network on a first level and a wireless mesh network on a second, higher bandwidth, level. The two wireless networks are differentiated, e.g., by causing the mesh networks to be formed using different spectra, protocols or coding, or antennae. The mobile intra-mesh communication point functions as an access point in the lower level mesh network and as a relay point in the upper level mesh network. Utilizing mobile inter-mesh communication points facilitates deployment of wireless network access points while enabling the location of access points to follow the concentration of network users. Mobile inter-mesh communication points may be deployed in personal vehicles such as cars, trucks, and motorcycles, public transportation vehicles such as busses, trains, and aircraft, emergency vehicles such as fire trucks and ambulances, and many other types of vehicles.
摘要翻译：移动回程间网间通信点形成第一级无线网状网络和第二，更高带宽级别的无线网状网络之间的接口。两个无线网络是不同的，例如通过使用不同的光谱，协议或编码或天线来形成网状网络。移动网内通信点作为下层网状网络中的接入点，作为上层网状网络中的中继点。利用移动网间通信点有助于无线网络接入点的部署，同时使得接入点的位置能够跟随网络用户的集中。移动互联网通信点可以部署在诸如汽车，卡车和摩托车的个人车辆，诸如公共汽车，火车和飞机的公共交通工具，消防车和救护车等应急车辆以及许多其他类型的车辆。

8. 发明授权

US07432776B2 Dielectric-filled transmission lines 失效
标题翻译：介质填充输电线路
公开(公告)号：US07432776B2
公开(公告)日：2008-10-07
申请号：US10890054
申请日：2004-07-13
申请人： Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
发明人： Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
IPC分类号： H01P3/08
CPC分类号： H05K1/0221 , H01P3/06 , H01P5/183 , H05K1/024 , H05K2201/09672 , H05K2201/09809 , H05K2201/09981
摘要： A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.
摘要翻译：印刷电路板传输线具有围绕内部介质芯的外部导电壁。传输线可以设置在接地屏蔽内，以提供一种形式的同轴导体，其减轻了来自相邻传输线的串扰和EMI。此外，介质芯传输线组可以设置在单个接地屏蔽内。例如，边缘耦合差动对可以在由印刷电路板的层（即并排）限定的平面上彼此平行地设置。此外，介质芯传输线的宽侧耦合差分对可以彼此平行地布置在与由印刷电路板的层（即，一个在另一个上面）限定的平面正交的堆叠中。此外，可以包括单端线路和差分对线路中的全部或者多条的多个介质芯线传输线路设置在单个接地屏蔽层内。

9. 发明申请

US20060130321A1 Technique for reducing via capacitance 有权
标题翻译：降低通孔电容的技术
公开(公告)号：US20060130321A1
公开(公告)日：2006-06-22
申请号：US11012127
申请日：2004-12-16
申请人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Soh
发明人： Herman Kwong , Larry Marcanti , Aneta Wyrzykowska , Kah Soh
IPC分类号： H01K3/10 , H05K3/02 , H05K1/11
CPC分类号： H05K3/403 , H05K1/115 , H05K3/0032 , H05K3/0044 , H05K3/045 , H05K3/107 , H05K3/1258 , H05K3/4069 , H05K3/429 , H05K2201/09645 , H05K2201/09854 , H05K2203/1476 , Y10T29/49016 , Y10T29/49139 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A technique for reducing via capacitance is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing via capacitance. The method may comprise forming, in a circuit board, a via hole that bridges a first trace and a second trace. The method may also comprise forming a channel in a sidewall of the via hole. The method may further comprise filling the via hole and the channel with a conductive material. The method may additionally comprise removing the conductive material from the via hole without depleting the channel, thereby forming an interconnect that couples the first trace to the second trace.
摘要翻译：公开了一种降低通孔电容的技术。在一个特定的示例性实施例中，该技术可以被实现为用于减小通孔电容的方法。该方法可以包括在电路板中形成桥接第一迹线和第二迹线的通孔。该方法还可以包括在通孔的侧壁中形成通道。该方法还可以包括用导电材料填充通孔和通道。该方法可以另外包括从通孔去除导电材料而不耗尽通道，从而形成将第一迹线耦合到第二迹线的互连。

10. 发明授权

US07725860B1 Contact mapping using channel routing 有权
标题翻译：使用通道路由联系映射
公开(公告)号：US07725860B1
公开(公告)日：2010-05-25
申请号：US10728894
申请日：2003-12-08
申请人： Herman Kwong , Kah Ming Soh , Martin Handforth , Larry Marcanti
发明人： Herman Kwong , Kah Ming Soh , Martin Handforth , Larry Marcanti
IPC分类号： G06F17/50 , H05K3/02
CPC分类号： H05K3/0005 , H05K1/0286 , H05K1/0298 , H05K2201/10212 , H05K2201/10689 , Y10T29/49155 , Y10T29/49156
摘要： A technique for improved mapping of the contacts of a PLD to the contacts of one or more other electronic components are provided. In one particular exemplary embodiment, the technique may be realized as a method for mapping contacts of a programmable logic device (PLD) to an electronic component in a signal routing device having one or more layers. The method comprises assigning a set of one or more contacts of the PLD to one or more respective contacts of the electronic component based at least in part on a pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device.
摘要翻译：提供了一种用于改进PLD的触点与一个或多个其它电子部件的触点的映射的技术。在一个特定示例性实施例中，该技术可以被实现为用于将可编程逻辑器件（PLD）的触点映射到具有一个或多个层的信号路由设备中的电子部件的方法。该方法包括至少部分地基于经由形成的一个或多个通道从电子部件的相应触点路由的导电迹线的图案，将一组PLD的一个或多个触点分配给电子部件的一个或多个相应的触点在信号路由设备的一层或多层。

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