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1. 发明授权

US4772346A Method of bonding inorganic particulate material 失效
标题翻译：粘合无机颗粒材料的方法
公开(公告)号：US4772346A
公开(公告)日：1988-09-20
申请号：US115568
申请日：1987-10-29
申请人： Herbert R. Anderson, Jr. , Constance J. Araps , Renuka S. Divakaruni , Daniel P. Kirby , Robert W. Nufer , Harbans S. Sachdev , Krishna G. Sachdev , Darbha Suryanarayana , Stoyan M. Zalar
发明人： Herbert R. Anderson, Jr. , Constance J. Araps , Renuka S. Divakaruni , Daniel P. Kirby , Robert W. Nufer , Harbans S. Sachdev , Krishna G. Sachdev , Darbha Suryanarayana , Stoyan M. Zalar
IPC分类号： C03C10/00 , C04B35/628 , C04B35/63 , C04B35/632 , C04B35/634 , H01L21/48 , H05K1/03 , C04B35/00
CPC分类号： C04B35/6268 , C03C10/00 , C04B35/195 , C04B35/628 , C04B35/62807 , C04B35/6316 , C04B35/6325 , C04B35/634 , C04B35/6342 , C04B35/638 , H01L21/4807 , H05K1/0306 , C04B2235/3232 , C04B2235/3481 , C04B2235/449 , C04B2235/5436 , C04B2235/6025 , C04B2235/6562 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2235/9661
摘要： In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.
摘要翻译：在由浆料形成元件的方法中，该浆料包括颗粒陶瓷和/或玻璃，有机粘合剂树脂和用于树脂的溶剂，其中元件由浆料成形，并且元件被加热以除去浆料并随后熔化陶瓷和/或玻璃颗粒，其改进包括在用选自有机硅烷，有机硅氮烷，钛螯合物，钛的钛的表面改性化合物形成浆料之前涂覆陶瓷和/或玻璃颗粒酯及其混合物。

2. 发明授权

US5139851A Low dielectric composite substrate 失效
公开(公告)号：US5139851A
公开(公告)日：1992-08-18
申请号：US503493
申请日：1990-03-30
申请人： John Acocella , Arnold I. Baise , Richard A. Bates , Jon A. Casey , David R. Clarke , Renuka S. Divakaruni , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Amy T. Matts , Robert W. Nufer , Srinivasa S. N. Reddy , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Arnold I. Baise , Richard A. Bates , Jon A. Casey , David R. Clarke , Renuka S. Divakaruni , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Amy T. Matts , Robert W. Nufer , Srinivasa S. N. Reddy , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： C04B41/48 , C04B41/49 , H01L21/48 , H01L23/538 , H05K1/03 , H05K3/40
CPC分类号： C04B41/4961 , C04B41/488 , H01L21/4857 , H01L23/5383 , H05K3/4061 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

3. 发明授权

US5135595A Process for fabricating a low dielectric composite substrate 失效
标题翻译：制造低介电复合基板的工艺
公开(公告)号：US5135595A
公开(公告)日：1992-08-04
申请号：US503495
申请日：1990-03-30
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

4. 发明授权

US5277725A Process for fabricating a low dielectric composite substrate 失效
标题翻译：低介电复合衬底的制造方法
公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译：在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

5. 发明授权

US5130067A Method and means for co-sintering ceramic/metal MLC substrates 失效
标题翻译：用于共烧陶瓷/金属MLC衬底的方法和手段
公开(公告)号：US5130067A
公开(公告)日：1992-07-14
申请号：US859093
申请日：1986-05-02
申请人： Philip L. Flaitz , Arlyne M. Flanagan , Joseph M. Harvilchuck , Lester W. Herron , John U. Knickerbocker , Robert W. Nufer , Charles H. Perry , Srinivasa N. Reddy , Steven P. Young
发明人： Philip L. Flaitz , Arlyne M. Flanagan , Joseph M. Harvilchuck , Lester W. Herron , John U. Knickerbocker , Robert W. Nufer , Charles H. Perry , Srinivasa N. Reddy , Steven P. Young
IPC分类号： C04B35/638 , C04B35/64 , H01L21/48
CPC分类号： C04B35/64 , C04B35/638 , H01L21/4807
摘要： A method for co-sintering ceramic/metal multi-layered ceramic substrates wherein X-Y shrinkage is controlled and X-Y distortion and Z-direction chamber are substantially eliminated. Binder-burnoff is substantially not aggravated during this process as well. The process is accomplished by applying selective forces to the surfaces of the ceramic substrates to control lateral movement while allowing Z direction shrinkage movement. Frictional force means, pneumatic forced means and weights are among the means used to supply forces. Cerium oxide is used in certain embodiments to enhance binder-burnoff.
摘要翻译：一种陶瓷/金属多层陶瓷基板的共烧结方法，其中X-Y收缩被控制，并且基本上消除了X-Y变形和Z方向室。在此过程中，粘结剂 - 烧毁也基本上不会加剧。该过程通过向陶瓷基底的表面施加选择力来实现，以控制横向运动，同时允许Z方向收缩运动。摩擦力意味着，气动强制手段和重量是用于供应力的手段之一。在某些实施方案中使用氧化铈以增强粘合剂 - 燃烧。

6. 发明授权

US4080414A Ceramic dielectrics 失效
公开(公告)号：US4080414A
公开(公告)日：1978-03-21
申请号：US589305
申请日：1975-06-23
申请人： Leslie C. Anderson , Robert W. Nufer , Frank G. Pugliese
发明人： Leslie C. Anderson , Robert W. Nufer , Frank G. Pugliese
IPC分类号： C04B33/13 , C08J3/09 , B29D27/04
CPC分类号： C04B33/1315 , C04B33/13 , C08J3/09
摘要： Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate in a solution of a binder resin miscible in a solvent mixture which is formed from a volatile solvent for the binder resin and a less volatile solvent in which the resin is at most only slightly soluble.

7. 发明授权

US4753694A Process for forming multilayered ceramic substrate having solid metal conductors 失效
标题翻译：用于形成具有固体金属导体的多层陶瓷基板的工艺
公开(公告)号：US4753694A
公开(公告)日：1988-06-28
申请号：US859092
申请日：1986-05-02
申请人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
发明人： Lester W. Herron , Robert O. Lussow , Robert W. Nufer , Bernard Schwartz , John Acocella , Srinivasa N. Reddy
IPC分类号： H05K3/46 , H01L21/48 , H01L23/538 , H05K1/03 , H05K3/20 , C03B29/00
CPC分类号： H01L23/5383 , H01L21/4857 , H05K3/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K2201/0317 , H05K2203/0156 , H05K3/4611 , H05K3/4629
摘要： A multilayered ceramic (MLC) substrate having embedded and exposed conductors suitable for mounting and interconnecting a plurality of electronic devices exterior thereof. The horizontal planar conductors comprise substantially a plurality of solid, non-porous, homogeneous metal patterns, whereas the vertical interplanar connection conductors are substantially porous metal conductors that are formed by methods such as screening. The process to form the MLC substrate involves forming a pattern of solid, nonporous conductors to a backing sheet having a release layer, then transferring the pattern to a ceramic green sheet. Zero X-Y shrinkage sintering processes allow the MLC substrate and solid metal conductors to be densified without distortion of the solid metal patterns or the ceramic.
摘要翻译：一种多层陶瓷（MLC）衬底，其具有适于安装和互连其外部的多个电子器件的嵌入和暴露的导体。水平平面导体基本上包括多个固体，非多孔均质的金属图案，而垂直平面连接导体是通过诸如筛选的方法形成的基本上多孔的金属导体。形成MLC衬底的方法包括将固体，无孔导体的图案形成为具有剥离层的背衬片，然后将图案转移到陶瓷生片。零X-Y收缩烧结工艺允许MLC衬底和固体金属导体致密化而不会使固体金属图案或陶瓷变形。

8. 发明授权

US4598107A Stepwise/ultimate density milling 失效
标题翻译：逐步/极限密度铣削
公开(公告)号：US4598107A
公开(公告)日：1986-07-01
申请号：US763157
申请日：1985-08-07
申请人： Lester W. Herron , Robert W. Nufer
发明人： Lester W. Herron , Robert W. Nufer
IPC分类号： C04B35/111 , C04B35/634 , H01L21/48 , C08K5/09 , C04B33/34 , C08L1/08
CPC分类号： H01L21/48 , C04B35/111 , C04B35/634
摘要： Disclosed is a method of forming a slurry for casting into ceramic green sheets. Starting from selected quantities of a solvent, plasticizer, polymeric binder material, frit and aluminum oxide, a low viscosity pre-mix is formed by combining predetermined portions of the solvent and binder material and all of the plasticizer. The remaining portions of the solvent and binder material are combined into a post-mix. Next, the pre-mix and frit are milled in a ball mill. Then the aluminum oxide is added to the ball mill in steps using predetermined portions and milled for predetermined periods of time to achieve the desired degree of aluminum oxide deagglomeration and particle packing density. Finally, the post-mix is added to the ball mill and milled to obtain the final slurry.
摘要翻译：公开了一种形成用于铸造成陶瓷生片的浆料的方法。从选定量的溶剂，增塑剂，聚合物粘合剂材料，玻璃料和氧化铝开始，通过将预定部分的溶剂和粘合剂材料以及所有的增塑剂组合形成低粘度预混物。溶剂和粘合剂材料的剩余部分组合成后混合物。接下来，将预混合物和玻璃料在球磨机中研磨。然后，使用预定的部分，将步骤中的氧化铝加入到球磨机中并研磨预定的时间以达到所需程度的氧化铝解聚和颗粒堆积密度。最后，将后混合物添加到球磨机中并研磨以获得最终的浆料。

9. 发明授权

US5290504A Continuous air bearing vapor stabilization system and method 失效
标题翻译：连续空气轴承汽化稳定系统及方法
公开(公告)号：US5290504A
公开(公告)日：1994-03-01
申请号：US968914
申请日：1992-10-30
申请人： Stephen A. Milkovich , Robert W. Nufer
发明人： Stephen A. Milkovich , Robert W. Nufer
IPC分类号： B28B11/00 , C04B35/622 , F26B13/20 , H05K3/46 , C04B33/30 , B29B17/00
CPC分类号： F26B13/104 , C04B35/622
摘要： An in situ stabilizing tool provides a stress relieved, ceramic green sheet for green sheet screened stability. A green sheet stablilization system uses air bearings as a means of conveying a continuous ceramic green sheet web in a frictionless and stress free state. Solvent vapor stabilization of green sheets in a continuous mode adjusts solvent concentration in the air bearing using a solvent bubbler. Solvent vapor is generated from a group of solvents (e.g. hydrocarbons, water, etc.) that can be vaporized and used to solvent plasticize the ceramic green sheets to achieve stress relaxation. Take up loops and sensors adjust for longitudinal shrinkage during the green sheet relaxation process.
摘要翻译：原位稳定工具提供了一种应力消除的陶瓷生坯片，用于生坯筛选稳定性。绿色片材稳定系统使用空气轴承作为在无摩擦和无应力状态下输送连续陶瓷生坯片材的手段。在连续模式下生片的溶剂蒸气稳定性使用溶剂起泡器调节空气轴承中的溶剂浓度。溶剂蒸气由一组溶剂（例如烃，水等）产生，其可以蒸发并用于溶剂塑化陶瓷生片以实现应力松弛。在生片松弛过程中，采取循环和传感器调整纵向收缩。

10. 发明授权

US5139852A Low dielectric composite substrate 失效
标题翻译：低介电复合基板
公开(公告)号：US5139852A
公开(公告)日：1992-08-18
申请号：US503492
申请日：1990-03-30
申请人： Arnold I. Baise , Ray M. Bryant , Jon A. Casey , Allen J. Dam , Werner E. Dunkel , James N. Humenik , Anthony Mastreani , Robert W. Nufer , Charles H. Perry , Salvatore J. Scilla
发明人： Arnold I. Baise , Ray M. Bryant , Jon A. Casey , Allen J. Dam , Werner E. Dunkel , James N. Humenik , Anthony Mastreani , Robert W. Nufer , Charles H. Perry , Salvatore J. Scilla
IPC分类号： C04B41/48 , C04B41/49 , H01L21/48 , H01L23/538 , H05K1/03 , H05K3/40
CPC分类号： H01L23/5383 , C04B41/488 , C04B41/4961 , H01L21/4857 , H05K3/4061 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译：在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

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