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    • 1. 发明申请
    • Integrated semiconductor memory and method for operating a semiconductor memory
    • 用于操作半导体存储器的集成半导体存储器和方法
    • US20060193168A1
    • 2006-08-31
    • US11331365
    • 2006-01-13
    • Stephan SchroderHerbert BenzingerGeorg EggersManfred ProllJorg Kliewer
    • Stephan SchroderHerbert BenzingerGeorg EggersManfred ProllJorg Kliewer
    • G11C11/34G11C16/04
    • G11C11/404H01L27/10885
    • An integrated semiconductor memory device includes memory cells each with a selection transistor and a storage capacitor. Memory cells of this type are usually read by the potential of the bit line to which the memory cell is connected being compared in a sense amplifier with the potential of a complementary, second bit line and a voltage difference identified being amplified. The semiconductor memory according to the invention provides for that capacitor electrode which is not connected to the selection transistor to be connected to the complementary, second bit line. As a result, for an operating voltage with the same magnitude, larger quantities of charge can be stored in the storage capacitor since now the two mutually spread potentials output by the sense amplifier are used for biasing the storage capacitor. The resultant increase in the signal strength makes the semiconductor memory insensitive toward signal corruptions which arise for example in the case of operating voltages at different levels for selection transistors and for transistors in the signal amplifier.
    • 集成半导体存储器件包括各自具有选择晶体管和存储电容器的存储单元。 这种类型的存储单元通常通过读出放大器中与存储器单元连接的位线的电位进行读取,其中互补的第二位线的电位和识别的电压差被放大。 根据本发明的半导体存储器提供了未连接到选择晶体管以连接到互补的第二位线的电容器电极。 结果,对于具有相同幅度的工作电压,由于现在由读出放大器输出的两个相互扩展的电位用于偏置存储电容器,所以可以将大量的电荷存储在存储电容器中。 信号强度的增加使得半导体存储器对信号损坏不敏感,例如在用于选择晶体管的不同电平的操作电压和信号放大器中的晶体管的情况下。
    • 2. 发明申请
    • Integrated semiconductor memory device and method for operating an integrated semiconductor memory device
    • 用于操作集成半导体存储器件的集成半导体存储器件和方法
    • US20050195638A1
    • 2005-09-08
    • US11071590
    • 2005-03-04
    • Herbert BenzingerJorg KliewerManfred ProllStephan Schroder
    • Herbert BenzingerJorg KliewerManfred ProllStephan Schroder
    • G11C7/12G11C11/00G11C11/4094
    • G11C11/4094G11C7/02G11C7/12
    • An integrated semiconductor memory device includes a memory cell array (B1) with a first bit line and a second bit line (BL, /BL), a controllable resistor (SW) and a control unit (100) configured to control the controllable resistor. In a first operating state of the integrated semiconductor memory device, the first and second bit lines are connected to one another via a first controllable switch (ET1) and also via the controllable resistor (SW) which has been set to a low resistance, to a connection (A10) that applies a mid-voltage (VBLEQ), where the voltage level of the mid-voltage is in the form of an arithmetic mean between a first and second voltage potential (VBLH, VBLL). By virtue of the control unit briefly setting the controllable resistor to a very low resistance in the first operating state of the integrated semiconductor memory device, the period of time required for the first and second bit lines require to assume the mid-voltage (VBLEQ) is shortened. The influence of capacitive coupling influences, which slow down the charging of the first and second bit lines to the mid-voltage, is significantly reduced as a result.
    • 集成半导体存储器件包括具有第一位线和第二位线(BL,/ BL)的存储单元阵列(B 1),可控电阻器(SW)和控制单元(100),其被配置为控制可控电阻器 。 在集成半导体存储器件的第一操作状态下,第一和第二位线经由第一可控开关(ET 1)彼此连接,并且还经由设置为低电阻的可控电阻(SW)连接, 涉及施加中间电压(V BAT)的连接(A 10),其中中压的电压电平为第一和第二电压电位之间的算术平均值 VBLH,VBLL)。 由于控制单元在集成半导体存储器件的第一操作状态下将可控电阻短暂地设置为非常低的电阻,所以第一和第二位线所需的时间段需要采用中间电压(V < SUB> BLEQ )被缩短。 因此,将第一和第二位线的充电速度降低到中间电压的电容耦合影响的影响显着减小。
    • 3. 发明申请
    • Integrated circuit for stabilizing a voltage
    • 用于稳定电压的集成电路
    • US20050248996A1
    • 2005-11-10
    • US11123226
    • 2005-05-06
    • Ralf SchneiderStephan SchroderManfred ProllJorg Kliewer
    • Ralf SchneiderStephan SchroderManfred ProllJorg Kliewer
    • G05F1/595G11C5/14G11C7/00G11C11/4074
    • G11C11/4074G11C5/145
    • An integrated circuit includes an input terminal (IN) for application of a supply voltage (Vext) and an output terminal (A) for generation of an output voltage (Vout). A first branch including a first controllable resistance (T1) and a second branch including a charge pump (10) and a second controllable resistance (T2) are connected between the input terminal (IN) and the output terminal (A). A control circuit (20) alters the resistance values of the first and second controllable resistances (T1, T2) in a manner dependent on a ratio of an actual value (Vout) of the output voltage to a desired value (VSout) of the output voltage and a ratio of an actual value (Vext) of the supply voltage to a desired value (VSext) of the supply voltage. As a result, the output voltage (Vout) can be stabilized to the desired value (VSout) virtually independently of fluctuations of the supply voltage.
    • 集成电路包括用于施加电源电压(Vext)的输入端(IN)和用于产生输出电压(Vout)的输出端子(A)。 包括第一可控电阻(T 1)和包括电荷泵(10)和第二可控电阻(T 2)的第二分支的第一分支连接在输入端(IN)和输出端(A)之间。 控制电路(20)以取决于输出电压的实际值(Vout)与期望值(VSout)的比值的方式改变第一和第二可控电阻(T 1,T 2)的电阻值 输出电压和电源电压的实际值(Vext)与电源电压的期望值(VSext)的比率。 结果,输出电压(Vout)可以实际上独立于电源电压的波动而稳定到期望值(VSout)。
    • 4. 发明申请
    • Integrated semiconductor memory with test circuit
    • 具有测试电路的集成半导体存储器
    • US20060120176A1
    • 2006-06-08
    • US11235540
    • 2005-09-27
    • Ralf SchneiderStephan SchroderManfred ProllHerbert Benzinger
    • Ralf SchneiderStephan SchroderManfred ProllHerbert Benzinger
    • G11C7/06
    • G11C29/025G11C8/08G11C11/401G11C29/02G11C2029/1202
    • An integrated semiconductor memory includes word lines connected to a first voltage potential via a respective first controllable switch and a respective third controllable switch and to a second voltage potential via a respective second controllable switch. In order to test whether one of the word lines is connected to the first voltage potential via its respective first and third controllable switches, the one of the word lines is connected to a comparator circuit via the respective second controllable switch and a driver line. After the respective first and third controllable switches have been controlled into the on state, in a test operating state of the integrated semiconductor memory, the respective second controllable switch is controlled into the on state and a potential state on the word line is evaluated by the comparator circuit. The result of the evaluation is fed to an external data terminal by an evaluation signal.
    • 集成半导体存储器包括通过相应的第一可控开关和相应的第三可控开关连接到第一电压电位的字线,以及经由相应的第二可控开关连接到第二电压电位的字线。 为了测试字线之一是否经由其相应的第一和第三可控开关连接到第一电压电位,所述字线之一经由相应的第二可控开关和驱动器线连接到比较器电路。 在相应的第一和第三可控开关已经被控制为导通状态之后,在集成半导体存储器的测试操作状态下,将相应的第二可控开关控制在导通状态,并且字线上的电位状态由 比较器电路。 评估结果通过评估信号馈送到外部数据终端。
    • 6. 发明申请
    • Integrated semiconductor memory
    • 集成半导体存储器
    • US20050249002A1
    • 2005-11-10
    • US11123221
    • 2005-05-06
    • Jurgen AugeManfred ProllJorg KliewerFrank Schroeppel
    • Jurgen AugeManfred ProllJorg KliewerFrank Schroeppel
    • G11C7/00G11C29/00G11C29/48
    • G11C29/48
    • An integrated semiconductor memory includes a memory cell array with at least one memory cell, in which a data value is stored, and an evaluation circuit with a counter. During a test of the integrated semiconductor memory, a counter reading of the counter is altered if the data value stored in the memory cell deviates from a desired value. A threshold value is predefined by a control circuit. A programming circuit compares the threshold value on the input side with the instantaneous counter reading of the counter. If the counter reading of the counter exceeds the threshold value, a programming element changes from a first programming state to a second programming state. After the conclusion of the test, the state of the programming element is read out via an output terminal. This scheme makes it possible to deduce a possible cause of failure of the integrated semiconductor memory.
    • 集成半导体存储器包括具有存储有数据值的至少一个存储单元的存储单元阵列和具有计数器的评估电路。 在集成半导体存储器的测试期间,如果存储在存储单元中的数据值偏离期望值,则计数器的计数器读数被改变。 阈值由控制电路预先定义。 编程电路将输入侧的阈值与计数器的瞬时计数器读数进行比较。 如果计数器的计数器读数超过阈值,则编程元件从第一编程状态变为第二编程状态。 在测试结束之后,通过输出端读出编程元件的状态。 该方案可以推断集成半导体存储器的可能的故障原因。