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    • 2. 发明授权
    • Method for off-orientation point rotation sawing of crystalline rod
material
    • 结晶棒材料偏转点旋转锯切方法
    • US4228578A
    • 1980-10-21
    • US3563
    • 1979-01-15
    • Lawrence Y. LinHenry W. GutscheJames A. Collier
    • Lawrence Y. LinHenry W. GutscheJames A. Collier
    • B23Q3/08B28D5/02B23P17/00B25B1/00H01L7/66
    • B28D5/028B23Q3/08Y10T29/4981Y10T29/49812Y10T29/49982Y10T83/0405
    • A method is provided for point rotation sawing of crystalline rod material at off-orientation angles wherein the crystalline rod is encapsulated in a molding media forming a cylindrical geometric encapsulation containing the rod with its crystallographic axis at an angle to the cylindrical axis of encapsulation, the angle coinciding with the off-orientation requirement. The encapsulation cylinder is rotated about its axis and contacted by sawing means at one or more points tangent to the cylinder surface and perpendicular to the cylinder's axis of rotation resulting in the sawing of a thin wafer from a cylinder which is inclusive of an off-orientation crystalline material wafer. Inside and outside diameter saws having sidewall lapping coatings provide an off-orientation point sawing method with simultaneous sawing and lapping of the resulting thin wafers as the point contact diameter becomes smaller; however, the off-orientation point sawing method utilizing the rotating cylinder is adaptable to a variety of sawing means.
    • 提供了一种用于以偏离取向角度对结晶棒材料进行点旋转锯切的方法,其中结晶棒被包封在模制介质中,模制介质形成圆柱形几何封装,该圆柱形几何封装包含具有与圆柱形轴向轴线成一定角度的晶棒, 角度与偏离方向要求一致。 封装圆筒围绕其轴线旋转并与锯切装置在与圆筒表面相切的一个或多个点处垂直于圆柱体的旋转轴线接触,导致从圆柱体切割薄晶片,其包括偏离方向 晶体材料晶圆。 具有侧壁研磨涂层的内外径锯提供了一种离轴定位锯切方法,随着点接触直径变小,同时对所得薄晶片进行锯切和研磨; 然而,利用旋转圆筒的偏离点切割方法适用于各种锯切装置。
    • 5. 发明授权
    • Gas curtain continuous chemical vapor deposition production of
semiconductor bodies
    • 气帘连续化学气相沉积生产半导体体
    • US4309241A
    • 1982-01-05
    • US172503
    • 1980-07-28
    • Paul M. GaravagliaHenry W. Gutsche
    • Paul M. GaravagliaHenry W. Gutsche
    • C01B33/02C01B33/035C30B25/00C30B25/02C30B25/10C30B25/14C30B25/18C30B29/06H01L21/205C30B25/08
    • C01B33/035C30B25/025C30B25/10C30B25/14C30B25/18Y10T117/10Y10T117/1032
    • Apparatus and process for producing electronic-grade semiconductor bodies are disclosed wherein continuously-pulled slim rod which can be formed in situ from the reaction of a seed crystal and a molten semiconductor material source, is pulled into and through a chemical vapor deposition chamber, having a gas curtain along the inner wall, the slim rod surface being preheated before entry into the deposition chamber where it is simultaneously exposed to focused heating and thermally decomposable gaseous compounds in order to provide suitable surface reaction conditions on the slim rod for the decomposition of the gaseous compounds which results in deposition growth upon the surface of the rod. Single crystal semiconductor bodies are produced according to the process by avoiding poly-growth conditions through the in situ continuously pulled virgin slim rod, preheating of the slim rod for entry into the chemical vapor deposition chamber wherein the rod is simultaneously heated or maintained at reaction temperature conditions while being exposed or contacted with elected thermally decomposable gaseous compounds and continuously drawn through the chemical vapor deposition chamber reaction zone resulting in an enlarged single crystal semiconductor body which is withdrawn continuously from the chemical vapor deposition chamber.
    • 公开了用于生产电子级半导体器件的装置和方法,其中可以从晶种和熔融半导体材料源的反应形成的连续拉伸的细棒被拉入并通过化学气相沉积室,其具有 沿着内壁的气帘,细长的杆表面在进入沉积室之前被预热,同时暴露于聚焦加热和可热分解的气态化合物,以便在细长杆上提供合适的表面反应条件以分解 导致在棒表面沉积生长的气态化合物。 根据该方法,通过避免多生长条件通过原位连续拉伸的原始细长棒来制造单晶半导体体,预热细条以进入化学气相沉积室,其中杆同时加热或保持在反应温度 同时暴露或接触所选择的可热分解气态化合物,并连续通过化学气相沉积室反应区,从而形成从化学气相沉积室连续取出的扩大的单晶半导体体。