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1. 发明授权

US08851356B1 Flexible circuit board interconnection and methods 有权
标题翻译：灵活的电路板互连和方法
公开(公告)号：US08851356B1
公开(公告)日：2014-10-07
申请号：US13158149
申请日：2011-06-10
申请人： Henry V. Holec , Wm. Todd Crandell , Eric Henry Holec
发明人： Henry V. Holec , Wm. Todd Crandell , Eric Henry Holec
IPC分类号： B23K31/02
CPC分类号： H05K3/363 , B23K1/0016 , B23K37/04 , F21Y2107/30 , F21Y2115/10 , H01R4/02 , H01R12/61 , H05K1/0269 , H05K1/118 , H05K1/144 , H05K1/147 , H05K1/189 , H05K2201/0311 , H05K2201/058 , H05K2201/09481 , H05K2201/09918 , H05K2201/10106 , H05K2203/0195 , H05K2203/0228 , H05K2203/043 , H05K2203/16
摘要： Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.
摘要翻译：本发明的实施例包括柔性电路板互连和相关的方法。在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。本文还包括其它实施例。

2. 发明授权

US08500456B1 Interconnectable circuit boards 有权
标题翻译：互连电路板
公开(公告)号：US08500456B1
公开(公告)日：2013-08-06
申请号：US13190639
申请日：2011-07-26
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H01R12/00
CPC分类号： H05K1/0293 , F21Y2107/30 , F21Y2115/10 , H01R4/02 , H01R9/096 , H01R12/523 , H01R13/717 , H05K1/0266 , H05K1/0269 , H05K1/0292 , H05K1/0298 , H05K1/11 , H05K1/113 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/147 , H05K3/0061 , H05K3/363 , H05K2201/041 , H05K2201/09481 , H05K2201/09918 , H05K2201/10106 , H05K2201/2027 , H05K2203/0228
摘要： In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
摘要翻译：在一些实施例中，可互连电路板可以包括以下特征中的一个或多个：（a）位于电路板顶部的第一导电焊盘，（b）导电焊盘上的电镀通孔，电路板，（c）耦合到电镀通孔的第二导电焊盘; 第二导电焊盘能够电连接到附接到第二可互连电路板的顶部的第三导电焊盘，（d）切割标记，指示用于分离电路板的安全位置，以及（e）与第二导电焊盘相邻的第二切割标记可以利用第一和第二切割标记之间的区域来进行通过电路板的安全切割的第一切割标记。

3. 发明授权

US08410720B2 Solid state lighting circuit and controls 有权
标题翻译：固态照明电路和控制
公开(公告)号：US08410720B2
公开(公告)日：2013-04-02
申请号：US12419879
申请日：2009-04-07
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H05B37/02
CPC分类号： H05B33/083 , F21K9/20 , F21V23/005 , F21Y2107/30 , F21Y2115/10 , H05B33/0815 , H05B33/0896 , H05K1/0263 , H05K2201/09309 , H05K2201/10106 , H05K2201/10166
摘要： In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
摘要翻译：在一些实施例中，固态照明电路可以包括以下特征中的一个或多个：（a）可操作地连接到电源的多个发射器（b）与限流装置可操作地耦合的电源，其中一个或更多的发射器被切换电路旁路，以及（c）至少一个MOSFET开关，其可操作地耦合到分压器电路。

4. 发明授权

US10334735B2 LED lighting systems and methods 有权
公开(公告)号：US10334735B2
公开(公告)日：2019-06-25
申请号：US13592090
申请日：2012-08-22
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H05K1/18
摘要： Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

5. 发明授权

US08007286B1 Circuit boards interconnected by overlapping plated through holes portions 有权
标题翻译：电路板通过重叠的电镀通孔部分互连
公开(公告)号：US08007286B1
公开(公告)日：2011-08-30
申请号：US12406761
申请日：2009-03-18
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H01R12/00
CPC分类号： H05K1/0293 , F21Y2107/30 , F21Y2115/10 , H01R4/02 , H01R9/096 , H01R12/523 , H01R13/717 , H05K1/0266 , H05K1/0269 , H05K1/0292 , H05K1/0298 , H05K1/11 , H05K1/113 , H05K1/118 , H05K1/14 , H05K1/144 , H05K1/147 , H05K3/0061 , H05K3/363 , H05K2201/041 , H05K2201/09481 , H05K2201/09918 , H05K2201/10106 , H05K2201/2027 , H05K2203/0228
摘要： In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.
摘要翻译：在一些实施例中，可互连电路板可以包括以下特征中的一个或多个：（a）位于电路板顶部的第一导电焊盘，（b）导电焊盘上的电镀通孔，电路板，（c）耦合到电镀通孔的第二导电焊盘; 第二导电焊盘能够电连接到附接到第二可互连电路板的顶部的第三导电焊盘，（d）切割标记，指示用于分离电路板的安全位置，以及（e）与第二导电焊盘相邻的第二切割标记可以利用第一和第二切割标记之间的区域来进行通过电路板的安全切割的第一切割标记。

6. 发明申请

US20130128582A1 LED LIGHTING SYSTEMS AND METHODS 审中-公开
标题翻译： LED照明系统和方法
公开(公告)号：US20130128582A1
公开(公告)日：2013-05-23
申请号：US13592090
申请日：2012-08-22
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： F21S4/00 , H05K13/00
CPC分类号： H05K1/189 , H05K2201/09063 , H05K2201/10106 , Y10T29/49124
摘要： Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.
摘要翻译：本发明的实施例包括LED照明系统和方法。例如，在一些实施例中，包括LED照明系统。 LED照明系统可以包括柔性分层电路结构，其可以包括顶部导热层，中间电绝缘层，底部导热层和安装在顶层上的多个发光二极管。 LED照明系统还可以包括外壳基板和安装结构。所述安装结构可以被配置为将所述分层电路结构悬挂在所述壳体基板之上，其中设置在所述柔性分层电路结构的底部导热层和所述壳体基板之间的气隙。分层电路结构和支撑层之间的距离可以为至少约0.5mm。本文还包括其它实施例。

7. 发明授权

US07980863B1 Printed circuit board flexible interconnect design 有权
标题翻译：印刷电路板柔性互连设计
公开(公告)号：US07980863B1
公开(公告)日：2011-07-19
申请号：US12372499
申请日：2009-02-17
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H01R12/00
CPC分类号： H05K3/363 , H05K1/0209 , H05K1/118 , H05K3/0052 , H05K3/0061 , H05K2201/09481 , H05K2201/09572 , H05K2201/10106
摘要： In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.
摘要翻译：在一些实施例中，电路板互连可以包括以下特征中的一个或多个：（a）在电路板上的金属焊盘内具有电镀通孔的第一电路板，所述通孔提供用于焊料连接第一电路板到第二电路板，（b）第二电路板，具有当焊料通过电镀通孔时能够以重叠的方式耦合到第一电路板的金属焊盘，以及（c）不导电在一个电路板的表面上的排斥材料。

8. 发明申请

US20090251068A1 Solid State Lighting Circuit and Controls 有权
标题翻译：固态照明电路和控制
公开(公告)号：US20090251068A1
公开(公告)日：2009-10-08
申请号：US12419879
申请日：2009-04-07
申请人： Henry V. Holec , Wm. Todd Crandell
发明人： Henry V. Holec , Wm. Todd Crandell
IPC分类号： H05B37/02
CPC分类号： H05B33/083 , F21K9/20 , F21V23/005 , F21Y2107/30 , F21Y2115/10 , H05B33/0815 , H05B33/0896 , H05K1/0263 , H05K2201/09309 , H05K2201/10106 , H05K2201/10166
摘要： In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.
摘要翻译：在一些实施例中，固态照明电路可以包括以下特征中的一个或多个：（a）可操作地连接到电源的多个发射器（b）与限流装置可操作地耦合的电源，其中一个或更多的发射器被切换电路旁路，以及（c）至少一个MOSFET开关，其可操作地耦合到分压器电路。

9. 发明授权

US07275335B2 Wireless tram gauge assembly 有权
公开(公告)号：US07275335B2
公开(公告)日：2007-10-02
申请号：US11206503
申请日：2005-08-18
申请人： Henry V. Holec , Greg W. Parkhurst , Timothy M. Gack , Eric R. Seckerson , Mike V. Atkinson
发明人： Henry V. Holec , Greg W. Parkhurst , Timothy M. Gack , Eric R. Seckerson , Mike V. Atkinson
IPC分类号： G01B5/00
CPC分类号： G01B3/08 , G01B5/0025
摘要： The present invention relates to a digital tram gauge assembly having an extendible elongate tram bar having a first height rod at a first end and a second height rod at a second end. A digital measuring device is positionable about the tram bar and is capable of digitally sensing, displaying and wirelessly transmitting measurement data from the digital tram gauge. The digital measuring device further includes a digital level sensor that functions as a digital level comparator to indicate whether the tram gauge assembly is oriented substantially parallel to a user-defined reference datum plane.

10. 发明申请

US20080149192A1 Valve 审中-公开
标题翻译：阀
公开(公告)号：US20080149192A1
公开(公告)日：2008-06-26
申请号：US11795107
申请日：2006-01-12
申请人： Henry V. Holec , Douglas P. Goulet , Daniel W. Celotta , Stephen J. Czeck , Richard Nighy
发明人： Henry V. Holec , Douglas P. Goulet , Daniel W. Celotta , Stephen J. Czeck , Richard Nighy
IPC分类号： F16K31/36
CPC分类号： F16K31/082 , F16K31/0682 , F16K47/02 , Y10T137/7766
摘要： A valve 100 comprising a magnetic circuit comprising a first member 101 and a pivotably mounted armature 102 the armature being movable between a position in which the valve seal 104 engages the valve seat 105 of valve port 103 to block the valve port 103, and a position away from the first member 101. A coil 106 surrounds the armature 102 which, when supplied with an electric current, creates a magnetic field in the armature 102 attracting the free end to the first member 101. Dampening pads 110 are provided on the armature 102. Each dampener pad 110 comprises a layer of viscoelastic material covered by a protective layer of polyetheretherketone (PEEK). During use, as there is wear between the armature 102 and the first member 101, and/or non magnetic section 107, the dampening pad 110 is compressed on impact by an increasing degree, thus the more worn the valve becomes, the more the dampening and thus the greater the protection against further wear.
摘要翻译：一种阀门100，其包括磁路，该磁路包括第一构件101和可枢转地安装的衔铁102，所述衔铁可在阀密封件104与阀口103的阀座105接合以阻塞阀口103的位置之间移动，远离第一成员101。线圈106围绕电枢102，当被提供电流时，电枢102在衔铁102中产生吸引自由端到第一构件101的磁场。减震垫110设置在电枢102上。每个阻尼垫110包括由聚醚醚酮（PEEK）保护层覆盖的一层粘弹性材料。在使用过程中，由于衔铁102与第一部件101和/或非磁性部件107之间存在磨损，所以阻尼垫110在冲击时被压缩，从而使阀变得更加磨损，阻尼越多因此更大的防止进一步磨损。

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